Dual Differential
(EIA-422-A)/
Quad Single-Ended
(EIA-423-A) Line Drivers
The MC26LS30 is a low power Schottky set of line drivers which
can be configured as two differential drivers which comply with
EIA–422–A standards, or as four single–ended drivers which comply
with EIA–423–A standards. A mode select pin and appropriate choice
of power supplies determine the mode. Each driver can source and
sink currents in excess of 50 mA.
In the differential mode (EIA–422–A), the drivers can be used up to
10 Mbaud. A disable pin for each driver permits setting the outputs
into a high impedance mode within a +10 V common mode range.
In the single–ended mode (EIA–423–A), each driver has a slew rate
control pin which permits setting the slew rate of the output signal so
as to comply with EIA–423–A and FCC requirements and to reduce
crosstalk. When operated from symmetrical supplies (+5.0 V), the
outputs exhibit zero imbalance
The MC26LS30 is available in a 16–pin surface mount package.
Operating temperature range is –40° to +85°C.
16
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SO–16
D SUFFIX
1
CASE 751B
A= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W= Work Week
PIN CONNECTIONS
MARKING
DIAGRAM
16
MC26LS30D
AWLYWW
1
• Operates as Two Differential EIA–422–A Drivers, or Four
Single–Ended EIA–423–A Drivers
• High Impedance Outputs in Differential Mode
• Short Circuit Current Limit In Both Source and Sink Modes
• ±10 V Common Mode Range on High Impedance Outputs
• ±15 V Range on Inputs
• Low Current PNP Inputs Compatible with TTL, CMOS, and MOS
Outputs
• Individual Output Slew Rate Control in Single–Ended Mode
• Replacement for the AMD AM26LS30 and National Semiconductor
Differential Output Rise Time (Figure 3)t
Differential Output Fall Time (Figure 3)t
Propagation Delay Time – Input to Differential Output
Input Low to High (Figure 3)
Input High to Low (Figure 3)
Skew Timing (Figure 3)
t
to t
PDH
Max to Min t
Max to Min t
Enable Timing (Figure 4)
Enable to Active High Differential Output
Enable to Active Low Differential Output
Enable to 3–State Output From Active High
Enable to 3–State Output From Active Low
1. All voltages measured with respect to Pin 5.
2. Only one output shorted at a time, for not more than 1 second.
Output Rise Time, C
Output Fall Time, C
Output Rise Time, C
Output Fall Time, C
Rise Time Coefficient (Figure 16)C
Propagation Delay Time, Input to Single Ended Output (Figure 5)
Input Low to High, C
Input High to Low, C
Skew Timing, CC = 0 (Figure 5)
to t
t
PDH
Max to Min t
Max to Min t
for Each Driver
PDL
PDH
PDL
1. All voltages measured with respect to Pin 5.
2. Only one output shorted at a time, for not more than 1 second.
3. Typical values established at +25°C, V
4. V
switched from 0.8 to 2.0 V.
in
5. Imbalance is the difference between V
= 0
C
= 0
C
= 50 pF
C
= 50 pF
C
= 0
C
= 0
C
Within a Package
Within a Package
= +5.0 V, VEE = –5.0 V.
CC
with Vin 0.8 V and VO2 with Vin 2.0 V.
O2
= 25°C, VCC = 5.0 V, VEE = –5.0 V, (Notes 1. and
A
SymbolMinTypMaxUnit
t
r
t
f
t
r
t
f
rt
–
–
–
–
65
65
3.0
3.0
300
300
–
–
ns
µs
–0.06–µs/pF
ns
t
PDH
t
PDL
–
–
100
100
300
300
ns
t
SK4
t
SK5
t
SK6
–
–
–
15
2.0
5.0
–
–
–
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4
Differential
+5.0
Gnd
00010000010110100
(EIA 422 A)
001X0100111Z0Z001
00X1100010Z1Z0011
00100000011001100
000100011X01100Z1
Sgeded
50
50
010000000100000
(EIA423A)
11100100001001000
11001001000010010
11000010010000100
V
in
(0.8 or 2.0 V)
Mode = 0
MC26LS30
T able 1
InputsOutputs
OperationV
CC
Differential+5.0Gnd000000110
(EIA–422–A)
Single–Ended+5.0–5.0100000000
(EIA–423–A)
X0XXXXXXZZZZ
X = Don’t Care
Z = High Impedance (Off)
V
CC
/2
R
L
V
OD2
RL/2
V
ModeABCDABCD
EE
1
V
CC
V
in
(0.8 or 2.0 V)
V
OS
Mode = 1
V
EE
1
1
0
1
Z
0
0
0
1
R
C
L
L
V
O
Figure 1. Differential Output TestFigure 2. Single–Ended Output Test
V
CC
V
in
100
500 pF
V
OD
S.G.
