MC33765
l
l
s
Very Low Dropout/Ultra Low
Noise 5 Outputs Voltage
Regulator
The MC33765 is an ultra low noise, very low dropout voltage
regulator with five independent outputs which is available in
TSSOP−16 surface mount package.
The MC33765 is available in 2.8 V. The output voltage is the same
for all five outputs but each output is capable of supplying different
currents up to 150 mA for output 4. The device features a very low
dropout voltage (0.11 V typical for maximum output current), very
low quiescent current (5.0 mA maximum in OFF mode, 130 mA typical
in ON mode) and one of the output (output 3) exhibits a very low noise
level which allows the driving of noise sensitive circuitry. Internal
current and thermal limiting protections are provided.
Additionally, the MC33765 has an independent Enable input pin for
each output. It includes also a common Enable pin to shutdown the
complete circuit when not used. The Common Enable pin has the
highest priority over the five independent Enable input pins.
The voltage regulators VR1, VR2 and VR3 have a common input
voltage pin VCC1. The other voltage regulators VR4 and VR5 have a
common input voltage pin VCC2.
Features
(Note: Microdot may be in either location)
• Five Independent Outputs at 2.8V Typical, Based Upon Voltage Version
• Internal Trimmed Voltage Reference
• V
Tolerance ±3.0% over the Temperature Range −40°C to +85°C
out
• Enable Input Pin (Logic−Controlled Shutdown) for Each of the Five
Outputs
• Common Enable Pin to Shutdown the Whole Circuit
• Very Low Dropout Voltage (0.11 V Typical for Output 1, 2, 3 and 5;
0.17 V Typical for Output 4 at Maximum Current)
• Very Low Quiescent Current (Maximum 5.0 mA in OFF Mode,
Common Enable
On/Off V−Reg. 1
On/Off V−Reg. 2
On/Off V−Reg. 3
On/Off V−Reg. 4
On/Off V−Reg. 5 VCC2
130 mA Typical in ON Mode)
• Ultra Low Noise for VR3 (30 mV RMS Max, 100 Hz < f < 100 kHz)
• Internal Current and Thermal Limit
• 100 nF for VR1, VR2, VR4 and VR5 and 1.0 mF for VR3 for Stability
• Supply Voltage Rejection: 60 dB (Typical) @ f = 1.0 kHz
• These are Pb−Free Devices*
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Voltage
Thermal Resistance Junction−to−Air
Operating Ambient Temperature
Maximum Operating Junct ion Temperature
Maximum Junction Temperature
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
R
T
V
CC
q
T
T
Jmax
T
stg
JA
A
J
5.3
140
−40 to +85
125
150
−60 to +150
V
°C/W
°C
°C
°C
°C
Device Package* Shipping
MC33765DTB TSSOP−16 96 Units/Rail
MC33765DTBG TSSOP−16 96 Units/Rail
MC33765DTBR2 TSSOP−16
MC33765DTBR2G TSSOP−16 2500 Tape & Ree
*This package is inherently Pb−Free.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
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TSSOP−16
DTB SUFFIX
1
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
CASE 948F
PIN CONNECTIONS
116
Bypass
15
14
13
12
11
MC33765
10
9
GND
2
3
4
5
6
7
8
(Top View)
ORDERING INFORMATION
MARKING
DIAGRAM
16
MC33
765
ALYW G
G
1
Not Connected
VCC1
Output V−Reg. 1
Output V−Reg. 2
Output V−Reg. 3
Output V−Reg. 4
Output V−Reg. 5
†
2500 Tape & Ree
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 4
1 Publication Order Number:
MC33765/D
ON/OFF 1
BYPASS
100 nF
(3)
VCC1
Enable
Voltage
Reference
Simplified Block Diagram
(15) (2)CE
Common
1.25 V
MC33765
Enable
−
+
Current
Limit
Temp.
Shut.
V
(10)
2
CC
330 nF
V
1
CC
(14)
V
1
OUT
100 nF
ON/OFF 2
ON/OFF 3
ON/OFF 4
(4)
(5)
(6)
Enable
Enable
Enable
Current
Limit
1
V
CC
−
+
Temp.
Shut.
(13)
V
100 nF
OUT
2
Current
Limit
VCC1
−
+
Temp.
Shut.
(12)
V
1.0 mF
OUT
3
Current
Limit
VCC2
−
+
Temp.
Shut.
(11)
V
100 nF
OUT
4
ON/OFF 5
GND
(7)
(8)
Enable
−
+
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2
Current
Limit
Temp.
