ON Semiconductor Fairchild FEBFDD850N10LD_CS001, Fairchild FDD850N10LD User Manual

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User Guide for
FEBFDD850N10LD_CS001
35 W Boost Converter for
LED Drive using BoostPak
Featured Fairchild Product:
Direct questions or comments
about this evaluation board to:
“Worldwide Direct Support”
Fairchild Semiconductor.com
FDD850N10LD
© 2013 Fairchild Semiconductor Corporation FEBFDD850N10LD_CS001 Rev. 1.0.0
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Table of Contents
1. Introduction ............................................................................................................................... 3
1.1. Description ....................................................................................................................... 3
1.2. Features ............................................................................................................................ 3
1.3. FDD850N10LD Diagrams ............................................................................................... 3
2. Evaluation Board Specifications ............................................................................................... 4
3. Photographs............................................................................................................................... 5
4. Printed Circuit Board ................................................................................................................ 6
5. Schematic .................................................................................................................................. 7
6. Bill of Materials ........................................................................................................................ 8
7. Inductor Specifications ........................................................................................................... 10
8. Test Conditions & Test Equipment......................................................................................... 11
9. Performance of Evaluation Board ........................................................................................... 12
9.1. Switching Waveforms .................................................................................................... 12
9.2. Output Regulation Characteristics ................................................................................. 16
9.3. Loss Analysis ................................................................................................................. 17
9.4. Efficiency ....................................................................................................................... 20
9.5. Temperature ................................................................................................................... 21
9.6. EMI................................................................................................................................. 22
10. Revision History ..................................................................................................................... 23
© 2013 Fairchild Semiconductor Corporation 2 FEBFDD850N10LD_CS001 Rev. 1.0.0
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This user guide supports the evaluation kit for the FDD850N10LD. It should be used in
Figure 1. Pin Descriptions
Figure 2. Block Diagram
conjunction with the FDD850N10LD datasheets as well as Fairchild’s application notes and technical support team. Please visit Fairchild’s website at www.fairchildsemi.com.
1. Introduction
This document describes the proposed solution for a driving of LED application using the BoostPak (FDD850N10LD) for boost topology. The input voltage range is 20.4 V –
27.6 V and there is a single-channel DC output with a constant current of 640 mA at 55 V. This document contains a general description of FDD850N10LD, the converter specification, a schematic, the bill of materials, and the typical operating characteristics.
1.1. Description
The N-channel MOSFET and NP diode are combined in one 5-lead D-Pak package produced using Fairchild Semiconductor’s PowerTrench® process tailored to minimize on­state resistance while maintaining superior switching performance. The diode is a hyper­fast rectifier with low forward-voltage drop and excellent switching performance. Using the BoostPak FDD850N10LD in low-power LED backlight driving applications results in lower profile and cost savings by reducing part count, weight, and PCB size as well as improving reliability due to lower leakage current than Schottky Barrier Diode (SBD).
1.2. Features
Lower Conduction Resistance :
- R
- R
= 61 mΩ (Typ.) at VGS = 10 V, ID = 12 A
DS(on)
= 64 mΩ (Typ.) at VGS = 5.0 V, ID = 12 A
DS(on)
Low Gate Charge (Typ. 22.2 nC) Low CFast Reverse Recovery Time: t
(Typ. 42 pF)
rss
rr
Fast Switching 100% Avalanche Tested Improved dv/dt Capability RoHS Compliant
1.3. FDD850N10LD Diagrams
(Typ.) = 11 ns at IF = 5 A, di/dt = 200 A/µs
© 2013 Fairchild Semiconductor Corporation 3 FEBFDD850N10LD_CS001 Rev. 1.0.0
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2. Evaluation Board Specifications
Description
Symbol
Value
Comments
Input Voltage
V
IN, MIN.
20.4 V V
IN, TYP.
24.0 V
V
IN, MAX.
27.6 V
Switching Frequency
fsw
200 kHz
R35 (kΩ)=15000/f
sw
(kHz)
Output Voltage / Current
V
OUT
55 V I
OUT
0.64 A
Output Power
P
OUT
35 W
Efficiency
> 92%
Temperature
T
BoostPak
T
Inductor
T
MOSFET
< 65°C
Initial Application
LED Backlight
All data was measured under the condition, TA=25°C.
