ON Semiconductor MC14051B, MC14052B, MC14053B Technical data

MC14051B, MC14052B, MC14053B
Analog Multiplexers/Demultiplexers
Features
Triple Diode Protection on Control Inputs
Switch Function is Break Before Make
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Analog Voltage Range (V
Note: VEE must be V
Linearized Transfer Characteristics
Low−noise − 12 nV/Cycle, f 1.0 kHz Typical
Pin−for−Pin Replacement for CD4051, CD4052, and CD4053
For 4PDT Switch, See MC14551B
For Lower R
CMOS Devices
, Use the HC4051, HC4052, or HC4053 High−Speed
ON
Pb−Free Packages are Available*
− VEE) = 3.0 to 18 V
DD
SS
http://onsemi.com
PDIP−16
P SUFFIX
CASE 648
SOIC−16
D SUFFIX
CASE 751B
TSSOP−16 DT SUFFIX
CASE 948F
16
1
16
MARKING
DIAGRAMS
MC140xxBCP
AWLYYWW
140xxB
AWLYWW
1
16
14
0xxB
ALYW
1
MAXIMUM RATINGS (Voltages Referenced to V
Symbol Parameter Value Unit
V
Vin,
V
I
T
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/C From
65C To 12 5C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, V the range V
Unused inputs must always be tied to a n appropriate l ogic voltage l evel ( e.g., either V
SS
DC Supply Voltage Range
DD
out
I
in
SW
P
D
T
A
stg
T
L
, VEE or VDD). Unused outputs must be left open.
(Referenced to V
Input or Output Voltage Range
(DC or Transient) (Referenced to V
Control Inputs and V Input Current (DC or Transient) per Control Pin +10 mA Switch Through Current ±25 mA Power Dissipation per Package (Note 1) 500 mW Ambient Temperature Range −55 to +125 °C Storage Temperature Range −65 to +150 °C Lead Temperature (8−Second Soldering) 260 °C
(Vin or V
SS
)  VDD.
out
, VSS VEE)
EE
for Switch I/O)
EE
in
SS
and V
)
SS
−0.5 to +18.0
−0.5 to V
for
should be constrained to
out
DD
+ 0.5
V
V
16
SOEIAJ−16
F SUFFIX
CASE 966
xx = Specific Device Code A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week
MC140xxB
AWLYWW
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005
February, 2005 − Rev. 6
1 Publication Order Number:
MC14051B/D
MC14051B, MC14052B, MC14053B
MC14051B
8−Channel Analog
Multiplexer/Demultiplexer
INHIBIT
6
A
CONTROLS
SWITCHES
IN/OUT
11
10
9 13 14 15 12
1
5
2
4
B C X0 X1 X2 X3 X4 X5 X6 X7
VDD = PIN 16
V
= PIN 8
SS
V
= PIN 7
EE
X
3
COMMON
OUT/IN
Multiplexer/Demultiplexer
CONTROLS
SWITCHES
IN/OUT
MC14052B
Dual 4−Channel Analog
INHIBIT
6
A
10
9 12 14 15 11
1
5
2
4
B X0
X1 X2 X3 Y0 Y1 Y2
Y3
V
DD
V
SS
V
EE
X
Y
= PIN 16
= PIN 8 = PIN 7
13
3
COMMONS
OUT/IN
Triple 2−Channel Analog
Multiplexer/Demultiplexer
CONTROLS
SWITCHES
IN/OUT
Note: Control Inputs referenced to VSS, Analog Inputs and Outputs reference to VEE. VEE must be ≤ VSS.