Shut.
VCC2
(9)
V
100 nF
OUT
5
MC33765
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
CONTROL ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (For typical values T
Characteristics
= 25°C, for min/max values TA = −40°C to +85°C/ Max TJ = 125°C)
A
Symbol Pin # Min Typ Max Unit
INDEPENDENT ENABLE PINS
Input Voltage Range V
Control Input Impedance
Logic “0”, i.e. OFF State
Logic “1”, i.e. ON State
ON/OFF(1−5)
V
ON/OFF(1−5)
− 0 − V
−
− −
100
2.0
−
−
−
0.5
CC
−
−
V
kW
V
COMMON ENABLE PIN
Input Voltage Range V
Control Input Impedance
Logic “0”, i.e. OFF State
Logic “1”, i.e. ON State
CE
V
CE
2 0 − V
2
2 −
100
2.0
−
−
−
0.3
CC
−
−
V
kW
V
CURRENT CONSUMPTION WITH NO LOAD
Current Consumption at Logic “0” for the complete device,
БББББББББББББББ
i.e. Common Enable and All Independent Enable pins at OFF State
Current Consumption at Logic “1” for the complete device,
i.e. Common Enable and All Independents Enable pins at ON State
БББББББББББББББ
Current Consumption at Logic “1”, Common Enable at ON State
and All Independents Enable pins at OFF State
ББББББ
ББББББ
IQ
IQ
IQ
OFF
ON1
ON2
Á
Á
−
−
−
ÁÁ
−
470
ÁÁ
130
Á
5.0
−
Á
−
mA
Á
mA
Á
mA
SUPPLY AND OUTPUT VOLTAGES, DROPOUT AND LOAD REGULATION
Supply Voltage V
CC
Regulator Output Voltage for VR1, VR2, VR3, VR4 and VR5
Dropout Voltage for VR1, VR2, VR3, VR5 (Note 1) VCC−V
Dropout Voltage for VR4 (Note 1) VCC−V
Load Regulation (TA = 25°C) Reg
MC33765 (2.8V) V
MC33765 (2.8V)
CC1, VCC2
V
OUT(1−5)
OUT
OUT4
load(1−5)
15, 10 3.0 3.6 5.3 V
14, 13, 12,
11, 9 2.7 2.8 2.85
14, 13, 12,
− 0.11 0.17 V
9
11 − 0.17 0.30 V
9, 11, 12,
− − 0.5 mV/mA
13, 14
V
MAX POWER DISSIPATION AND TOTAL DC OUTPUT CURRENT (VR1 + VR2 + VR3 + VR4 + VR5) (Note 2)
Max Power Dissipation at VCC = 5.3 V (TA = 85°C)
Max. Total RMS Output Current at VCC = 5.3 V (TA = 85°C)
Max Power Dissipation at VCC = 5.3 V (TA = 25°C)
Max. Total RMS Output Current at VCC = 5.3 V (TA = 25°C)
P
P
dmax
I
RMS
dmax
I
RMS
− −
− −
−
−
−
−
−
−
285
130
700
250
mW
mA
mW
mA
1. Typical dropout voltages have been measured at currents: Output1: 25 mA, Output2: 35 mA, Output3: 40 mA, Output4: 140 mA, Output5: 40 mA
Maximum value of dropout voltages are measured at maximum specified current.