Table 1. Summary of Features and Performance
© 2013 Fairchild Semiconductor Corporation 4 FEBFDD850N10LD_CS001 Rev. 1.0.0
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3. Photographs
Figure 3. Top View (114 x 76 mm2)
Figure 4. Bottom View (114 x 76 mm2)
© 2013 Fairchild Semiconductor Corporation 5 FEBFDD850N10LD_CS001 Rev. 1.0.0
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4. Printed Circuit Board
114.3mm
76.2mm
114.3mm
63.5mm
114.3mm
Figure 5. Top Side
Figure 6. Bottom Side
© 2013 Fairchild Semiconductor Corporation 6 FEBFDD850N10LD_CS001 Rev. 1.0.0
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5. Schematic
Figure 7. Evaluation Board Schematic
© 2013 Fairchild Semiconductor Corporation 7 FEBFDD850N10LD_CS001 Rev. 1.0.0
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6. Bill of Materials
Item
No.
Reference
Part No.
Qty.
Description
Manufacturer
1
Q11
FDD850N10LD
1
BoostPak, D-Pak 5L
Fairchild
Semiconductor
2
Q12
FDD120AN15A0
1
150 V / 14 A / 120 Ω, D-Pak
Fairchild
Semiconductor
3
Q13
KTD1624
1
3 A / 60 V / NPN BJT, SOT-89
KEC
4
L1
DYCP1580-470
1
47µH / 0.073 Ω / 5 A, SMD Inductor
DONGYANG
TELECOM
5
U1
1 Main Controller
6
D1,D2
BAT54HT1G
2
0.2 A / 30 V Small Signal Diode, SOD-323
Fairchild
Semiconductor
7
ZD1
MM3Z12VC
1
12 V / 200 mW Zener Diode, SOD-
323F
Fairchild
Semiconductor
8
C1
NXH35VB330MTPRB
1
330 µF / 35 V Electrolytic Capacitor
Samyoung
9
C2, C4, C5, C12,
C13, C15, C16,
C27
GRM21BR71H105KA12
8
1 µF / 50 V SMD Capacitor 2012
Murata
10
C3
GRM31CR71H475KA12
1
4.7 µF / 50 V SMD Capacitor 3216
Murata
11
C6, C10, C11,
C17, C18, C19
GRM188R71H102KA01
6
1 nF / 50 V SMD Capacitor 1608
Murata
12
C7
GRM188R71E221KA01
1
220 pF / 25 V SMD Capacitor 1608
Murata
13
C14
NXQ100VB100MTPRB
1
100 µF / 100 V Electrolytic Capacitor
Samyoung
14
C20, C21, C23, C26, C28, C29,
C30, C31
GRM188R71E105KA12
8
1 µF / 25 V SMD Capacitor 1608
Murata
15
C24, C25
GRM188R71E154KA01
2
150 nF / 25 V SMD Capacitor 1608
Murata
16
R1, R25, R26,
R27, R28
MCR10ERTJ104
5
100 kΩ SMD Resistor 2012
Rhom
17
R2
MCR10ERTJ683
1
68 kΩ SMD Resistor 2012
Rhom
18
R3, R4
MCR10ERTJ623
2
62 kΩ SMD Resistor 2012
Rhom
19
R5, R44
MCR03ERTF30R0
2
30 Ω SMD Resistor 1608
Rhom
20
R6
MCR03ERTJ5R6
1
5.6 Ω SMD Resistor 1608
Rhom
21
R7
MCR03ERTF1002
1
10 kΩ SMD Resistor 1608
Rhom
22
R8, R9, R10, R11,
R12, R13, R14
MCR10ERTJ1R0
7
1 Ω SMD Resistor 2012
Rhom
23
R22, R23, R24
MCR10ERTJ100
3
10 Ω SMD Resistor 2012
Rhom
24
R29
MCR03ERTF1103
1
110 kΩ SMD Resistor 1608
Rhom
25
R30, R54, R55
MCR03ERTF1003
3
100 kΩ SMD Resistor 1608
Rhom
26
R31, R32, R36, R37, R38, R53,
R58
MCR03ERTF2002
7
20 kΩ SMD Resistor 1608
Rhom
27
R33
MCR03ERTF6201
1
6.2 kΩ SMD Resistor 1608
Rhom
28
R34, R56
MCR03ERTF1000
2
100 Ω SMD Resistor 1608
Rhom
29
R35
MCR03ERTF7502
1
75 kΩ SMD Resistor 1608
Rhom
© 2013 Fairchild Semiconductor Corporation 8 FEBFDD850N10LD_CS001 Rev. 1.0.0
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Item
No.
