ON Semiconductor MAC08BT1, MAC08MT1 Technical data

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MAC08BT1, MAC08MT1

Preferred Device

Sensitive Gate Triacs

Silicon Bidirectional Thyristors

Designed for use in solid state relays, MPU interface, TTL logic and other light industrial or consumer applications. Supplied in surface mount package for use in automated manufacturing.

• Sensitive Gate Trigger Current in Four Trigger Modes

• Blocking Voltage to 600 Volts

• Glass Passivated Surface for Reliability and Uniformity

• Surface Mount Package

• Device Marking: MAC08BT1: AC08B; MAC08MT1: A08M, and

Date Code

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TRIAC

0.8 AMPERE RMS

200 thru 600 VOLTS

MAXIMUM RATINGS (T

Rating

Peak Repetitive Off–State V oltage

(Sine Wave, 50 to 60 Hz, Gate Open,

and V

110°C)

RRM

TJ = 25 to

On–State Current RMS (TC = 80°C)

(Full Sine Wave 50 to 60 Hz)

Peak Non–repetitive Surge Current

(One Full Cycle Sine Wave, 60 Hz, TC = 25°C)

Circuit Fusing Considerations

(Pulse Width = 8.3 ms)

Peak Gate Power

(TC = 80°C, Pulse Width v 1.0 µs)

Average Gate Power

(TC = 80°C, t = 8.3 ms)

Operating Junction Temperature Range T

Storage Temperature Range T

(1) V

DRM

voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.

= 25°C unless otherwise noted)

Symbol Value Unit

(1)

MAC08BT1 MAC08MT1

for all types can be applied on a continuous basis. Blocking

DRM,

RRM

200 600

T(RMS)

TSM

I2t 0.4 A2s

G(AV)

stg

0.8 Amps

8.0 Amps

5.0 Watts

0.1 Watt

–40 to

+110

–40 to

+150

Volts

°C

MT2

SOT–223

CASE 318E

STYLE 11

MT1

PIN ASSIGNMENT

1 2 3 Gate 4

Main Terminal 1 Main Terminal 2

Main Terminal 2

ORDERING INFORMATION

Device Package Shipping

MAC08BT1 SOT223 16mm Tape and Reel

MAC08MT1 SOT223

(1K/Reel)

16mm Tape and Reel

(1K/Reel)

 Semiconductor Components Industries, LLC, 2000

May, 2000 – Rev. 3

Preferred devices are recommended choices for future use

and best overall value.

1 Publication Order Number:

MAC08BT1/D

MAC08BT1, MAC08MT1

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Thermal Resistance, Junction to Ambient

PCB Mounted per Figure 1

Thermal Resistance, Junction to Tab

Measured on MT2 Tab Adjacent to Epoxy

Maximum Device T emperature for Soldering Purposes

(for 10 Seconds Maximum)

ELECTRICAL CHARACTERISTICS (T

Characteristic

OFF CHARACTERISTICS

Peak Repetitive Blocking Current

(VD = Rated V

DRM

, V

; Gate Open) TJ = 25°C

RRM

ON CHARACTERISTICS

Peak On–State Voltage

(IT = "1.1 A Peak)

Gate Trigger Current (Continuous dc) All Quadrants

(VD = 12 Vdc, RL = 100 Ω)

Holding Current (Continuous dc)

(VD = 12 Vdc, Gate Open, Initiating Current = "20 mA)

Gate Trigger V oltage (Continuous dc) All Quadrants

(VD = 12 Vdc, RL = 100 Ω)

(1)

DYNAMIC CHARACTERISTICS

Critical Rate of Rise of Commutation Voltage

(f = 250 Hz, ITM = 1.0 A, Commutating di/dt = 1.5 A/mS On–State Current Duration = 2.0 mS, V Gate Unenergized, TC = 110°C, Gate Source Resistance = 150 Ω, See Figure 10)

Critical Rate–of–Rise of Off State Voltage

(Vpk = Rated V

(1) Pulse Test: Pulse Width ≤ 300 µsec, Duty Cycle ≤ 2%.

, TC= 110°C, Gate Open, Exponential Method)

DRM

= 25°C unless otherwise noted; Electricals apply in both directions)

= 200 V,

DRM

TJ = 110°C

θJA

θJT

Symbol Min Typ Max Unit

DRM

RRM

(dv/dt)

dv/dt 10 — — V/µs

— —

— — 1.9 Volts

— — 10 mA

— — 5.0 mA

— — 2.0 Volts

1.5 — — V/µs

156 °C/W

25 °C/W

260 °C

— —

200

µA µA

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Symbol Parameter

DRM

RRM

Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current

Maximum On State Voltage Holding Current

MAC08BT1, MAC08MT1

Voltage Current Characteristic of Triacs

(Bidirectional Device)

on state

at V

RRM

Quadrant Definitions for a Triac

RRM

Quadrant 3 MainTerminal 2 –

+ Current

off state

Quadrant 1 MainTerminal 2 +

at V

DRM

+ Voltage

MT2 POSITIVE

(Positive Half Cycle)

(+) MT2

Quadrant II Quadrant I

IGT – + I

Quadrant III Quadrant IV

(–) I

GATE

(–) I

GATE

MT1

REF

(–) MT2

MT1

REF

(Negative Half Cycle)

–

MT2 NEGATIVE

(+) I

GATE

(+) I

GATE

(+) MT2

MT1

REF

(–) MT2

MT1

REF

All polarities are referenced to MT1. With in–phase signals (using standard AC lines) quadrants I and III are used.

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0.984

25.0

0.079

2.0

0.079

2.0

0.059

1.5

0.091

2.3

MAC08BT1, MAC08MT1

0.15

3.8

0.091

0.059

1.5

0.244

0.059

1.5

6.2

inches

BOARD MOUNTED VERTICALL Y IN CINCH 8840 EDGE CONNECT OR.

2.3

BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL.

MATERIAL: G10 FIBERGLASS BASE EPOXY

0.096

2.44

0.059

1.5

0.096

2.44

0.472

12.0

0.096

2.44

0.059

1.5

Figure 1. PCB for Thermal Impedance and

Power Testing of SOT-223

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