NOTES:
1. S.G. set to: f 1.0 MHz; duty cycle = 50%; t
2. t
= t
SK1
3. t
4. t
PDH–tPDL
computed by subtracting the shortest t
SK2
computed by subtracting the shortest t
SK3
for each driver.
Figure 3. Differential Mode Rise/Fall Time and Data Propagation Delay
, tf, 10 ns.
r
from the longest t
PDH
from the longest t
PDL
+3.0 V
V
in
1.5 V
t
PDH
90%
50%
V
out
10%
t
r
of the 2 drivers within a package.
PDH
of the 2 drivers within a package.
PDL
1.5 V
t
f
t
0 V
PDL
90%
50%
10%
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5
MC26LS30
V
CC
V
0 or 3.0 V
V
in
S.G.
En
500 pF
450 Ω
R
L
V
SS
in
(Vin = Hi)
Output
Current
= Lo)
(V
in
NOTES:
1. S.G. set to: f 1.0 MHz; duty cycle = 50%; t
, tf, 10 ns.
r
2. Above tests conducted by monitoring output current levels.
Figure 4. Differential Mode Enable Timing
V
CC
C
Vin
V
EE
S.G.
NOTES:
1. S.G. set to: f 100 kHz; duty cycle = 50%; t
2. t
= t
SK4
3. t
4. t
PDH–tPDL
computed by subtracting the shortest t
SK5
computed by subtracting the shortest t
SK6
C
450
for each driver.
500 pF
, tf, 10 ns.
r
PDH
PDL
V
O
from the longest t
from the longest t
1.5 V
t
t
PHZ
PLZ
0.1 VSS/R
L
0.1 V
SS/RL
V
in
1.5 V
t
PDH
90%
50%
V
out
10%
of the 4 drivers within a package.
PDH
of the 4 drivers within a package.
PDL
+3.0 V
1.5 V
0 V
t
PZH
VSS/R
VSS/R
L
L
t
PZL
0.5 VSS/R
0.5 VSS/R
L
L
+2.5 V
1.5 V
0 V
t
PDL
90%
50%
10%
t
r
t
f
Figure 5. Single–Ended Mode Rise/Fall Time and Data Propagation Delay
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6
MC26LS30
5.0
4.0
3.0
2.0
, OUTPUT VOLTAGE (V)
OD
V
1.0
0
+100
+60
+20
-20
-60
, SHORT CIRCUIT CURRENT (mA)
SC
I
-100
Differential Mode
Mode = 0, VCC = 5.0 V
0.8 or
2.0 V
I
O
V
OD
, OUTPUT CURRENT (mA)
I
O
Figure 6. Differential Output Voltage
versus Load Current
Normally Low Output
Normally High Output
Differential Mode
Mode = 0, V
1.0
Vza, APPLIED OUTPUT VOLTAGE (V)
Figure 8. Short Circuit Current
versus Output Voltage
CC
= 5.0 V
40
Differential Mode
Mode = 0
Supply Current = Bias Current + Load Current
30
20
, BIAS CURRENT (mA)
B
VCC = 5.25 V
I
6050403020100
10
20
TOTAL LOAD CURRENT (mA)
1201008060040
Figure 7. Internal Bias Current
versus Load Current
+5.0
VCC = 0
0
-5.0
-10
-15
INPUT CURRENT A)
in
I
-20
6.05.04.03.02.00
-25
VCC = 5.0 V
Pins 2 to 4, 6, 7
-5.0 V VEE 0
Differential or
Single-Ended Mode
, INPUT VOLTAGE (V)
V
in
(Pin numbers refer to SO–16 package only.)
