ON Semiconductor MAC12SM, MAC12SN Technical data

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MAC12SM, MAC12SN
Preferred Device
Sensitive Gate Triacs
Silicon Bidirectional Thyristors
Sensitive Gate Allows Triggering by Microcontrollers and other
Logic Circuits
Blocking Voltage to 800 Volts
On-State Current Rating of 12 Amperes RMS at 70°C
High Surge Current Capability - 90 Amperes
Rugged, Economical TO220AB Package
Glass Passivated Junctions for Reliability and Uniformity
Maximum Values of I
High Commutating di/dt - 8.0 A/ms Minimum at 110°C
Immunity to dV/dt - 15 V/sec Minimum at 110°C
Operational in Three Quadrants: Q1, Q2, and Q3
Device Marking: Logo, Device Type, e.g., MAC12SM, Date Code
, VGT and IH Specified for Ease of Design
GT
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TRIACS
12 AMPERES RMS
600 thru 800 VOLTS
MT2
4
MT1
G
MARKING DIAGRAM
MAXIMUM RATINGS (T
Peak Repetitive Off-State Voltage (Note 1)
(T
= -40 to 110°C, Sine Wave,
J
50 to 60 Hz, Gate Open)
On-State RMS Current
(All Conduction Angles; T
Peak Non-Repetitive Surge Current
(One Full Cycle Sine Wave, 60 Hz, T
= 110°C)
J
Circuit Fusing Consideration
(t = 8.33 ms)
Peak Gate Power
(Pulse Width = 1.0 sec, T
Average Gate Power
(t = 8.3 msec, T
Operating Junction Temperature Range T
Storage Temperature Range T
1. (V
and V
DRM
voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
RRM
= 25°C unless otherwise noted)
J
Rating
MAC12SM MAC12SN
= 70°C)
C
= 70°C)
C
= 70°C)
C
for all types can be applied on a continuous basis. Blocking
Symbol Value Unit
V
DRM,
V
RRM
600 800
I
T(RMS)
I
TSM
I2t 33 A2sec
P
GM
P
G(AV)
J
stg
12 A
90 A
16 W
0.35 W
- 40 to 110
- 40 to 150
°C
°C
MAC12xx
ALYWW
V
1
2
3
TO-220AB
CASE 221A
Style 4
xx = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year WW = Work Week
PIN ASSIGNMENT
1 2 3 Gate 4
Main Terminal 1 Main Terminal 2
Main Terminal 2
ORDERING INFORMATION
Device Package Shipping
MAC12SM TO220AB 50 Units/Rail
Semiconductor Components Industries, LLC, 2003
April, 2003 - Rev. 2
MAC12SN TO220AB
Preferred devices are recommended choices for future use and best overall value.
1 Publication Order Number:
50 Units/Rail
MAC12SM/D
MAC12SM, MAC12SN
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance - Junction to Case
- Junction to Ambient
Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 10 Seconds T
R
JC
R
JA
L
2.2
°C/W
62.5 260 °C
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted; Electricals apply in both directions)
J
Characteristic
OFF CHARACTERISTICS
Peak Repetitive Blocking Current
(V
= Rated V
D
DRM
, V
; Gate Open) TJ = 25°C
RRM
ON CHARACTERISTICS
Peak On-State Voltage
(1)
(ITM = ±17 A)
Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 )
MT2(+), G(+) MT2(+), G(-) MT2(-), G(-)
Holding Current
(V
= 12 V, Gate Open, Initiating Current = ±200 mA)
D
Latching Current (VD = 12 V, IG = 5 mA)
MT2(+), G(+) MT2(+), G(-) MT2(-), G(-)
Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 )
MT2(+), G(+) MT2(+), G(-) MT2(-), G(-)
DYNAMIC CHARACTERISTICS
Critical Rate of Change of Commutating Current
(V
= 400 V, ITM = 3.5 A, Commutating dV/dt = 10 V/s, Gate Open,
D
= 110°C, f = 500 Hz, Snubber: Cs = 0.01 f, Rs = 15 )
T
J
Critical Rate of Rise of Off-State Voltage
(V
= 67% V
D
= 110°C)
T
J
, Exponential Waveform, RGK = 1 K,
DRM
Repetitive Critical Rate of Rise of On-State Current
IPK = 50 A; PW = 40 sec; diG/dt = 1 A/sec; Igt = 100 mA; f = 60 Hz
2. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
= 110°C
T
J
Symbol Min Typ Max Unit
I
DRM
I
RRM
V
TM
I
GT
I
H
I
L
V
GT
(di/dt)
,
-
-
-
-
0.01
2.0
- - 1.85 V
-
-
-
1.5
2.5
2.7
5.0
5.0
5.0
- 2.5 10 mA
-
-
-
0.45
0.45
0.45
c
8.0 10 - A/ms
3.0
5.0
3.0
0.68
0.62
0.67
15 20 15
1.5
1.5
1.5
mA
mA
mA
V
dV/dt 15 40 - V/s
di/dt - - 10 A/s
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