FST3125
4-Bit Bus Switch
The ON Semiconductor FST3125 is a quad, high performance
switch. The device is CMOS TTL compatible when operating between
4 and 5.5 Volts. The device exhibits extremely low R
nearly zero propagation delay. The device adds no noise or ground
bounce to the system.
The device consists of four independent 1−bit switches with
separate Output/Enable (OE
OE
is low. If OE is high, the switch is high Z.
) pins. Port A is connected to Port B when
and adds
ON
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MARKING
DIAGRAMS
Features
• R
t 4 W Typical
ON
• Less Than 0.25 ns−Max Delay Through Switch
• Nearly Zero Standby Current
• No Circuit Bounce
• Control Inputs are TTL/CMOS Compatible
• Pin−For−Pin Compatible With QS3125, FST3125, CBT3125
• All Popular Packages: TSSOP−14, SOIC−14
• These are Pb−Free Devices
1
OE
1
2
1A
3
1B
4
OE
2
5
2A
6
2B
GND
7
Figure 1. Pin Assignment for
SOIC and TSSOP
14
13
12
11
10
V
CC
OE
4
4A
4B
OE
3
9
3A
8
3B
14
1
SOIC−14
D SUFFIX
CASE 751A
14
1
TSSOP−14
DT SUFFIX
CASE 948G
A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
14
FST3125G
AWLYWW
1
14
FST
3125
ALYWG
G
1
PIN NAMES
Pin
OE1, OE2, OE3, OE
1A, 2A, 3A, 4A
1B, 2B, 3B, 4B Bus B
NC Not Connected
4
Description
Bus Switch Enables
Bus A
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
June, 2013 − Rev. 0
1 Publication Order Number:
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
FST3125/D
OE
FST3125
1
1
OE
OE
OE
TRUTH TABLE
Inputs Outputs
OE A, B
1A
2A
3A
4A
2
4
2
5
10
3
9
13
4
12
3
6
8
11
Figure 2. Logic Diagram
L A = B
H Z
1B
2B
3B
4B
ORDERING INFORMATION
Device Order Number Package Shipping
FST3125DR2G SOIC−14
(Pb−Free)
FST3125DTR2G TSSOP−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
2500 Units / Tape & Reel
2500 Units / Tape & Reel
†
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2
FST3125
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
I
I
OK
I
I
CC
I
GND
T
STG
T
T
q
MSL Moisture Sensitivity Level 1
F
V
ESD
I
Latchup
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
DC Supply Voltage *0.5 to )7.0 V
CC
DC Input Voltage *0.5 to )7.0 V
I
DC Output Voltage *0.5 to )7.0 V
O
DC Input Diode Current VI t GND *50 mA
IK
DC Output Diode Current VO t GND *50 mA
DC Output Sink Current 128 mA
O
DC Supply Current per Supply Pin $100 mA
DC Ground Current per Ground Pin $100 mA
Storage Temperature Range *65 to )150
Lead Temperature, 1 mm from Case for 10 Seconds 260
L
Junction Temperature Under Bias )150
J
Thermal Resistance (Note 1) SOIC
JA
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
R
TSSOP
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model
Latchup Performance Above VCC and Below GND at 85_C (Note 4)
125
170
u4000
u400
u2000
$100 mA
_C
_C
_C
_C/W
V
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
V
V
T
Dt/DV
5. Unused control inputs may not be left open. All control inputs must be tied to a high− or low−logic input voltage level.
Supply Voltage Operating, Data Retention Only 4.0 5.5 V
CC
Input Voltage (Note ) 0 5.5 V
I
Output Voltage (HIGH or LOW State) 0 5.5 V
O
Operating Free−Air Temperature −55 +125
A
Input Transition Rise or Fall Rate Switch Control Input
Switch I/O
0
0
5
DC
_C
ns/V
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3