1513119.07.05.03.01.0-1.0
Figure 9. Input Current versus Input Voltage
4.5
4.0
3.5
, OUTPUT VOLTAGE (V)
OH
V
3.0
Single-Ended Mode
Mode = 1
VCC = 5.0 V, VEE = -5.0 V
Vin = 1
0
Figure 10. Output Voltage versus
I
, OUTPUT CURRENT (mA)
OH
Output Source Current
-3.25
-3.75
-4.25
, OUTPUT VOLTAGE (V)
OL
V
-4.75
-60-40-30-50-20-10
0
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7
Single-Ended Mode
Mode = 1
VCC = 5.0 V, VEE = -5.0 V
Vin = 0
2010
I
, OUTPUT CURRENT (mA)
OL
Figure 11. Output Voltage versus
Output Sink Current
60504030
MC26LS30
26
22
18
, BIAS CURRENT (mA)
B+
14
I
10
100
-20
-60
, SHORT CIRCUIT CURRENT (mA)
SC
I
-100
Single Ended Mode
Mode = 1
V
= 5.0 V, VEE = -5.0 V
CC
Supply Current = Bias Current + I
OH
Vin = LoVin = Hi
-80
I
OL
TOTAL LOAD CURRENT (mA)
Figure 12. Internal Positive Bias Current
versus Load Current
60
20
Single-Ended Mode
Mode = 1
VCC = 5.0 V, VEE = -5.0 V
Normally Low Output
Normally High Output
-2.0-4.0-6.02.04.06.0
V
, APPLIED OUTPUT VOLTAGE (V)
za
0
0
-5.0
-10
Vin = LoV
= Hi
in
, BIAS CURRENT (mA)
B-
-15
I
Single-Ended Mode
Mode = 1
VCC = 5.0 V, VEE = -5.0 V
Supply Current = Bias Current + I
I
-2400-16024016080
OH
-20
I
OL
OL
-80-2400-16024016080
I
OH
TOTAL LOAD CURRENT (mA)
Figure 13. Internal Negative Bias Current
versus Load Current
110
Normally Low Output
Normally High Output to Ground
02085
T
, AMBIENT TEMPERATURE (°C)
A
40
60-20
+ (mA)
SC
-90
- (mA)I
-100
SC
I
-110
90
70
Single or Differential Mode
VCC = 5.0 V, VEE = -5.0 V or Gnd
50
-40
Figure 14. Short Circuit Current
versus Output Voltage
1.0 k
Single-Ended Mode
Mode = 1
µ, t
VCC = 5.0 V, VEE = -5.0 V
100
, RISE/FALL TIME ( s)t
10
f
r
1.0
10
Figure 16. Rise/Fall Time versus Capacitance
100
C
, CAPACITANCE (pF)
C
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8
Figure 15. Short Circuit Current
versus
Temperature
1.0 k
10 k
MC26LS30
APPLICATIONS INFORMATION
(Pin numbers refer to SO–16 package only.)
Description
The MC26LS30 is a dual function line driver – it can be
configured as two differential output drivers which comply
with EIA–422–A Standard, or as four single–ended drivers
which comply with EIA–423–A Standard. The mode of
operation is selected with the Mode pin (Pin 4) and
appropriate power supplies (see Table 1). Each of the four
outputs is capable of sourcing and sinking 60 to 7 0 m A while
providing sufficient voltage to ensure proper data
transmission.
As differential drivers, data rates to 10 Mbaud can be
transmitted over a twisted pair for a distance determined by
the cable characteristics. EIA–422–A Standard provides
guidelines for cable length versus data rate. The advantage
of a differential (balanced) system over a single–ended
system is greater noise immunity, common mode rejection,
and higher data rates.
Where extraneous noise sources are not a problem, the
MC26LS30 may be configured as four single–ended drivers
transmitting data rates to 100 Kbaud. Crosstalk among wires
within a cable is controlled by the use of the slew rate control
pins on the MC26LS30.
