ON Semiconductor MBR120VLSFT1 Technical data

MBR120VLSFT1
l l
Surface Mount Schottky Power Rectifier
Plastic SOD−123 Package
Features
Guardring for Stress Protection
Optimized for Very Low Forward Voltage
125°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Package Designed for Optimal Automated Board Assembly
ESD Ratings: Machine Model, C;
Human Body Model, 3B
Pb−Free Packages are Available
Mechanical Characteristics
Reel Options: MBR120VLSFT1 = 3,000 per 7″ reel/8 mm tape
MBR120VLSFT3 = 10,000 per 13 reel/8 mm tape
Device Marking: L2V
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES 20 VOLTS
SOD−123FL
CASE 498
PLASTIC
MARKING DIAGRAM
M
L2V
G
G
L2V = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping
MBR120VLSFT1 SOD−123FL 3000/Tape & Reel MBR120VLSFT1G SOD−123FL
(Pb−Free) MBR120VLSFT3 SOD−123FL 10000/Tape & Ree MBR120VLSFT3G SOD−123FL
(Pb−Free) †For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
3000/Tape & Reel
10000/Tape & Ree
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 2
1 Publication Order Number:
MBR120VLSFT1/D
MBR120VLSFT1
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage DC Blocking Voltage
Average Rectified Forward Current (Rated VR) TL = 119°C
Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz)
Storage Temperature Range T Operating Junction Temperature T Voltage Rate of Change (Rated VR) dv/dt 1000
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Lead (Note 2) Thermal Resistance − Junction−to−Ambient (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm2).
V
RRM
V
RWM
V
I
F(AV)
I
FSM
R
R R R
stg
20 V
R
1.0 A
45 A
−65 to +125 °C
J
−65 to +125 °C V/ms
tjl
tjl tja tja
26 21
325
82
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic Symbol TJ = 255C TJ = 855C Unit
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 0.1 A) (IF = 0.5 A) (IF = 1.0 A)
Maximum Instantaneous Reverse Current (Note 3)
(Rated DC Voltage)
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2%.
V
F
I
R
0.275
0.315
0.340
0.205
0.270
0.300
V
mA
0.60 15
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