MC10H211
Dual 3−Input 3−Output NOR
Gate
Description
The MC10H211 is designed to drive up to six transmission lines
simultaneously. The multiple outputs of this device also allow the wire
ORing of several levels of gating for minimization of gate and package
count.
The ability to control three parallel lines with minimum propagation
delay from a single point makes the MC10H211 particularly useful in
clock distribution applications where minimum clock skew is desired.
Features
• Propagation Delay, 1.0 ns Typical
• Power Dissipation, 160 mW Typical
• Improved Noise Margin 150 mV
(Over Operating Voltage and Temperature Range)
• Voltage Compensated
• MECL 10K™ Compatible
• Pb−Free Packages are Available*
2
5
6
7
9
10
11
V
= PINS 1, 15
CC1
V
= PIN 16
CC2
VEE = PIN 8
Figure 1. Logic Diagram
3
4
12
13
14
CDIP−16
L SUFFIX
CASE 620A
16
1
PDIP−16
P SUFFIX
CASE 648
SOEIAJ−16
CASE 966
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MARKING DIAGRAMS*
16
MC10H211L
AWLYYWW
1
16
MC10H211P
AWLYYWWG
1
10H211
ALYWG
120
V
CC1
A
OUT
A
OUT
A
OUT
A
IN
A
IN
A
IN
V
EE
For PLCC pin assignment, see the Pin Conversion Tables on page 18
Pin assignment is for Dual−in−Line Package.
of the ON Semiconductor MECL Data Book (DL122/D).
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
V
CC2
V
CC1
B
OUT
B
OUT
B
OUT
B
IN
B
IN
B
9
IN
Figure 2. Dip Pin Assignment
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 9
1 Publication Order Number:
20
1
PLLC−20
FN SUFFIX
CASE 775
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G= Pb−Free Package
10H211G
AWLYYWW
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
MC10H211/D
MC10H211
Table 1. MAXIMUM RATINGS
Symbol Characteristic Rating Unit
V
EE
V
I
I
out
T
A
T
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Power Supply (VCC = 0) −8.0 to 0 Vdc
Input Voltage (VCC = 0) 0 to V
Output Current − Continuous
− Surge
50
100
EE
Vdc
mA
Operating Temperature Range 0 to +75 °C
Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
Table 2. ELECTRICAL CHARACTERISTICS (V
= −5.2 V ±5%) (See Note 1)
EE
0° 25° 75°
Symbol Characteristic Min Max Min Max Min Max Unit
I
E
I
inH
I
inL
V
OH
V
OL
V
IH
V
IL
Power Supply Current − 42 − 38 − 42 mA
Input Current High − 720 − 450 − 450
Input Current Low 0.5 − 0.5 − 0.3 −
mA
mA
High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc
Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc
High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc
Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50 W resistor to −2.0 V. Note: If crosstalk is present, double bypass capacitor to 0.2 mF.
Table 3. AC CHARACTERISTICS
0° 25° 75°
Symbol Characteristic Min Max Min Max Min Max Unit
t
pd
t
r
t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Propagation Delay 0.7 2.0 0.7 2.0 0.7 2.0 ns
Rise Time 0.9 2.0 0.9 2.2 0.9 2.4 ns
Fall Time 0.9 2.0 0.9 2.2 0.9 2.4 ns
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2
MC10H211
ORDERING INFORMATION
Device Package Shipping
MC10H211FN PLLC−20 46 Units / Rail
MC10H211FNG PLLC−20
(Pb−Free)
MC10H211FNR2 PLLC−20 500 / Tape & Reel
MC10H211FNR2G PLLC−20
(Pb−Free)
MC10H211L CDIP−16 25 Unit / Rail
MC10H211M SOEIAJ−16 50 Unit / Rail
MC10H211MG SOEIAJ−16
(Pb−Free)
MC10H211MEL SOEIAJ−16 2000 / Tape & Reel
MC10H211MELG SOEIAJ−16
(Pb−Free)
MC10H211P PDIP−16 25 Unit / Rail
MC10H211PG PDIP−16
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
46 Units / Rail
500 / Tape & Reel
50 Unit / Rail
2000 / Tape & Reel
25 Unit / Rail
†
Resource Reference of Application Notes
AN1405/D − ECL Clock Distribution Techniques
AN1406/D − Designing with PECL (ECL at +5.0 V)
AN1503/D −
AN1504/D − Metastability and the ECLinPS Family
AN1568/D − Interfacing Between LVDS and ECL
AN1672/D − The ECL Translator Guide
AND8001/D − Odd Number Counters Design
AND8002/D − Marking and Date Codes
AND8020/D − Termination of ECL Logic Devices
AND8066/D − Interfacing with ECLinPS
AND8090/D − AC Characteristics of ECL Devices
ECLinPSt I/O SPiCE Modeling Kit
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3
MC10H211
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
−L−
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
−N−
L−M
S
Y BRK
−M−
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
−T−
VIEW S
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L−M
T
M
S
S
L−M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L−M
T
S
VIEW D−D
M
M
S
L−M
T
L−M
T
S
S
S
0.007 (0.180) N
H
M
S
L−M
T
S
K1
K
0.007 (0.180) N
F
M
S
L−M
T
S
VIEW S
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 −−− 0.51 −−−
K 0.025 −−− 0.64 −−−
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y −−− 0.020 −−− 0.50
Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
MILLIMETERSINCHES
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4
16 9
1
Z
D
e
b
0.13 (0.005)
M
B
16
B
1
C
8
E
F
H
E
E
A
A
1
0.10 (0.004)
A
MC10H211
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
L
E
M
_
L
DETAIL P
VIEW P
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
A
9
L
8
Q
1
c
16X J
0.25 (0.010) T
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MIN MAX MIN MAX
−−− 2.05 −−− 0.081
A
A
0.05 0.20 0.002 0.008
1
0.35 0.50 0.014 0.020
b
0.10 0.20 0.007 0.011
c
9.90 10.50 0.390 0.413
D
5.10 5.45 0.201 0.215
E
1.27 BSC 0.050 BSC
e
H
7.40 8.20 0.291 0.323
E
0.50 0.85 0.020 0.033
L
L
1.10 1.50 0.043 0.059
E
M
Q
1
Z
M
B
10
0
_
0.70 0.90 0.028 0.035
−−− 0.78 −−− 0.031
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C −−− 0.200 −−− 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
INCHES
10
0
_
_
_
MILLIMETERSINCHES
____
K
N
G
0.25 (0.010) T
M
16X D
A
T
SEATING
PLANE
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5
MC10H211
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE T
−A−
916
B
18
F
C
S
−T−
H
G
D
16 PL
0.25 (0.010) T
K
M
A
SEATING
PLANE
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L
J
M
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
____
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MC10H211/D
6
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