Mode Selection (Differential Mode)
In this mode (Pins 4 and 8 at ground), only a +5.0 V supply
±5% is required at VCC. Pins 2 and 7 are the driver inputs,
while Pins 10, 11, 14 and 15 are the outputs (see Block
Diagram on page 1). The two outputs of a driver are always
complementary and the differential voltage available at each
pair of outputs is shown in Figure 6 for V
= 5.0 V. The
CC
differential output voltage will vary directly with VCC. A
“high” output can only source current, while a “low” output
can only sink current (except for short circuit current – see
Figure 8).
The two outputs will be in a high impedance mode when
the respective Enable input (Pin 3 or 6) is high, or if V
CC
1.1 V. Output leakage current over a common mode range of
± 10 V is typically less than 1.0 µA.
The outputs have short circuit current limiting, typically,
less than 100 mA over a voltage range of 0 to +6.0 V (see
Figure 8). Short circuits should not be allowed to last
indefinitely as the IC may be damaged.
Pins 9, 12, 13 and 16 are not normally used when in this
mode, and should be left open.
(Single–Ended Mode)
In this mode (Pin 4 ≥ 2.0 V) VCC requires +5.0 V, and V
EE
requires –5.0 V, both ±5.0%. Pins 2, 3, 6, and 7 are inputs for
the four drivers, and Pins 15, 14, 11, and 10 (respectively)
are the outputs. The four drivers are independent of each
other, and each output will be at a positive or a negative
voltage depending on its input state, the load current, and the
supply voltage. Figures 10 & 11 indicate the high and low
output voltages for V
= 5.0 V, and VEE = –5.0 V. The graph
CC
of Figure 10 will vary directly with VCC, and the graph of
Figure 11 will vary directly with VEE. A “high” output can
only source current, while a “low” output can only sink
current (except short circuit current – see Figure 14).
The outputs will be in a high impedance mode only if
V
1.1 V. Changing VEE to 0 V does not set the outputs
CC
to a high impedance mode. Leakage current over a common
mode range of ±10 V is typically less than 1.0 µA.
The outputs have short circuit current limiting, typically
less than 100 mA over a voltage range of ±6.0 V (see Figure
14). Short circuits should not be allowed to last indefinitely
as the IC may be damaged.
Capacitors connected between Pins 9, 12, 13, and 16 and
their respective outputs will provide slew rate limiting of the
output transition. Figure 16 indicates the required capacitor
value to obtain a desired rise or fall time (measured between
the 10% and 90% points). The positive and negative
transition times will be within ≈ ±5% of each other. Each
output may be set to a different slew rate if desired.
Inputs
The five inputs determine the state of the outputs in
accordance with Table 1. All inputs (regardless of the
operating mode) have a nominal threshold of +1.3 V, and
their voltage must be kept within a range of 0 V to +15 V for
proper operation. If an input is taken more than 0.3 V below
ground, excessive currents will flow, and the proper
operation of the drivers will be affected. An open pin is
equivalent to a logic high, but good design practices dictate
that inputs should never be left open. Unused inputs should
be connected to ground. The characteristics of the inputs are
shown in Figure 9.
Power Supplies
VCC requires +5.0 V, ±5%, regardless of the mode of
operation. The supply current is determined by the IC’s
internal bias requirements and the total load current. The
internally required current is a function of the load current
and is shown in Figure 7 for the differential mode.
In the single–ended mode, V
must be –5.0 V, ±5% in
EE
order to comply with EIA–423–A standards. Figures 12 and
13 indicate the internally required bias currents as a function
of total load current (the sum of the four output loads). The
discontinuity at 0 load current exists due to a change in bias
current when the inputs are switched. The supply currents
vary ≈ ± 2.0 mA as V
and VEE are varied from 4.75 V
CC
to 5.25 V.
Sequencing of the supplies during power–up/
power–down is not required.
Bypass capacitors (0.1 µF minimum on each supply pin)
are recommended to ensure proper operation. Capacitors
reduce noise induced onto the supply lines by the switching
action of the drivers, particularly where long P.C. board
tracks are involved. Additionally, the capacitors help absorb
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9
MC26LS30
transients induced onto the drivers’ outputs from the
external cable (from ESD, motor noise, nearby computers,
etc.).