PIN ASSIGMENT
MC14051B MC14052B MC14053B
V
16
DD
X2
15
X1
14
X0
13
X3
125
A
11
B
10
C
9
INH
V
V
Y0
Y2
Y3
Y1
1
2
3
Y
4
6
7
EE
8
SS
V
16
DD
X2
15
X1
14
X
13
X0
125
11
X3
10
A
9
B
INH
V
V
X4
X6
X7
X5
1
2
X
3
4
6
7
EE
8
SS
MC14053B
INHIBIT
6
A
11
B
10
C
9
X0
12
X1
13
Y0
2
Y1
1
Z0
5
Z1
3
V
= PIN 16
DD
V
SS
V
EE
1
Y1
2
Y0
3
Z1
4
Z
Z0
INH
6
7
V
EE
8
V
SS
= PIN 8 = PIN 7
14
X
COMMONS
15
Y
Z
16
15
14
13
125
10
OUT/IN
4
V
DD
Y
X
X1
X0
11
A
B
9
C
http://onsemi.com
2
MC14051B, MC14052B, MC14053B
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î ÎÎ ÎÎ
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î ÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
Î
Î
Î
ÎÎ
ELECTRICAL CHARACTERISTICS
− 55C
Characteristic
ОООООО
Symbol
Î
V
Î
DD
Test Conditions
ОООООО
Min
Max
Î
Min
Î
SUPPLY REQUIREMENTS (Voltages Referenced to VEE)
Power Supply Voltage
ОООООО
Range
Quiescent Current Per
Package
ОООООО
ОООООО
ОООООО
Total Supply Current
(Dynamic Plus
ОООООО
Quiescent, Per Package
ОООООО
V
Î
I
DD
Î
Î
Î
I
D(AV)
Î
Î
DD
VDD – 3.0 V
Î
Î
Î
Î
Î
Î
ОООООО
5.0
Control Inputs:
10
V
ОООООО
in
15
Switch I/O: V
ОООООО
V
DD
500 mV (Note 3)
ОООООО
5.0
TA = 25C only (The
10
channel component,
ОООООО
15
(V not included.)
ОООООО
SS
= VSS or VDD,
EE
, and V
– V
in
)/Ron, is
out
switch
V
V
EE
I/O
3.0
18
5.0 10 20
3.0
Î
Î
Î
Î
Î
Î
Î
Î
Typical (0.20 A/kHz) f + I
ОООООООООООО
ОООООООООООО
CONTROL INPUTS — INHIBIT, A, B, C (Voltages Referenced to VSS)
Low−Level Input Voltage
ОООООО
High−Level Input Voltage
ОООООО
Input Leakage Current Input Capacitance
V
Î
V
Î
I
C
5.0 10
Î
15
5.0 10
Î
15 15
Ron = per spec,
= per spec
I
off
ОООООО
Ron = per spec, I
= per spec
off
ОООООО
Vin = 0 or V
DD
IL
IH
in
in
3.5
7.0 11
1.5
3.0
Î
Î
4.0
± 0.1
Î
3.5
7.0
Î
SWITCHES IN/OUT AND COMMONS OUT/IN — X, Y, Z (Voltages Referenced to VEE)
Recommended
Peak−to−Peak Voltage
ОООООО
V
Î
I/O
Channel On or Off
Î
ОООООО
0
V
DD
Î
Î
Into or Out of the Switch
Recommended Static or
ОООООО
Dynamic Voltage Across the Switch (Note 3)
ОООООО
V
Î
Î
switch
Î
Î
Channel On
ОООООО
ОООООО
0
600
Î
Î
Î
Î
(Figure 5) Output Offset Voltage ON Resistance
ОООООО
ОООООО
ON Resistance Between
ОООООО
Any Two Channels in the
Same Package
ОООООО
Off−Channel Leakage
Current (Figure 10)
ОООООО
ОООООО
Capacitance, Switch I/O Capacitance, Common O/I
ОООООО
ОООООО
Capacitance, Feedthrough
(Channel Off)
V
R
Î
Î
R
Î
Î
I
Î
Î
C C
Î
Î
C
OO
on
off
I/O O/I
I/O
Vin = 0 V, No Load
5.0
V
Î
10 15
Î
5.0
on
Î
10 15
Î
15
Vin = VIL or V
Î
Î
Inhibit = V
Inhibit = V
Î
Î
−−Pins Not Adjacent Pins Adjacent
500 mV
switch
ОООООО
(Note 3) V (Control), and Vin =
ОООООО
0 to V
ОООООО
ОООООО
(Switch)
DD
= VIL or V
in
IH
IH
(Control) Channel to
ОООООО
Channel or Any One Channel
ОООООО
DD DD
(MC14051B)
ОООООО
(MC14052B) (MC14053B)
ОООООО
800
Î
Î
Î
Î
± 100
Î
Î
Î
Î
400 220
70 50 45
Î
Î
Î
Î
Î
Î
Î
Î
2. Data labeled “Typ” is not to be used for design purposes, but is intended as an indication of the IC’s potential performance.
