ON Semiconductor MBR140SFT1 Technical data

MBR140SFT1
Surface Mount Schottky Power Rectifier
Plastic SOD−123 Package
Guardring for Stress Protection
Low Forward Voltage
125°C Operating Junction Temperature
Epoxy Meets UL94, V0 at 1/8
Package Designed for Optimal Automated Board Assembly
ESD Ratings: Machine Model, C
ESD Ratings: Human Body Model, 3B
Mechanical Characteristics
Reel Options: MBR140SFT1 = 3,000 per 7″ reel/8 mm tape
Reel Options: MBR140SFT3 = 10,000 per 13 reel/8 mm tape
Device Marking: L4F
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES 40 VOLTS
SOD−123FL
CASE 498
PLASTIC
DEVICE MARKING
D
L4F
L4F = Specific Device Code D = Date Code
ORDERING INFORMATION
Device Package Shipping
MBR140SFT1 SOD−123FL MBR140SFT3 SOD−123FL 10,000/Tape & Reel
3000/Tape & Reel
Semiconductor Components Industries, LLC, 2003
September, 2003 − Rev. 2
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
1 Publication Order Number:
MBR140SFT1/D
MBR140SFT1
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 112°C) I Peak Repetitive Forward Current
(At Rated V
, Square Wave, 100 kHz, TL = 95°C)
R
Non−Repetitive Peak Surge Current
(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz) Storage Temperature T Operating Junction Temperature T Voltage Rate of Change (Rated VR, TJ = 25°C) dv/dt 10,000 V/s
THERMAL CHARACTERISTICS
Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Lead (Note 2) Thermal Resistance − Junction−to−Ambient (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm
2
).
V
V
I
I
RRM
RWM
V
R
O
FRM
FSM
stg
J
R
tjl
R
tjl
R
tja
R
tja
40 V
1.0 A
2.0 A
30 A
−55 to 150 °C
−55 to 125 °C
26 21
325
82
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3), See Figure 2 (IF = 0.1 A)
(I
= 1.0 A)
F
= 3.0 A)
(I
F
Maximum Instantaneous Reverse Current (Note 3), See Figure 4 (VR = 40 V)
(V
= 20 V)
R
3. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤2%.
V
F
I
R
TJ = 25°C TJ = 85°C
0.36
0.55
0.85
0.30
0.515
0.88
TJ = 25°C TJ = 85°C
0.5
0.15
25 18
V
mA
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2
10
MBR140SFT1
100
10
1.0
TJ = 125°C
TJ = 85°C
TJ = −40°C
0.1
0.1 v
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
, INSTANTANEOUS FORWARD CURRENT (AMPS) i
F
F
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
100E−3
10E−3
1.0E−3
100E−6
10E−6
, REVERSE CURRENT (AMPS)
R
I
1.0E−6 10 20 30
, REVERSE VOLTAGE (VOLTS)
V
R
TJ = 25°C
TJ = 125°C
TJ = 85°C
TJ = 25°C
0.70.3 0.5 0.9
1.0 TJ = 125°C
TJ = 85°C
0.1
0.1 , MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
V
F
, INSTANTANEOUS FORWARD CURRENT (AMPS)
F
I
1.0E+0
100E−3
10E−3
1.0E−3
100E−6
, MAXIMUM REVERSE CURRENT (AMPS)
10E−6
R
I
400
10 20 30
VR, REVERSE VOLTAGE (VOLTS)
TJ = 25°C
0.70.3 0.5 0.9
(VOLTS)
TJ = 85°C
TJ = 25°C
400
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
1.8
1.6
1.4 SQUARE
1.2
1
0.8
0.6
0.4
Ipk/Io = 10
Ipk/Io = 20
0.2
0
, AVERAGE FORWARD CURRENT (AMPS)
O
I
3525
T
, LEAD TEMPERATURE (°C)
L
Figure 5. Current Derating
dc
freq = 20 kHz
WAVE
Ipk/Io = Ipk/Io = 5
55 115
7545 65 85 125
95 105
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1.0
0.9
0.8
0.7
0.6
Ipk/Io = 10
Ipk/Io = 20
Ipk/Io = 5
Ipk/Io =
SQUARE
WAVE
dc
0.5
0.4
0.3
0.2
0.1
, AVERAGE POWER DISSIPATION (WATTS)
FO
P
0
0.20 IO, AVERAGE FORWARD CURRENT (AMPS)
0.6 1.4
1.00.4 0.8 1.2 1.6
Figure 6. Forward Power Dissipation
3
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