ON Semiconductor MAC16HCD, MAC16HCM, MAC16HCN Technical data

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MAC16HCD, MAC16HCM, MAC16HCN
Preferred Device
Triacs
Designed primarily for full-wave ac control applications, such as motor controls, heating controls or dimmers; or wherever full–wave, silicon gate–controlled devices are needed.
High Commutating di/dt and High Immunity to dv/dt @ 125°C
Uniform Gate Trigger Currents in Three Quadrants, Q1, Q2, and Q3
Blocking Voltage to 800 Volts
On–State Current Rating of 16 Amperes RMS at 80°C
High Surge Current Capability — 150 Amperes
Industry Standard TO–220AB Package for Ease of Design
Glass Passivated Junctions for Reliability and Uniformity
Device Marking: Logo, Device T ype, e.g., MAC16HCD, Date Code
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TRIACS
16 AMPERES RMS
400 thru 800 VOLTS
MT2
MT1
G
MAXIMUM RATINGS (T
Rating Symbol Value Unit
Peak Repetitive Off–State V oltage
(TJ = –40 to 125°C, Sine Wave, 50 to 60 Hz, Gate Open)
On–State RMS Current
(Full Cycle Sine Wave 50 to 60 Hz; TC = 80°C)
Peak Non-Repetitive Surge Current
(One Full Cycle, 60 Hz, TJ = 125°C)
Circuit Fusing Consideration
(t = 8.33 ms)
Peak Gate Power
(Pulse Width ≤ 1.0 µs, TC = 80°C)
Average Gate Power
(t = 8.3 ms, TC = 80°C)
Operating Junction Temperature Range T
Storage Temperature Range T
(1) V
and V
DRM
voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
RRM
= 25°C unless otherwise noted)
J
(1)
MAC16HCD MAC16HCM MAC16HCN
(2)
for all types can be applied on a continuous basis. Blocking
V
DRM,
V
RRM
400 600 800
I
T(RMS)
I
TSM
I2t 93 A2sec
P
GM
P
G(AV)
J
stg
16 A
150 A
20 Watts
0.5 Watts
–40 to
+125
–40 to
+150
Volts
°C
°C
4
1
2
3
TO–220AB
CASE 221A
STYLE 4
PIN ASSIGNMENT
1 2 3 Gate 4
Main Terminal 1 Main Terminal 2
Main Terminal 2
ORDERING INFORMATION
Device Package Shipping
MAC16HCD TO220AB 50 Units/Rail MAC16HCM TO220AB MAC16HCN TO220AB
50 Units/Rail 50 Units/Rail
Semiconductor Components Industries, LLC, 1999
February , 2000 – Rev. 0
Preferred devices are recommended choices for future use
and best overall value.
1 Publication Order Number:
MAC16HC/D
MAC16HCD, MAC16HCM, MAC16HCN
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance
— Junction to Case — Junction to Ambient
Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 10 Seconds T
ELECTRICAL CHARACTERISTICS (T
Characteristic
OFF CHARACTERISTICS
Peak Repetitive Blocking Current TJ = 25°C
(VD = Rated V
DRM
, V
, Gate Open) TJ = 125°C
RRM
ON CHARACTERISTICS
Peak On–State Voltage Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 Ω)
MT2(+), G(+) MT2(+), G(–)
MT2(–), G(–) Holding Current (VD = 12 V, Gate Open, Initiating Current = "150 mA) I Latch Current (VD = 12 V, IG = 50 mA)
MT2(+), G(+)
MT2(+), G(–)
MT2(–), G(–) Gate Trigger V oltage (Continuous dc) (VD = 12 V, RL = 100 Ω)
MT2(+), G(+)
MT2(+), G(–)
MT2(–), G(–)
(1)
(ITM = "21 A Peak) V
DYNAMIC CHARACTERISTICS
Rate of Change of Commutating Current
(VD = 400 V, ITM = 6A, Commutating dv/dt = 20 V/µs, CL = 10 µF
Gate Open, TJ = 125°C, f = 250 Hz, with Snubber) LL = 40 mH Critical Rate of Rise of Off–State V oltage
(VD = Rated V Repetitive Critical Rate of Rise of On-State Current
IPK = 50 A; PW = 40 µsec; diG/dt = 200 mA/µsec; f = 60 Hz
(1) Pulse Test: Pulse Width 2.0 ms, Duty Cycle 2%.
, Exponential Waveform, Gate Open, TJ = 125°C)
DRM
= 25°C unless otherwise noted; Electricals apply in both directions)
J
Symbol Min Typ Max Unit
I
,
DRM
I
RRM
TM
I
GT
H
I
L
V
GT
(di/dt)c 15 A/ms
dv/dt 750 V/µs
di/dt 10 A/µs
0.5
0.5
0.5
R
θJC
R
θJA
L
— —
1.6 Volts
10 10 10
20 50 mA
— — —
0.80
0.73
0.82
— —
16 18 22
33 36 33
2.2
62.5 260 °C
0.01
2.0
50 50 50
60 80 60
1.5
1.5
1.5
°C/W
mA
mA
mA
Volts
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Symbol Parameter
V
DRM
I
DRM
V
RRM
I
RRM
V
TM
I
H
Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current
Maximum On State Voltage Holding Current
MAC16HCD, MAC16HCM, MAC16HCN
Voltage Current Characteristic of Triacs
(Bidirectional Device)
+ Current
on state
I
at V
RRM
Quadrant Definitions for a Triac
MT2 POSITIVE
(Positive Half Cycle)
+
RRM
Quadrant 3 MainTerminal 2 –
I
H
V
TM
V
I
H
off state
TM
Quadrant 1 MainTerminal 2 +
I
at V
DRM
DRM
+ Voltage
(+) MT2
Quadrant II Quadrant I
IGT – + I
Quadrant III Quadrant IV
All polarities are referenced to MT1. With in–phase signals (using standard AC lines) quadrants I and III are used.
(–) I
GATE
(–) I
GATE
GT
MT1
REF
(–) MT2
GT
MT1
REF
MT2 NEGATIVE
(Negative Half Cycle)
(+) I
GATE
(+) I
GATE
(+) MT2
GT
MT1
REF
(–) MT2
GT
MT1
REF
GT
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