3. For voltage drops across the switch (V current out of the switch may contain both V Maximum Ratings are exceeded. (See first page of this data sheet.)
) > 600 mV ( > 300 mV at high temperature), excessive VDD current may be drawn, i.e. the
switch
and switch input components. The reliability of the device will be unaffected unless the
DD
25C
Typ
(Note 2)
ÎÎ
ÎÎ
0.005
0.010
ÎÎ
0.015
ÎÎ
ÎÎ
(0.07 A/kHz) f + I
(0.36 A/kHz) f + I
2.25
4.50
ÎÎ
6.75
2.75
5.50
ÎÎ
11
8.25
±0.00001
0
0
5.0
ÎÎ
ÎÎ
ÎÎ
10
250
ÎÎ
120
80
ÎÎ
25
ÎÎ
10 10
ÎÎ
± 0.05
ÎÎ
ÎÎ
10
60
ÎÎ
32 17
ÎÎ
0.15
0.47
Max
Î
Î
Î
Î
Î
Î
Î
± 0.1
V
Î
600
Î
Î
1050
Î
500 280
Î
Î
Î
± 100
Î
Î
Î
Î
18
5.0 10 20
1.5
3.0
4.0
7.5
70 50 45
DD
DD DD DD
Min
Î
3.0
Î
Î
Î
Î
Î
3.5
7.0
Î
11
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
125C
0
0
Max
Î
18
Î
150 300
Î
600
Î
Î
1.5
3.0
Î
4.0
Î
1.0
V
DDVPP
Î
300
Î
Î
1200
Î
520 300
Î
135
Î
95 65
Î
±1000
Î
Î
Î
Î
Unit
V
A
A
V
V
A pF
mV
V
nA
pF pF
pF
http://onsemi.com
3
MC14051B, MC14052B, MC14053B
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ELECTRICAL CHARACTERISTICS (Note 4) (C
Characteristic
Propagation Delay Times (Figure 6)
ООООООООООООО
Switch Input to Switch Output (R
MC14051
ООООООООООООО
ООООООООООООО
t
PLH
t
PLH
t
PLH
, t
= (0.17 ns/pF) CL + 26.5 ns
PHL
, t
= (0.08 ns/pF) CL + 11 ns
PHL
, t
= (0.06 ns/pF) CL + 9.0 ns
PHL
= 10 k)
L
= 50 pF, TA = 25C) (VEE VSS unless otherwise indicated)
L
Symbol
t
, t
PLH
ÎÎÎ
ÎÎÎ
ÎÎÎ
PHL
VDD – V
EE
Vdc
ÎÎÎÎ
ÎÎÎÎ
5.0 10
ÎÎÎÎ
15
Typ (Note 5)
All Types
ÎÎÎ
ÎÎÎ
35 15
ÎÎÎ
12
Max
ÎÎ
ÎÎ
90 40
ÎÎ
30
MC14052
ООООООООООООО
ООООООООООООО
t
PLH
t
PLH
t
PLH
, t
= (0.17 ns/pF) CL + 21.5 ns
PHL
, t
= (0.08 ns/pF) CL + 8.0 ns
PHL
, t
= (0.06 ns/pF) CL + 7.0 ns
PHL
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
5.0 10
ÎÎÎÎ
15
ÎÎÎ
30 12
ÎÎÎ
10
ÎÎ
75 30
ÎÎ
25
MC14053
t
, t
ООООООООООООО
ООООООООООООО
PLH
t
PLH
t
PLH
= (0.17 ns/pF) CL + 16.5 ns
PHL
, t
= (0.08 ns/pF) CL + 4.0 ns
PHL
, t
= (0.06 ns/pF) CL + 3.0 ns
