ON Semiconductor MC10H211 Technical data

MC10H211

Dual 3−Input 3−Output NOR Gate

Description

The MC10H211 is designed to drive up to six transmission lines simultaneously. The multiple outputs of this device also allow the wire ORing of several levels of gating for minimization of gate and package count.

The ability to control three parallel lines with minimum propagation delay from a single point makes the MC10H211 particularly useful in clock distribution applications where minimum clock skew is desired.

Features

• Propagation Delay, 1.0 ns Typical

• Power Dissipation, 160 mW Typical

• Improved Noise Margin 150 mV

(Over Operating Voltage and Temperature Range)

• Voltage Compensated

• MECL 10K™ Compatible

• Pb−Free Packages are Available*

5 6 7

9 10 11

= PINS 1, 15

CC1

= PIN 16

CC2

VEE = PIN 8

Figure 1. Logic Diagram

3 4

13 14

CDIP−16

L SUFFIX

CASE 620A

PDIP−16

P SUFFIX

CASE 648

SOEIAJ−16

CASE 966

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MARKING DIAGRAMS*

MC10H211L

AWLYYWW

MC10H211P

AWLYYWWG

10H211 ALYWG

120

CC1

OUT

For PLCC pin assignment, see the Pin Conversion Tables on page 18

Pin assignment is for Dual−in−Line Package.

of the ON Semiconductor MECL Data Book (DL122/D).

CC2

CC1

OUT

Figure 2. Dip Pin Assignment

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

November, 2006 − Rev. 9

1 Publication Order Number:

PLLC−20

FN SUFFIX

CASE 775

A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G= Pb−Free Package

10H211G

AWLYYWW

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.

MC10H211/D

MC10H211

Table 1. MAXIMUM RATINGS

Symbol Characteristic Rating Unit

out

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

Power Supply (VCC = 0) −8.0 to 0 Vdc

Input Voltage (VCC = 0) 0 to V

Output Current − Continuous

− Surge

100

Vdc

Operating Temperature Range 0 to +75 °C

Storage Temperature Range − Plastic

− Ceramic

−55 to +150

−55 to +165

°C °C

Table 2. ELECTRICAL CHARACTERISTICS (V

= −5.2 V ±5%) (See Note 1)

0° 25° 75°

Symbol Characteristic Min Max Min Max Min Max Unit

inH

inL

Power Supply Current − 42 − 38 − 42 mA

Input Current High − 720 − 450 − 450

Input Current Low 0.5 − 0.5 − 0.3 −

High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc

Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc

High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc

Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc

1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. Note: If crosstalk is present, double bypass capacitor to 0.2 mF.

Table 3. AC CHARACTERISTICS

0° 25° 75°

Symbol Characteristic Min Max Min Max Min Max Unit

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.

Propagation Delay 0.7 2.0 0.7 2.0 0.7 2.0 ns

Rise Time 0.9 2.0 0.9 2.2 0.9 2.4 ns

Fall Time 0.9 2.0 0.9 2.2 0.9 2.4 ns

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