ON Semiconductor FPF3381 User Manual

28 V / 5 A Rated OVP with
Low On-resistance and
Integrated TVS

FPF3381

Description

FPF3381UCX is an OVP with integrated ultra−low on−resistance
single channel switch. The device contains an N−MOSFET that can
operate over an input voltage range of 2.8 V to 23 V and can support
a maximum continuous current of 5 A.

When the input voltage exceeds the over−voltage threshold,
the internal FET is turned off immediately to prevent damage
to the protected downstream components.

The device has integrated ±110 V surge protection TVS base
on IEC61000−4−5 standards.

FPF3381 is available in a small 12−bumps WLCSP package
and operate over the free−air temperature range of −40°C to +85°C.

Features

• Over−voltage Protection Up to +28 V

• Integrated TVS: ±110 V for IEC61000−4−5

• Internal Low RDS(on) NMOS Transistors: Typical 15 mW

• Programmable Over−voltage Lockout (OVLO)

♦ Externally Adjustable via OVLO Pin

• Active−low Enable Pin (OVLO) for Device

• Super−fast OVLO Response Time: Typical 40 ns

• Over Temperature Protection (Thermal Shutdown)

• Robust ESD Performance

♦ ±4 kV Human Body Model (HBM)
♦ ±2 kV Charged Device Model (CDM)

• System Level ESD (IEC61000−4−2)

♦ ±10 kV Contact Discharge
♦ ±15 kV Air Gap Discharge

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WLCSP−12

CASE 567WP

MARKING DIAGRAM

3RZZ

YWA

3R = Specific Device Code
ZZ = Assembly Lot Code
Y = Year
W = Work Week
A = Assembly Location

(Note: Microdot may be in either location)

PIN ASSIGNMENT

ENB

OUT

OUT

GND

Typical Applications

• Mobile Phones

• PDAs

• GPS

© Semiconductor Components Industries, LLC, 2021

March, 2021 − Rev. 0

ACOKB

OVLO

ORDERING INFORMATION

See detailed ordering and shipping information on page 2 of
this data sheet.

1 Publication Order Number:

OUT

IN

(Top View)

IN

IN

GND

GND

FPF3381/D

FPF3381

Travel

Adapter

Legacy USB /

USB Type C connector

IN

VBUS

IN

1uF

OUT

FPF3381

R1

OVLO

R2

Figure 1. Application Schematic – Adjustable Option

Discharge

GND

Driver

Gate Drive

HV Battery

Charger

1uF

OUT

1.2 V

OVLO

0.2 V

GND

Control

ENB

ACOKB

Figure 2. Simplified Block Diagram

PIN FUNCTION DESCRIPTION

Pin # Name Description

B3, C2, C3 IN Power Input: Switch Input and Device Supply

A2, A3, B2 OUT Power Output: Switch Output to Load

A1 ENB

B1 ACOKB Power Good Acknowledge Output: Open−drain output to indicate Power Good condition

C1 OVLO OVLO Input: Over Voltage Lockout Adjustment Input

A4, B4, C4 GND Ground

Enable Input: Active Low. 0: Switch enabled. 1: Switch disabled. 1 MW Pull−down resistor integrated.

ORDERING INFORMATION

Device Marking Package Shipping

FPF3381UCX 3R WLCSP−12L 4000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

†

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2

FPF3381

Table 1. MAXIMUM RATINGS

Rating Symbol Value Unit

Input Voltage Range (Note 1) V

Output Voltage Range V

Adjustable Input Range V

Internal FET Continuous Current I

Internal FET Peak Current (pulse width no longer than 100 ms)

Maximum Junction Temperature T

Storage Temperature Range T

ESD Capability, Human Body Model (Note 2) ESD

ESD Capability, Charged Device Model (Note 2) ESD

IEC 61000−4−2 SYSTEM Level ESD

in

out

OVLO

OUT

I

PEAK

J(max)

STG

HBM

CDM

Contact 10

Air Gap 15

Lead Temperature Soldering

Reflow (SMD Styles Only), Pb−Free Versions (Note 3)

T

SLD

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS

, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe

Operating parameters.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
Latch−up Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78

3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

−0.3 to +28 V

−0.3 to (Vin + 0.3) V

−0.3 to +24 V

0 to 6.25 A

7 A

150 °C

−65 to 150 °C

4

2

260 °C

kV

Table 2. THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Characteristics, WLCSP−12 (Note 4)

Thermal Resistance, Junction−to−Air (Note 5)

R

θJA

84.1 °C/W

4. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe

Operating parameters.

5. Values based on 2S2P JEDEC std. PCB.

Table 3. RECOMMENDED OPERATING RANGES

Rating Symbol Min Max Unit

Supply Voltage on VIN V

I/O pins V

Output Current (Note 6) I

IN Capacitor C

OUT Capacitor C

Ambient Temperature T

in

OVLO

out

in

out

A

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.

6. Life time, under maximum current, > 5 years base on Temperature < 85°C and no longer than 12 hours per day.

2.8 25 V

0 5.5 V

0 5 A

0.1

0.1

mF

mF

−40 85 °C

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