Operating Temperature Range
The maximum ambient operating temperature, listed as
+85°C, is actually a function of the system use (i.e.,
specifically how many drivers within a package are used)
and at what current levels they are operating. The maximum
power which may be dissipated within the package is
determined by:
T
T
where R
P
Dmax
= package thermal resistance which is typically:
JA
θ
Jmax
R
A
JA
120°C/W for the SOIC (D) package,
T
= max. allowable junction temperature (150°C)
Jmax
TA = ambient air temperature near the IC package.
1) Differential Mode Power Dissipation
For the differential mode, the power dissipated within the
package is calculated from:
PD [(VCC VOD) IO] (each driver) (VCC IB)
where: VCC= the supply voltage
VOD= is taken from Figure 6 for the known
value of I
I
= the internal bias current (Figure 7)
B
O
As indicated in the equation, the first term (in brackets) must
be calculated and summed for each of the two drivers, while
the last term is common to the entire package. Note that the
term (VCC –VOD) is constant for a given value of IO and does
not vary with VCC. For an application involving the
following conditions:
TA = +85°C, IO = –60 mA (each driver), VCC = 5.25 V, the
suitability of the package types is calculated as follows.
The power dissipated is:
PD [3.0V 60 mA 2] (5.25 V 18 mA)
PD 454 mW
The junction temperature calculates to:
TJ 85°C (0.454 W 120° CW) 139°C for the
SOIC package.
Since the maximum allowable junction temperature is not
exceeded in any of the above cases, either package can be
used in this application.
2) Single–Ended Mode Power Dissipation
For the single–ended mode, the power dissipated within
the package is calculated from:
P
[(
D
I
O
(
IB V
(
VCC V
CC
OH
)(
)](
IB V
each driver
EE
)
)
The above equation assumes IO has the same magnitude
for both output states, and makes use of the fact that the
absolute value of the graphs of Figures 10 and 11 are nearly
identical. IB+ and IB– are obtained from the right half of
Figures 12 and 13, and (V
Figure 10. Note that the term (V
– VOH) can be obtained from
CC
– VOH) is constant for a
CC
given value of IO and does not vary with VCC.For an
application involving the following conditions:
TA = +85°C, IO = –60 mA (each driver), VCC = 5.25 V,
V
= –5.25 V, the suitability of the package types is
EE
calculated as follows.
The power dissipated is:
(
P
24 mA 5.25 V
D
[
60 mA 1.45 V 4.0
PD 490 mW
)(
3.0 mA 5.25 V
]
)
The junction temperature calculates to:
TJ 85°C (0.490 W 120° CW) 144°C for the
SOIC package.
Since the maximum allowable junction temperature is not
exceeded in any of the above cases, either package can be
used in this application.
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10
MC26LS30
SYSTEM EXAMPLES
(Pin numbers refer to SO–16 package only.)
Differential System
An example of a typical EIA–422–A system is shown in
Figure 17. Although EIA–422–A does not specifically
address multiple driver situations, the MC26LS30 can be
used in this manner since the outputs can be put into a high
impedance mode. It is, however, the system designer’s
responsibility to ensure the Enable pins are properly
controlled so a s t o p revent t wo d rivers o n t he s ame c able f rom
being “on” at the same time.
The limit on the number of receivers and drivers which
may be connected on one system is determined by the input
current of each receiver, the maximum leakage current of
each “off” driver, and the DC current through each
terminating resistor. The sum of these currents must not
exceed the capability of the “on” driver (≈60 mA). If the
cable is of any significant length, with receivers at various
points along its length, the common mode voltage may vary
along its length, and this parameter must be considered when
calculating the maximum driver current.
The cable requirements are defined not only by the AC
characteristics and t he d ata r ate, b ut also by t he D C r esistance.
The maximum resistance must be such that the minimum
voltage across any receiver inputs is never l ess t han 2 00 m V.