PHL
Inhibit to Output (RL = 10 k, VEE = VSS) Output “1” or “0” to High Impedance, or
ООООООООООООО
High Impedance to “1” or “0” Level
MC14051B
ООООООООООООО
ООООООООООООО
MC14052B
ООООООООООООО
MC14053B
ООООООООООООО
Control Input to Output (RL = 10 k, VEE = VSS)
ООООООООООООО
MC14051B
ООООООООООООО
MC14052B
ООООООООООООО
ООООООООООООО
MC14053B
ООООООООООООО
ООООООООООООО
Second Harmonic Distortion
(R
= 10K, f = 1 kHz) Vin = 5 V
L
PP
Bandwidth (Figure 7)
= 1 k, Vin = 1/2 (VDD−VEE) p−p, CL = 50pF
(R
ООООООООООООО
L
20 Log (V
out/Vin
) = − 3 dB)
Off Channel Feedthrough Attenuation (Figure 7)
ООООООООООООО
R
= 1K, Vin = 1/2 (VDD − VEE) p−p
L
= 4.5 MHz — MC14051B
f
in
ООООООООООООО
= 30 MHz — MC14052B
f
in
ООООООООООООО
f
= 55 MHz — MC14053B
in
Channel Separation (Figure 8)
(R
= 1 k, Vin = 1/2 (VDD−VEE) p−p,
L
ООООООООООООО
= 3.0 MHz
f
in
Crosstalk, Control Input to Common O/I (Figure 9)
= 1 k, RL = 10 k
(R
1
ООООООООООООО
Control t
TLH
= t
= 20 ns, Inhibit = VSS)
THL
ÎÎÎ
ÎÎÎ
t
, t
PHZ
t
PZH
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
t
PLH
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
,
PLZ
, t
PZL
, t
PHL
BW
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
5.0
ÎÎÎÎ
10
ÎÎÎÎ
15
ÎÎÎÎ
5.0
ÎÎÎÎ
10
ÎÎÎÎ
15
5.0 10 15
5.0 10 15
ÎÎÎÎ
5.0 10
ÎÎÎÎ
15
5.0
ÎÎÎÎ
10 15
ÎÎÎÎ
5.0
ÎÎÎÎ
10 15
ÎÎÎÎ
10
10
ÎÎÎÎ
10
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
10
ÎÎÎÎ
10
ÎÎÎÎ
25
ÎÎÎ
8.0
ÎÎÎ
6.0
ÎÎÎ
350
ÎÎÎ
170
ÎÎÎ
140 300
155
ÎÎÎ
125 275
140
ÎÎÎ
110
ÎÎÎ
360 160
ÎÎÎ
120 325
ÎÎÎ
130
90
ÎÎÎ
300
ÎÎÎ
120
80
ÎÎÎ
0.07
17
ÎÎÎ
– 50
ÎÎÎ
ÎÎÎ
ÎÎÎ
– 50
ÎÎÎ
75
ÎÎÎ
65
ÎÎ
20
ÎÎ
15
ÎÎ
700
ÎÎ
340
ÎÎ
280 600
310
ÎÎ
250 550
280
ÎÎ
220
ÎÎ
720 320
ÎÎ
240 650
ÎÎ
260 180
ÎÎ
600
ÎÎ
240 160
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
4. The formulas given are for the typical characteristics only at 25C.
5. Data labelled “Typ” is not lo be used for design purposes but In intended as an indication of the IC’s potential performance.