2. See package power dissipation and thermal protection.
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3
MC33765
REGULATOR ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (For typical values T
Characteristics Pin # Symbol Min Typ Max Unit
OUTPUT CURRENTS (Note 3)
Regulator VR1 Output Current
Regulator VR2 Output Current 13 I
Regulator VR3 Output Current 12 I
Regulator VR4 Output Current 11 I
Regulator VR5 Output Current 9 I
Current Limit for VR1, VR2, VR3, VR4, VR5
[Twice the max Output Current for each output]
EXTERNAL CAPACITORS
External Compensation Capacitors for VR1, VR2, VR4, VR5 14, 13, 11, 9 C
External Compensation Capacitors for VR3 12 C
External Compensation Capacitors ESR − − 0.05 1.0 3.0
RIPPLE REJECTIONS
Ripple Rejection VR1, VR2, VR4, VR5
(at Max. Current, 1.0 kHz, C = 100 nF)
= 25°C, for min/max values TA = −40°C to +85°C/ Max TJ = 125°C)
A
14 I
14, 13, 12,
11, 9
14, 13, 11, 9
I
(1−2, 4−5)
(DV
OUT
OUT1
OUT2
OUT3
OUT4
OUT5
MAX
4
10 − 30 mA
10 − 40 mA
0 − 50 mA
10 − 150 mA
10 − 60 mA
− 2 X I
(1−5)
OUT
0.10 − 1.0
1.0 − −
50 60 − dB
)
(DVCC)
− mA
mF
mF
W
Ripple Rejection VR1, VR2, VR4, VR5
(at Max. Current, f = 10 kHz, C = 100 nF)
Ripple Rejection of VR3
(at Max. Current, f = 1.0 kHz, C = 1.0 mF)
Ripple Rejection of VR3
(at Max. Current, f = 10 kHz, C = 1.0 mF)
Ripple Rejection of VR3
(at Max. Current, f = 100 kHz, C = 1.0 mF)
14, 13, 11, 9
12
12
12
(DV
OUT
(DVCC)
(DV
OUT
(DVCC)
(DV
OUT
(DVCC)
(DV
OUT
(DVCC)
40 45 − dB
)
50 60 − dB
)
40 45 − dB
)
18 22 − dB
)
DYNAMIC PARAMETERS
Rise Time (1% → 99%) Common Enable at ON st ate, C
VR1, VR2, VR4, VR5 with C
VR3 with C
= 1.0 mF, TA = 25°C
OUT
Fall Time (99% → 1%) [C
Overshoot (C
TA = 25°C Common Enable at ON state, independent enable from OFF to ON state
= 100 nF for VR1, VR2, VR4, VR5 and C
OUT
= 100 nF, TA = 25°C
OUT
= 100 nF, I
OUT
= 30 mA] (Note 4) t
OUT
Settling Time (to ±0.1% of nominal) at TA = 25°C
Common Enable at ON state, independent enable from OFF to ON state
bypass
= 10 nF, I
OUT
at max. current
out
= 1.0 mF for VR3) at
t
on
off
−
−
−
−
150
− 100 −
30
− − 5 8 %
−
− 95 −
ms
ms
ms
ms
NOISE AND CROSSTALKS
Noise Voltage (100 Hz < f < 100 kHz) with C
VR1, VR2, VR4, VR5 with C
= 100 nF; VR3 with C
OUT
Static crosstalk (DC shift) between the Regulator Output, TA = 25°C (Note 5) − − 150 200
Dynamic CrossTalk Attenuation between the Regulator Outputs (f = 10 kHz),
bypass
= 100 nF
OUT
= 1.0 mF
− −
−
40
25
30
−
mV RMS
mV
− 30 35 − dB
TA = 25°C (Note 6)
THERMAL SHUTDOWN
Thermal Shutdown − − 160 − °C
3. Maximum Output Currents are peak values. Total DC current have to be set upon maximum power dissipation specification. Only Output
3 has been designed to be stable at minimum current of 0 mA.
4. The Fall time is highly dependent on the load conditions, i.e. load current for a specified value of C
5. Static Crosstalk is a DC shift caused by switching ON one of the outputs through independent enable to all other outputs. This parameter
OUT
.
is highly dependent on overall PCB layout and requires the implementation of low−noise GROUND rules (e.g. Ground plane).
6. Dynamic crosstalk is the ratio between a forced output signal to signal transferred to other outputs. This requires special device configuration
to be measured.