The ground terminals of each driver and receiver in Figure
17 must be connected together by a dedicated wire (or the
shield) in the cable to provide a common reference. Chassis
grounds or power line grounds should not be relied on for
this common connection as they may generate significant
common mode differences. Additionally, they usually do
not provide a sufficiently low impedance at the frequencies
of interest.
Single–Ended System
An example of a typical EIA–423–A system is shown in
Figure 18. Multiple drivers on a single data line are not
possible since the drivers cannot be put into a high
impedance mode. Although each driver is shown connected
to a single receiver, multiple receivers can be driven from a
single driver as long as the total load current of the receivers
and the terminating resistor does not exceed the capability
of the driver (≈60 mA). If the cable is of any significant
length, with receivers at various points along its length, the
common mode voltage may vary along its length, and this
parameter must be considered when calculating the
maximum driver current.
The cable requirements are defined not only by the AC
characteristics and the data rate, but also by the DC
resistance. The maximum resistance must be such that the
minimum voltage across any receiver inputs is never less
than 200 mV.
The ground terminals of each driver and receiver in
Figure 18 must be connected together by a dedicated wire
(or the shield) in the cable so as to provide a common
reference. Chassis grounds or power line grounds should not
be relied on for this common connection as they may
generate significant common mode differences.
Additionally , they usually do not provide a sufficiently low
impedance at the frequencies of interest.
Additional Modes of Operation
If compliance with EIA–422–A or EIA–423–A Standard
is not required in a particular application, the MC26LS30
can be operated in two other modes.
1) The device may be operated in the differential mode
(Pin 4 = 0) with VEE connected to any voltage between
ground and –5.25 V. Outputs in the low state will be
referenced to VEE, resulting in a differential output voltage
greater than that shown in Figure 6. The Enable pins will
operate the same as previously described.
2) The device may be operated in the single–ended mode
(Pin 4 = 1) with V
connected to any voltage between
EE
ground and –5.25 V. Outputs in the high state will be at a
voltage as shown in Figure 10, while outputs in a low state
will be referenced to V
Termination Resistors
EE
.
Transmission line theory states that, in order to preserve
the shape and integrity of a waveform traveling along a
cable, the cable must be terminated in an impedance equal
to its characteristic impedance. In a system such as that
depicted in Figure 17, in which data can travel in both
directions, both physical ends of the cable must be
terminated. Stubs leading to each receiver and driver should
be as short as possible.
In a system such as that depicted in Figure 18, in which
data normally travels in one direction only, a terminator is
theoretically required only at the receiving end of the cable.
However, if the cable is in a location where noise spikes of
several volts can be induced onto it, then a terminator
(preferably a series resistor) should be placed at the driver
end to prevent damage to the driver.
Leaving off the terminations will generally result in
reflections which can have amplitudes of several volts above
V
or several volts below ground or VEE. These
CC
overshoots/undershoots can disrupt the driver and/or
receiver, create false data, and in some cases, damage
components on the bus.
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11
En
MC26LS30
R
TTL
En
R
DTTLTTL
TTL
DR
T
En
TTL
D
En
TTL
D
R
T
En
D
TTL
TTL
R
NOTES:
1. Terminating resistors R
should be located at the physical ends of the cable.
T
2. Stubs should be as short as possible.
3. Receivers = AM26LS32, MC3486, SN75173 or SN75175.
4. Circuit grounds must be connected together through a dedicated wire.
TTL
R
En
TTL
R
TTL
D
Twisted
Pair
TTL
TTL
TTL
TTL
D
D
D
D
MC26LS30
Figure 17. EIA–422–A Example
C
C
R
T
C
C
R
T
C
C
R
T
C
C
R
T
+
-
+
-
+
-
+
R
-
TTLR
TTLR
TTLR
TTL
AM26LS32, MC3486, SN75173, or SN75175
Figure 18. EIA–423–A Example
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12
–T–
–A–
169
–B–
18
G
K
C
SEATING
PLANE
D
16 PL
0.25 (0.010)A
M
S
B
T
S
MC26LS30
PACKAGE DIMENSIONS
SO–16
D SUFFIX
CASE 751B–05
ISSUE J
8 PLP
M
0.25 (0.010)B
M
S
X 45
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
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