Unit
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
MHz
Î
dB
Î
Î
Î
dB
Î
mV
Î
ns
ns
ns
ns
ns
ns
ns
ns
ns
%
http://onsemi.com
4
IN/OUT
LEVEL CONVERTED CONTROL
MC14051B, MC14052B, MC14053B
V
V
DD
V
DD
DD
V
DD
V
EE
IN/OUT OUT/IN
OUT/IN
V
EE
Figure 1. Switch Circuit Schematic
TRUTH TABLE
Control Inputs
Select
Inhibit
C* B A MC14051B MC14052B MC14053B
0 0 0 0 X0 Y0 X0 Z0 Y0 X0 0 0 01 X1 Y1 X1 Z0 Y0 X1 0 0 10 X2 Y2 X2 Z0 Y1 X0 0 0 11 X3 Y3 X3 Z0 Y1 X1
0 1 0 0 X4 Z1 Y0 X0 0 1 01 X5 Z1 Y0 X1 0 1 10 X6 Z1 Y1 X0 0 1 11 X7 Z1 Y1 X1
1 x x x None None None
*Not applicable for MC14052 x = Don’t Care
16 V
DD
INH6
A10
LEVEL
CONVERTER
B9
X012
8VSS7V
EE
X114
X215
X311
Y01 Y15
Y22 Y34
ON Switches
BINARY TO 1−OF−4
DECODER WITH
INHIBIT
13X
3Y
CONTROL
16 V
DD
INH6
A11 B10 C9
X013
LEVEL
CONVERTER
8V
SS
7V
BINARY TO 1−OF−8
DECODER WITH
INHIBIT
EE
X114
X215 X312
X41 X55
X62 X74
Figure 2. MC14051B Functional Diagram
16 V
DD
INH6
A11 B10
C9
X012
X113 Y02
Y11 Z05
Z13
LEVEL
CONVERTER
8VSS7V
BINARY TO 1−OF−2
DECODER WITH
INHIBIT
EE
3X
14X
15Y
4Z
Figure 3. MC14052B Functional Diagram Figure 4. MC14053B Functional Diagram
http://onsemi.com
5
CONTROL
SECTION
OF IC
SOURCE
ON SWITCH
V
MC14051B, MC14052B, MC14053B
TEST CIRCUITS
GENERATOR
LOAD
PULSE
A B C
INH
V
out
R
C
L
L
VDDVEEVEEV
Figure 5. V Across Switch Figure 6. Propagation Delay Times,
Control and Inhibit to Output
A, B, and C inputs used to turn ON or OFF the switch under test.
A B C
V
VDD − V
2
SS
EE
INH
R
L
V
in
CL = 50 pF
Figure 7. Bandwidth and Off−Channel
Feedthrough Attenuation
V
out
VDD − V
EE
2
(Adjacent Channels Used For Setup)
A B
ON
C
OFF
INH
V
in
Figure 8. Channel Separation
DD
R
L
V
out
R
CL = 50 pF
L
A B
C
INH
R
L
R1
V
out
CL = 50 pF
Figure 9. Crosstalk, Control Input to
Common O/I
NOTE: See also Figures 7 and 8 in the MC14016B data sheet.
http://onsemi.com
OFF CHANNEL UNDER TEST
V
DD
V
CONTROL
SECTION
OF IC
OTHER CHANNEL(S)
COMMON
EE
V
EE
V
DD
V
EE
V
DD
Figure 10. Off Channel Leakage
6
350
10 k
VEE = V
MC14051B, MC14052B, MC14053B
V
DD
V
DD
SS
Figure 11. Channel Resistance (RON) Test Circuit
TYPICAL RESISTANCE CHARACTERISTICS
KEITHLEY 160
DIGITAL
MULTIMETER
1 k
RANGE
350
X−Y
PLOTTER
300
250
200
150
100
, ON" RESISTANCE (OHMS)
ON
R
50
0
−8.0−10 −6.0 −4.0 −2.0 0 0.2 4.0 6.0 8.0 10
700
600
500
400
300
200
, ON" RESISTANCE (OHMS)
ON
R
100
V
, INPUT VOLTAGE (VOLTS)
in
Figure 12. V
300
250
200
T
= 125°C
A
25°C
−55 °C
= 7.5 V, VEE = − 7.5 V Figure 13. VDD = 5.0 V, VEE = − 5.0 V
DD
150
100
, ON" RESISTANCE (OHMS)
ON
R
50
0
−8.0−10 −6.0 −4.0 −2.0 0 0.2 4.0 6.0 8.0 10
V
, INPUT VOLTAGE (VOLTS)
in
350
T
= 25°C
300
250
A
VDD = 2.5 V
200
150
T
= 125°C
A
25°C
−55 °C
100
, ON" RESISTANCE (OHMS)
ON
R
50
5.0 V
T
= 125°C
A
25°C
−55 °C
7.5 V
0
−8.0−10 −6.0 −4.0 −2.0 0 0.2 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (VOLTS)
Figure 14. VDD = 2.5 V, VEE = − 2.5 V
0
http://onsemi.com
7
−8.0−10 −6.0 −4.0 −2.0 0 0.2 4.0 6.0 8.0 10
V
, INPUT VOLTAGE (VOLTS)
in
Figure 15. Comparison at 25°C, VDD = − V
EE
MC14051B, MC14052B, MC14053B
Î
Î
Î
Î
ÎÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
APPLICATIONS INFORMATION
Figure A illustrates use of the on−chip level converter detailed in Figures 2, 3, and 4. The 0−to−5 V Digital Control signal is used to directly control a 9 V
The digital control logic levels are determined by V and VSS. The VDD voltage is the logic high voltage; the V
analog signal.