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4
MC33765
MC33765 TYPICAL OSCILLOSCOPE SHOTS
X: 100ms/div
Y1: 1V/div
Y2: 60mV/div
Vin = 4.0V
Ta = 23°C
Vout5
Enable of
Out4
Figure 1. Crosstalk response of MC33765 showing
extremely weak interaction between outputs
Output 4 is banged from 0 to 150mA
X: 500ms/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C
CE
Out3
Y1
Y2
Y1
Y2
X: 5ms/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C
CE
Out3
Figure 2. Repetitive Common Enable response time
Vout5 Enable
Vout5
Y1
Y2
Y1
Y2
Figure 3. Single Common Enable response time
(Cbypass discharged)
Vout4
X: 500ms/div
Y1: 10mV/div
Vin = 3.8V
Ta = 23°C
Y1
X: 5ms/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C
Figure 4. Output response from seperate Enable
Y1
Vout5
X: 500ms/div
Y1: 10mV/div
Vin = 3.8V
Ta = 23°C
Figure 5. Output 4 is banged from 3mA to 150mA Figure 6. Output 5 is banged from 3mA to 50mA
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5
Vin
t
MC33765
Y1
Vin
Y1
Y2
Vout2 Y2
X: 200ms/div
Y1: 2V/div
Y2: 10mV/div
Vin = variable
Ta = 23°C
Figure 7. Typical input voltage rejection (Cout = 100nF)
160
140
OUT5
DROPOUT VOLTAGE (mV)
120
100
OUT4
OUT3
OUT2
OUT1
80
60
40
20
Vout3
X: 200ms/div
Y1: 2V/div
Y2: 10mV/div
Vin = variable
Ta = 23°C
Figure 8. Typical input voltage rejection (Cout = 1mF)
8.0
OUT4
7.0
6.0
OUT2
5.0
4.0
OUT3
3.0
GROUND CURRENT (mA)
2.0
OUT1
1.0
OUT5
0
200 40 100
60 80
OUTPUT CURRENT (mA)
120 140 160
Figure 9. Dropout Voltage versus Output Current
400
350
OUT4
300
250
OUT5
200
OUT3
OUT2
OUT1
−40−60 −20 40
020
TEMPERATURE (°C)
60 80 100
MAXIMUM OUTPUT CURRENT (mA)
150
100
50
0
Figure 11. Maximum Output Current versus Temperature
0
−40−60 −20 40
020
TEMPERATURE (°C)
60 80 100
Figure 10. Ground Current versus Individual Outpu
160
140
DROPOUT VOLTAGE (mV)
120
100
30 mA
80
20 mA
60
10 mA
40
20
0
−40−60 −20 40
020
TEMPERATURE (°C)
60 80 100
Figure 12. Dropout Voltage versus Operating
Temperature: OUT1
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6
MC33765
160
140
120
100
30 mA
80
20 mA
60
DROPOUT VOLTAGE (mV)
10 mA
40
20
0
−40−60 −20 40
020
TEMPERATURE (°C)
Figure 13. Dropout Voltage versus Operating
Temperature: OUT2
200
150
150 mA
100 mA
100
60 mA
DROPOUT VOLTAGE (mV)
50
10 mA
0
−40−60 −20 40
020
TEMPERATURE (°C)
60 80 100
60 80 100
160
140
120
100
50 mA
80
30 mA
60
DROPOUT VOLTAGE (mV)
10 mA
40
20
0
−40−60 −20 40
020
TEMPERATURE (°C)
Figure 14. Dropout Voltage versus Operating
Temperature: OUT3
160
140
120
100
60 mA
80
35 mA
60
DROPOUT VOLTAGE (mV)
40
10 mA
20
0
−40−60 −20 40
020
TEMPERATURE (°C)
60 80 100
60 80 100
Figure 15. Dropout Voltage versus Operating
Temperature: OUT4
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Figure 16. Dropout Voltage versus Operating
Temperature: OUT5
7
MC33765
DEFINITIONS
Load Regulation − The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage − The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential input/output), dropout voltage
is affected by junction temperature, load current and
minimum input supply requirements.
Output Noise Voltage − The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
MC33765 Output noise performances
300
250
200
150
nV/sqrt(Hz)
100
50
0
10 100 10000
1000
Frequency (Hz)
OUT3
Vin = 3.6V
I
= typical
out
C
= 10nF
byp
OUT1, 2, 3, 4, 5
100000 1000000
Maximum Power Dissipation − The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current − Current which is used to operate the
regulator chip with no load current.
Line Regulation − The change in input voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Thermal Protection − Internal thermal shutdown
circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 160°C, the regulator turns off.
This feature is provided to prevent catastrophic failures from
accidental overheating.
Maximum Package Power Dissipation and RMS
Current − The maximum package power dissipation is the
power dissipation level at which the junction temperature
reaches its maximum value i.e. 125°C. The junction
temperature is rising while the difference between the input
power (VCC X ICC) and the output power (V
out
X I
out
) is
increasing.
As MC33765 device exhibits five independent outputs
I
is specified as the maximum RMS current combination
out
of the five output currents.
As the device can be switched ON/OFF through
independent Enable (ON/OFF pin) or Common Enable, the
output signal could be, for example, a square wave. Let’s
assume that the device is ON during TON on a signal period
T. The RMS current will be given by:
Ǹ
where
T
on
I
out
D +
RMS
T
ON
T
+ IP D
I
p
T, period
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum RMS current as following:
TJ–T
R
A
qJA
Pd +
The maximum operating junction temperature TJ is
specified at 125°C, if TA = 25°C, then PD = 700 mW. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
P
I
out
+
D
VCC–V
out
So that in the more drastic conditions:
VCC = 5.3 V, V
I
is 269 mA.
out
= 2.7 V then the maximum RMS value of
out
The maximum power dissipation supported by the device
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the IC has good thermal
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power d issipation by s ubtracting
the output power from the input power. All variables are then
well known: p ower d issipati on, t hermal s hut down t emperature
(160°C for MC33765) and ambient temperature.
