ON Semiconductor MC10EP08, MC100EP08 User Manual

3.3 V/5 V ECL 2-Input
Differential XOR/XNOR

MC10EP08, MC100EP08

Description

The MC10/100EP08 is a differential XOR/XNOR gate. The EP08 is

ideal for applications requiring the fastest AC performance available.

The 100 Series contains temperature compensation.

Features

• 250 ps Typical Propagation Delay

• Maximum Frequency = > 3 GHz Typical

• PECL Mode Operating Range:

= 3.0 V to 5.5 V with V

V

CC

• NECL Mode Operating Range:

= 0 V with V

V

CC

= −3.0 V to −5.5 V

EE

• Open Input Default State

• Safety Clamp on Inputs

• Q Output Will Default LOW with Inputs Open or at V

• These Devices are Pb-Free, Halogen Free and are RoHS Compliant

EE

= 0 V

EE

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8

1

SOIC−8 NB

D SUFFIX

CASE 751−07

8

1

TSSOP−8

DT SUFFIX

CASE 948R−02

MARKING DIAGRAMS*

8

HEP08

ALYW

G

1

8

KEP01

ALYW

G

1

SOIC−8 NB TSSOP−8

8

HP08

ALYWG

G

1

8

KP082

ALYWG

G

1

A = Assembly Location

L = Wafer Lot
H = MC10
K = MC100

(Note: Microdot may be in either location)

*For additional marking information, refer to

Application Note AND8002/D

Y = Year
W = Work Week
G = Pb-Free Package

.

ORDERING INFORMATION

Device

MC10EP08DG

MC10EP08DR2G

MC10EP08DTG

MC100EP08DG

MC100EP08DTG

MC100EP08DTR2G

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifica­tions Brochure, BRD8011/D

Package

SOIC−8 NB

(Pb-Free)

SOIC−8 NB

(Pb-Free)

TSSOP−8

(Pb-Free)

SOIC−8 NB

(Pb-Free)

TSSOP−8

(Pb-Free)

TSSOP−8
(Pb-Free)

.

Shipping

98 Units / Tube

2500 /

Tape & Reel

100 Units / Tube

98 Units / Tube

100 Units / Tube

2500 /

Tape & Reel

†

© Semiconductor Components Industries, LLC, 2016

April, 2021 − Rev. 8

1 Publication Order Number:

MC10EP08/D

MC10EP08, MC100EP08

Table 1. PIN DESCRIPTION

D0

D0

1

2

78Q

V

CC

PIN

D0, D1, D0

Q, Q ECL Data Outputs

V

CC

V

EE

, D1

FUNCTION

ECL Data Inputs

Positive Supply

Negative Supply

Table 2. TRUTH TABLE

3

D1

45

QD1

6

V

EE

D0* D1* D0

LLHHLH
L HHL HL
H LLH HL
H HLL LH

** Pins will default to 0.666% of V
* Pins will default LOW when left open.

** D1** Q Q

when left open.

CC

Figure 1. 8-Lead Pinout (Top View) and Logic Diagram

Table 3. ATTRIBUTES

Characteristics Value

Internal Input Pulldown Resistor

Internal Input Pullup Resistor

ESD Protection

Human Body Model
Machine Model
Charged Device Model

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb-Free Pkg

SOIC−8 NB
TSSOP−8

Flammability Rating

Oxygen Index: 28 to 34

Transistor Count 135 Devices

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

75 kW

37.5 kW

> 4 kV

> 200 V

> 2 kV

Level 1
Level 3

UL 94 V−0 @ 0.125 in

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2

MC10EP08, MC100EP08

Table 4. MAXIMUM RATINGS

Symbol Parameter Condition 1 Condition 2 Rating Unit

V

V

T

q

q

q

q

T

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.

PECL Mode Power Supply VEE = 0 V 6 V

CC

NECL Mode Power Supply VCC = 0 V −6 V

EE

V

PECL Mode Input Voltage

I

NECL Mode Input Voltage

I

Output Current Continuous

out

T

Operating Temperature Range −40 to +85 °C

A

Storage Temperature Range −65 to +150 °C

stg

Thermal Resistance (Junction-to-Ambient) 0 lfpm

JA

Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 °C/W

JC

Thermal Resistance (Junction-to-Ambient) 0 lfpm

JA

Thermal Resistance (Junction-to-Case) Standard Board TSSOP−8 41 to 44 °C/W

JC

Wave Solder (Pb-Free) < 2 to 3 sec @ 260°C 265 °C

sol

VEE = 0 V
V

= 0 V

CC

Surge

500 lfpm

500 lfpm

VI ≤ V

CC

VI ≥ V

EE

SOIC−8 NB
SOIC−8 NB

TSSOP−8
TSSOP−8

6

−6

50

100

190
130

185
140

V

mA

°C/W

°C/W

Table 5. 10EP DC CHARACTERISTICS, PECL (V

= 3.3 V, VEE = 0 V (Note 1))