p−p
DD
SS
voltage is logic low. For the example, VDD = + 5 V = logic high at the control inputs; VSS = GND = 0 V = logic low.
The maximum analog signal level is determined by V
DD
and VEE. The VDD voltage determines the maximum recommended peak above VSS. The VEE voltage determines the maximum swing below VSS. For the example, VDD − VSS = 5 V maximum swing above VSS; VSS − VEE = 5 V maximum swing below VSS. The example shows a ± 4.5 V signal which allows a 1/2 volt margin at each
+5 V −5 V
+5 V
EXTERNAL
CMOS
DIGITAL
CIRCUITRY
9 V
p−p
ANALOG SIGNAL
0−TO−5 V DIGITAL
CONTROL SIGNALS
V
DD
SWITCH
I/O
INHIBIT,
A, B, C
V
SS
MC14051B MC14052B MC14053B
peak. If voltage transients above V
and/or below VEE are
DD
anticipated on the analog channels, external diodes (Dx) are recommended as shown in Figure B. These diodes should be small signal types able to absorb the maximum anticipated current surges during clipping.
The absolute maximum potential difference between
V
and VEE is 18.0 V. Most parameters are specified up t o
DD
15 V which is the recommended maximum difference between V
and VEE.
DD
Balanced supplies are not required. However, VSS must be greater than or equal to VEE. For example, VDD = + 10 V, VSS = + 5 V, and VEE – 3 V is acceptable. See the T able below.
V
EE
COMMON
O/I
9 V
p−p
ANALOG SIGNAL
+4.5 V
GND
4.5 V
Figure A. Application Example
V
DD
D
X
ANALOG
I/O
D
X
V
EE
Figure B. External Germanium or Schottky Clipping Diodes
POSSIBLE SUPPLY CONNECTIONS
ÎÎ
V
In Volts
ÎÎ
+ 8 + 5 + 5 + 5
+ 10
DD
ÎÎÎ
V
SS
In Volts
ÎÎÎ
0 0 0 0
+ 5
ÎÎ
V
EE
In Volts
ÎÎ
– 8
– 12
0 – 5 – 5
COMMON
O/I
Control Inputs
ООООО
Logic High/Logic Low
In Volts
ООООО
+ 8/0 + 5/0 + 5/0 + 5/0
+ 10/ + 5
V
DD
D
X
D
X
V
EE
ООООООО
Maximum Analog Signal Range
ООООООО
In Volts
+ 8 to – 8 = 16 V
+ 5 to – 12 = 17 V
+ 5 to 0 = 5 V
+ 5 to – 5 = 10 V
+ 10 to – 5 = 15 V
p–p
p–p
p–p
p–p
p–p
http://onsemi.com
8
MC14051B, MC14052B, MC14053B
ORDERING INFORMATION
Device Package Shipping
MC14051BCP PDIP−16 500 Units / Rail MC14051BCPG PDIP−16
(Pb−Free) MC14051BD SOIC−16 48 Units / Rail MC14051BDG SOIC−16
(Pb−Free) MC14051BDR2 SOIC−16 2500 / Tape & Reel MC14051BDR2G SOIC−16
(Pb−Free) MC14051BDTR2 TSSOP−16* 2500 / Tape & Reel MC14051BF SOEIAJ−16 50 Units / Rail MC14051BFEL SOEIAJ−16 2000 / Tape & Reel MC14051BFELG SOEIAJ−16
(Pb−Free)
MC14052BCP PDIP−16 500 Units / Rail MC1405BCPG PDIP−16
(Pb−Free) MC14052BD SOIC−16 48 Units / Rail MC14052BDG SOIC−16
(Pb−Free) MC14052BDR2 SOIC−16 2500 / Tape & Reel MC14052BDR2G SOIC−16
