ON Semiconductor LB11685AV User Manual

LB11685AV

f

Monolithic Digital IC
3‐phase Sensor Less Motor
Driver

Overview

The LB11685AV is a three-phase full-wave current-linear-drive
motor driver IC. It adopts a sensor less control system without the use
of a Hall Effect device. For quieter operation, the LB11685AV
features a current soft switching circuit and be optimal for driving the
cooling fan motors used in refrigerators, etc.

Functions

• Three-phase Full-wave Linear Drive (Hall Sensor-less Method)

• Built-in Current Limiter Circuit

• Built-in Three-phase Output Voltage Control Circuit

• Built-in Motor Lock Protection Circuit

• Motor Lock Protection Detection Output

• FG Output Made by Back EMF

• Built-in Thermal Shut Down Circuit

• Beat Lock Prevention Circuit

Specifications

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SSOP24J

CASE 565AS

MARKING DIAGRAM

XXXXXXXXXX
YMDDD

MAXIMUM RATINGS

Parameter

Maximum Supply
Voltage

Input Applied
Voltage

Maximum Output
Current

Allowable Power
Dissipation

Operating
Temperature

Storage
Temperature

Junction
Temperature

Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.

1. The I

2. Specified board: 76.1 mm × 114.3 mm × 1.6 mm, glass epoxy board.

CAUTION: Absolute maximum ratings represent the value which cannot be

CAUTION: Even when the device is used within the range of absolute

is a peak value of motor-current.

O

exceeded for any length of time.

maximum ratings, as a result of continuous usage under high
temperature, high current, high voltage, or drastic temperature
change, the reliability of the IC may be degraded. Please
contact us for the further details.

(TA = 25°C)

Symbol Conditions Ratings Unit

VCC max 19 V

VIN max −0.3 to VCC + 0.3 V

IO max

(Note 1)

Pd max Mounted on

T

T

Tj max 150

a board (Note 2)

opr

stg

1.2 A

1.05 W

−40 to +85 °C

−55 to +150

°C

°C

XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data

PIN ASSIGNMENT

24 VOUTUOUT 1
23 WOUT(NC) 2
22 (NC)(NC) 3
21 (NC)PGND 4
20 RFMCOM 5

(NC) 6

11

CO

19 V
18 REGSGND 7
17 VOHFG 8
16 FC1RD 9
15 FC2(NC) 10
14 C2V
13 C1CX 12

CC

ORDERING INFORMATION

See detailed ordering and shipping information on page 7 o
this data sheet.

© Semiconductor Components Industries, LLC, 2013

January , 2018 − Rev. 1

1 Publication Order Number:

LB11685AV/D

LB11685AV

RECOMMENDED OPERATING CONDITIONS (T

Symbol

V

CC

Recommended Supply Voltage 12.0 V

Parameter Conditions Ratings Unit

= 25°C)

A

VCC op Operating Supply Voltage 4.5 to 18.0 V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.

ELECTRICAL CHARACTERISTICS (T

Symbol

I

CC

Supply Current FC1 = FC2 = 0 V 5 10 20 mA

Parameter Conditions Min Typ Max Unit

= 25°C unless otherwise noted)

C

VREG Internal Regulate Voltage 3.0 3.3 3.6 V

VOSOUR Output Voltage (Source) IO = 0.8 A (Note 5) 1.3 1.7 V

VOSINK Output Voltage (Sink) IO = 0.8 A (Note 5) 0.5 1.3 V

VOLIM Current Limiter 0.268 0.300 0.332 V

VINCOM MCOM Pin

0 VCC − 2 V

Common-input Voltage Range

ICOM+ MCOM Pin

MCOM = 7 V 30 80

mA

Source Current for Hysteresis

ICOM− MCOM Pin

MCOM = 7 V 30 80

mA

Sink Current for Hysteresis

RTCOM MCOM Pin

RTCOM = ICOM+ / ICOM− 0.6 1.4

Hysteresis Current Ratio

I

VCO

f

min VCO Oscillation Minimum Frequency

VCO

f

max VCO Oscillation Maximum Frequency

VCO

I

CX

DVCX
IC1(2)+ C1 (C2) Charge Current VCO = 2.5 V , C1(2) = 1.3V 12 20 28
IC1(2)− C1 (C2) Discharge Current VCO = 2.5 V , C1(2) = 1.3V 12 20 28

VCO Input Bias Current VCO = 2.3 V 0.2

VCO = 2.1 V , CX = 0.015mF

930 Hz

Design target (Note 4)
VCO = 2.7 V , CX = 0.015mF

8.6 kHz

Design target (Note 4)
CX Charge/Discharge Current VCO = 2.5 V , CX = 1.6V 70 100 140
CX Hysteresis Voltage 0.35 0.55 0.75

mA

mA

mA
mA

RTC1(2) C1 (C2) Charge/Discharge Current Ratio RTC1(2) = IC1(2)+ / IC1(2)− 0.8 1.0 1.2

RTCCHG C1/C2 Charge Current Ratio RTCCHG = IC1+ / IC2+ 0.8 1.0 1.2

RTCDIS C1/C2 Discharge Current Ratio RTCDIS = IC1− / IC2− 0.8 1.0 1.2

VCW1(2) C1 (C2) Cramp Voltage Width 1.0 1.3 1.6 V

VFGL FG Output Low Level Voltage IFG = 3 mA 0.5 V
VRDL RD Output Low Level Voltage IRD = 3mA 0.5 V
TTSD Thermal Shut Down Operating Temperature

(Note 3)

DTTSD

Thermal Shut Down Hysteresis Temperature
(Note 3)

Junction temperature

Design target (Note 4)

Junction temperature

Design target (Note 4)

150 180 °C

15

°C

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.

3. The thermal shut down circuit is built-in for protection from damage of IC. But its operation is out of T
operation.

. Design thermal calculation at normal

opr

4. Design target value and no measurement is made.

5. The I

is a peak value of motor-current.

O

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LB11685AV

1.5

1.0

max (W)

d

P

0.5

Allowable Power Dissipation,

0

−40 −20 0 20 40 60 80 100

Ambient Temperature, T

Figure 1. Pd max − T

Specified circuit board:

114.3 × 76.1 × 1.6 mm
glass epoxy board

1.05

(5C)

A

A

3

0.55

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