CC

−40°C 25°C 85°C

Symbol

I

EE

V

OH

V

OL

V

IH

V

IL

V

IHCMR

I

IH

I

IL

Characteristic

Power Supply Current 20 28 36 20 30 38 20 32 38 mA

Output HIGH Voltage (Note 2) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV

Output LOW Voltage (Note 2) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV

Input HIGH Voltage (Single-Ended) 2090 2415 2155 2480 2215 2540 mV

Input LOW Voltage (Single-Ended) 1365 1690 1430 1755 1490 1815 mV

Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 3)

Input HIGH Current 150 150 150

Input LOW Current

D
D

Min Ty p Max Min Typ Max Min Typ Max

2.0 3.3 2.0 3.3 2.0 3.3 V

0.5

−150

0.5

−150

0.5

−150

Unit

mA

mA

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm.

1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.

2. All loading with 50 W to V

3. V

min varies 1:1 with VEE, V

IHCMR

input signal.

CC

− 2.0 V.

IHCMR

max varies 1:1 with VCC. The V

range is referenced to the most positive side of the differential

IHCMR

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3

MC10EP08, MC100EP08

Table 6. 10EP DC CHARACTERISTICS, PECL (V

= 5.0 V, VEE = 0 V (Note 1))

CC

−40°C 25°C 85°C

Symbol

I

EE

V

OH

V

OL

V

IH

V

IL

V

IHCMR

I

IH

I

IL

Characteristic

Power Supply Current 20 28 36 20 30 38 20 32 38 mA

Output HIGH Voltage (Note 2) 3865 3940 4115 3930 4055 4180 3990 4115 4240 mV

Output LOW Voltage (Note 2) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV

Input HIGH Voltage (Single-Ended) 3790 4115 3855 4180 3915 4240 mV

Input LOW Voltage (Single-Ended) 3065 3390 3130 3455 3190 3515 mV

Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 3)

Input HIGH Current 150 150 150

Input LOW Current

D
D

Min Ty p Max Min Typ Max Min Ty p Max

2.0 5.0 2.0 5.0 2.0 5.0 V

0.5

−150

0.5

−150

0.5

−150

Unit

mA

mA

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm.

1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.

2. All loading with 50 W to V

3. V

min varies 1:1 with VEE, V

IHCMR

input signal.

Table 7. 10EP DC CHARACTERISTICS, NECL (V

CC

− 2.0 V.

IHCMR

max varies 1:1 with VCC. The V

= 0 V; V

CC

EE

range is referenced to the most positive side of the differential

IHCMR

= −5.5 V to −3.0 V (Note 1))

−40°C 25°C 85°C

Symbol

I

EE

Characteristic

Power Supply Current 20 28 36 20 30 38 20 32 38 mA

Min Ty p Max Min Ty p Max Min Typ Max

Unit

VOH Output HIGH Voltage (Note 2) −1135 −1010 −885 −1070 −945 −820 −1010 −885 −760 mV

V

V

V

IHCMR

Output LOW Voltage (Note 2) −1935 −1810 −1685 −1870 −1745 −1620 −1810 −1685 −1560 mV

OL

Input HIGH Voltage (Single-Ended) −1210 −885 −1145 −820 −1085 −760 mV

IH

V

Input LOW Voltage (Single-Ended) −1935 −1610 −1870 −1545 −1810 −1485 mV

IL

Input HIGH Voltage Common Mode
Range (Differential Configuration)

V

+ 2.0 0.0 V

EE

+ 2.0 0.0 V

EE

+ 2.0 0.0 V

EE

(Note 3)

I

Input HIGH Current 150 150 150

IH

I

Input LOW Current

IL

D
D

0.5

−150

0.5

−150

0.5

−150

mA

mA

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm.

1. Input and output parameters vary 1:1 with V

2. All loading with 50 W to V

3. V

min varies 1:1 with VEE, V

IHCMR

input signal.

CC

− 2.0 V.

IHCMR

.

CC

max varies 1:1 with VCC. The V

range is referenced to the most positive side of the differential

IHCMR

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