(Pb−Free) MC14052BDTR2 TSSOP−16* 2500 / Tape & Reel MC14052BF SOEIAJ−16 50 Units / Rail MC14052BFEL SOEIAJ−16 2000 / Tape & Reel MC14052BFELG SOEIAJ−16
(Pb−Free)
500 Units / Rail
48 Units / Rail
2500 / Tape & Reel
2000 / Tape & Reel
500 Units / Rail
48 Units / Rail
2500 / Tape & Reel
2000 / Tape & Reel
MC14053BCP PDIP−16 500 Units / Rail MC14053BCPG PDIP−16
(Pb−Free) MC14053BD SOIC−16 48 Units / Rail MC14053BDG SOIC−16
(Pb−Free) MC14053BDR2 SOIC−16 2500 / Tape & Reel MC14053BDR2G SOIC−16
(Pb−Free) MC14053BDTR2 TSSOP−16* 2500 / Tape & Reel MC14053BF SOEIAJ−16 50 Units / Rail MC14053BFG SOEIAJ−16
(Pb−Free) MC14053BFEL SOEIAJ−16 2000 / Tape & Reel MC14053BFELG SOEIAJ−16
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
500 Units / Rail
48 Units / Rail
2500 / Tape & Reel
50 Units / Rail
2000 / Tape & Reel
http://onsemi.com
9
MC14051B, MC14052B, MC14053B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE T
−A−
916
B
18
F
C
S
−T−
H
G
D
16 PL
0.25 (0.010) T
K
M
A
L
SEATING PLANE
J
M
SOIC−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77
M
G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
−T−
−A−
16 9
−B−
18
G
K
C
SEATING
PLANE
D
16 PL
0.25 (0.010) A
M
S
B
T
S
8 PLP
0.25 (0.010) B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
M
S
X 45
R
F
J
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7

P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
INCHESMILLIMETERS
http://onsemi.com
10
MC14051B, MC14052B, MC14053B
ÉÉ
PACKAGE DIMENSIONS
TSSOP−16 DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F−01
ISSUE A
0.10 (0.004)
−T−
SEATING PLANE
L
U0.15 (0.006) T
PIN 1 IDENT.
U0.15 (0.006) T
D
S
2X L/2
S
16X REFK
0.10 (0.004) V
M
S
U
T
S
K
K1
16
9
J1
B
−U−
1
8
J
N
A
SECTION N−N
0.25 (0.010)
M
−V− N
F
DETAIL E
C
DETAIL E
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−.
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
−W−
L 6.40 BSC 0.252 BSC M 0 8 0 8

INCHESMILLIMETERS
G
http://onsemi.com
11
16 9
1
Z
D
e
b
0.13 (0.005)
M
8
MC14051B, MC14052B, MC14053B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966−01
ISSUE O
L
E
Q
1
H
E
E
A
A
1
0.10 (0.004)
VIEW P
M
L
DETAIL P
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MIN MAX MIN MAX
−−− 2.05 −−− 0.081
A A
0.05 0.20 0.002 0.008
1
0.35 0.50 0.014 0.020
b
0.18 0.27 0.007 0.011
c
9.90 10.50 0.390 0.413
D
5.10 5.45 0.201 0.215
E
1.27 BSC 0.050 BSC
e
H
7.40 8.20 0.291 0.323
E
0.50 0.85 0.020 0.033
L L
1.10 1.50 0.043 0.059
E
0
M
Q
0.70 0.90 0.028 0.035
1
−−− 0.78 −−− 0.031
Z
INCHES
10
10
0
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your local Sales Representative.
MC14051B/D
12
Loading...