TJ–T
R
qJA
+
A
P
D
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8
MC33765
DESIGN HINTS
Reducing the cross−talk between the MC33765 outputs
One of the origin of the DC shift finds its seat in the layout
surrounding the integrated circuit. Particular care has to be
taken when routing the output ground paths. Star grounding
116
MC33765
Rlayout
15
14
13
12
11
10
9
WRONG CORRECT
Load1 Load2
2
3
4
5
6
7
8
common impedance shift
Figure 17. Star Cabling Avoids Coupling by Common Ground Impedance
The first l eft c abling w ill g enerate a v oltage s hift w hich w ill
superimpose on the output voltages, thus creating an
undesirable offset. By routing the return grounds to a single
or a ground plane are the absolute conditions to reduce the
noise or shift associated to common impedance situations,
as depicted by Figure 17.
116
2
3
4
5
6
7
8
15
14
13
12
11
MC33765
10
9
Star cabling
Load1 Load2
low impedance point, you naturally shield the circuit against
common impedance d i sturbances. F igure 1 8 portraits the text
fixture implemented to test the response of the MC33765.
V
CC
10k
10k
116
10nF
10k
2
3
4
5
6
7
8
MC33765
Figure 18. DC Shift Text Fixture
15
14
13
12
11
10
9
470nF
+
100nF
1mF
56
18
Output 3
Output 4
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9
MC33765
DESIGN HINTS (cont.)
Output 4 was banged from 0 to 150mA via its dedicated
control pi n, w hile o utput 3 fixed at 5 0mA w as m onitored. T he
circuit has been implemented on a PCB equipped with a
Y1, output 3
Figure 19. Vin = 4V, Y1 = 62.5mV/div, F = 200Hz
ground plane a nd r outed w ith s hort c opper t races. T he r esults
are shown hereafter, revealing the excellent behavior of the
MC33765 when crosstalks outputs is at utmost importance.
Y1, output 3
Figure 20. Vin = 5V, Y1 = 1mV/div
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10
MC33765
TECHNICAL TERMS
Rise Time − Common Enable being in ON state, the
device is switched on by ON/OFF pin control.
Let’s call t1 the time when ON/OFF signal reaches 1% of its
nominal value.
Let’s call t2 the time when output signal reaches 99% of its
nominal value.
The rise time for this device is specified as:
tON+ t1* t
2
Fall Time − The fall time is highly dependent on the
output capacitor and so device design is not impacting at all
this parameter.
Rise Time
Vnom
Settling Time
Overshoot
99%
Overshoot, Settling Time − As regulators are based on
regulation loop through an error amplifier, this type of
device requires a certain time to stabilize and reach its
nominal value.
The overshoot is defined as the voltage difference
between the peak voltage and steady state when switching
ON the regulator.
The settling time is equal to the time required by the
regulator to stabilize to its nominal value (±0.5%) after peak
value when switching ON the regulator.
Output Voltage
OFF
ON
Chip Enable is ON
ON/OFF pin signal
1%
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11
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
16
1
SCALE 2:1
16X REFK
M
G
0.10 (0.004)
−T−
SEATING
PLANE
L
U0.15 (0.006) T
PIN 1
IDENT.
U0.15 (0.006) T
D
S
2X L/2
S
0.10 (0.004) V
16
1
A
−V−
C
U
T
9
B
−U−
8
TSSOP−16
CASE 948F−01
ISSUE B
S
S
J1
J
N
N
F
DETAIL E
DETAIL E
H
K
K1
SECTION N−N
0.25 (0.010)
M
DATE 19 OCT 2006
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
−W−
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
INCHESMILLIMETERS
SOLDERING FOOTPRINT
7.06
GENERIC
MARKING DIAGRAM*
16
XXXX
1
XXXX
ALYW
1
XXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
0.65
PITCH
W = Work Week
G or G = Pb−Free Package
*This information is generic. Please refer to
16X
0.36
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
16X
1.26
98ASH70247A
TSSOP−16
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
PAGE 1 OF 1
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