MBR0530, NRVB0530
s
Schottky Power Rectifier,
Surface Mount
0.5 A, 30 V, SOD-123 Package
The MBR0530 uses the Schottky Barrier p
rinciple with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. These state−of−the−art
devices have the following features:
Features
• Guardring for Stress Protection
• Low Forward Voltage
• 125°C Operating Junction Temperature
• Epoxy Meets UL 94, V−0 @ 0.125 in
• Package Designed for Optimal Automated Board Assembly
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics
• Polarity Designator: Cathode Band
• Weight: 11.7 mg (approximately)
• Case: Epoxy, Molded
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
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SCHOTTKY BARRIER
RECTIFIER
0.5 AMPERES
30 VOLTS
SOD−123
CASE 425
STYLE 1
MARKING DIAGRAM
1
B3 = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
B3 MG
G
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. 8
1 Publication Order Number:
ORDERING INFORMATION
Device Package Shipping
MBR0530T1G SOD−123
(Pb−Free)
NRVB0530T1G SOD−123
(Pb−Free)
MBR0530T3G SOD−123
(Pb−Free)
NRVB0530T3G SOD−123
(Pb−Free)
** 8 mm Tape, 7” Reel
*** 8 mm Tape, 13” Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD801 1/D.
3,000 /
Tape & Reel **
3,000 /
Tape & Reel **
10.000 /
Tape & Reel ***
10.000 /
Tape & Reel ***
MBR0530T1/D
†
MBR0530, NRVB0530
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated V
, TL = 100°C)
R
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage Temperature Range T
Operating Junction Temperature T
Voltage Rate of Change (Rated VR) dv/dt 1000
ESD Rating:
Machine Model = C
Human Body Model = 3B
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance − Junction−to−Ambient (Note 1)
Thermal Resistance − Junction−to−Lead
1. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
V
V
I
F(AV)
I
R
R
RRM
RWM
V
R
FSM
stg
J
q
JA
q
JL
30 V
A
0.5
A
5.5
−65 to +150 °C
−65 to +125 °C
V/ms
V
> 400
> 8000
206 °C/W
150 °C/W
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 2)
(i
= 0.1 Amps, TJ = 25°C)
F
(iF = 0.5 Amps, TJ = 25°C)
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, T
= 15 V, TC = 25°C)
(V
R
= 25°C)
C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2%.
4
10
1
= 125°C 75°C 25°C -40°C
T
J
1000
100
0.1
10
, REVERSE CURRENT (A)μ
R
I
1
0.01
, INSTANTANEOUS FORWARD CURRENT (AMPS)
0.15
F
i
0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55
v
, INSTANTANEOUS VOLTAGE (VOLTS)
F
5 101520 30354025
0
v
F
0.375
0.43
I
R
130
20
TJ = 125°C
75°C
25°C
, REVERSE VOLTAGE (VOLTS)
V
R
V
mA
Figure 1. Typical Forward Voltage
Figure 2. Typical Reverse Current
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2
180
MBR0530, NRVB0530
160
140
120
100
80
C, CAPACITANCE (pF)
60
40
20
0
1
0.875
0.75
0.625
0.5
0.375
0.25
0.125
AVERAGE FORWARD CURRENT (AMP)
0
60
TYPICAL CAPACITANCE AT 0 V = 170 pF
5101520 3025
V
, REVERSE VOLTAGE (VOLTS)
R
Figure 3. Typical Capacitance
DC
SQUARE WAVE
= p
= 5
= 10
Ipk/Iav = 20
67 74 81 88 13095
LEAD TEMPERATURE (°C)
123116109102
, AVERAGE POWER DISSIPATION (WATT)
F(AV)
P
0.35
0.315
0.28
0.245
0.21
0.175
0.14
0.105
0.07
0.035
Figure 4. Current Derating (Lead)
TJ = 125°C
= 10
Ipk/Iav = 20
0
0.1 0.2 0.3 0.4 0.80.5
0
I
, AVERAGE FORWARD CURRENT (AMP)
F(AV)
Figure 5. Power Dissipation
= 5
SQUARE WAVE
= p
DC
0.70.6
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3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 5:1
SOD−123
CASE 425−04
ISSUE G
DATE 07 OCT 2009
D
1
H
E
2
E
b
A
A1
q
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS INCHES
DIM MIN NOM MAX
A 0.94 1.17 1.35 0.037
A1 0.00 0.05 0.10 0.000
b 0.51 0.61 0.71 0.020
---
c
E 2.54 2.69 2.84 0.100
H
E
L 0.25
q 00
---
1.60
3.56
3.68 0.140
--- ---
--- ---
°°° °
MIN NOM MAX
0.046
0.002
0.024
--- ---
0.15
0.055D 1.40 1.80
0.063
0.010
0.106
0.145
3.86
10 10
GENERIC
MARKING DIAGRAM*
0.053
0.004
0.028
0.006
0.071
0.112
0.152
--- ---
C
SOLDERING FOOTPRINT*
0.91
0.036
1
XXX = Specific Device Code
M = Date Code
XXXMG
G
G = Pb−Free Package
2.36
0.093
4.19
0.165
SCALE 10:1
mm
ǒ
inches
1.22
0.048
Ǔ
(Note: Microdot may be in either location)
*This information is generic. Please refer to device data
sheet for actual part marking. Pb−Free indicator, “G” or
microdot “ G”, may or may not be present.
STYLE 1:
PIN 1. CATHODE
2. ANODE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
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disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
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© Semiconductor Components Industries, LLC, 2019
98ASB42927B
SOD−123
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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