Reference
Part No.
Qty.
Description
Manufacturer
30
R40, R43
MCR03ERTF3002
2
30 kΩ SMD Resistor 1608
Rhom
31
R41, R42
MCR03ERTF0000
2
0 Ω SMD Resistor 1608
Rhom
32
R45, R46, R47,
R48, R49
MCR10ERTJ7R5
5
7.5 Ω SMD Resistor 2012
Rhom
33
R57
MCR03ERTF5102
1
51 kΩ SMD Resistor 1608
Rhom
34
R59, R60
MCR03ERTF5101
2
5.1 kΩ SMD Resistor 1608
Rhom
35
R61, R62, R63,
R64, R65, R66
MCR10ERTJ911
6
910 Ω SMD Resistor 2012
Rhom
36
CON1
DG301_5.0_2P
1
2-Pin Terminal Block for Vin
DEGSON
ELECTRONICS
37
CON2
DG301_5.0_3P
1
3-Pin Terminal Block for LED
DEGSON
ELECTRONICS
38
SW1
SS12E17
1
1P2T Switch
VIMEX
39
F1
1 IF=4 A
© 2013 Fairchild Semiconductor Corporation 9 FEBFDD850N10LD_CS001 Rev. 1.0.0
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7. Inductor Specifications
HEAD OFFICE & FACTORY
942-5, Dohwa-Dong, Nam-gu, Incheon, Korea
TEL : 032-584-0100 FAX : 032-584-0101
China Factory
No.28 Feng Huang Street, Weifang Shandong, CHINA
TEL : 86-536-790-2048 FAX : 86-536-760-2046
Thailand Factory
3/3 Moo. 1 T. Napradoo A.Phantong Chonburi
TEL : 66-81-933-5740 FAX : 66-38-451-573
Top view
Front view
Bottom view
No.
Winding
Pin (S F)
Wire
Turns
Winding Method
P1
1  3
0.35 Φ * 2
21.5 ± 2.0
Solenoid Winding 2 4
Pin
Specification
Inductance
1, 2 – 3, 4
47.0 µH
Resistance
0.073 Ω
Maximum Current
5.0 A
S : 1, 2
F : 3, 4
: WINDING START POINT
Manufacturer: DONGYANG TELECOM CO., LTD.
Part No : DYCP1580-470
Figure 8. Inductor Specification & Construction
(unit : mm)
Figure 9. Dimension Specification
Table 2. Winding Specifications
Table 3. Electrical Characteristics
© 2013 Fairchild Semiconductor Corporation 10 FEBFDD850N10LD_CS001 Rev. 1.0.0
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8. Test Conditions & Test Equipment
Evaluation Board #
FEBFDD850N10LD_CS001
Test Date
Test Temperature
TA=25°C
Test Equipments
DC Power Supply: H-3005D by FinePower Power Analyzer: PM3000A by Voltech Load: 100 W 100 ΩJ Adjustable Resistor Oscilloscope: DPO7104 by Tectronix
Passive voltage probe - P6139 Differential high voltage probe - P5205 Current probe : TCP0030
Thermometer: Therma CAM SC640 by FLIR SYSTEMS
Oscilloscope
(DPO7104)
Power Analyzer
(PM3000A)
DC Power Supply
(H-3005D)
V
A
V
A
Power Resistor
(100W 85Ω, 100Ω)
Table 4. Test Conditions & Test Equipment
© 2013 Fairchild Semiconductor Corporation 11 FEBFDD850N10LD_CS001 Rev. 1.0.0
Figure 10. Test Block Diagram
Page 13
9. Performance of Evaluation Board
Input Voltage (V)
Remarks
20.4
24
27.6
Power On
MOSFET
V
ds
(V)
62.4
62.4
63.2
Diode
Vca (V)
69.6
69.6
68.8
Inductor
I
L_max
(A)
2.56
2.36
2.20
I
L_min
(A)
0.00
0.08
0.04
Normal
MOSFET
Vds (V)
64.0
64.0
64.0
Diode
Vca (V)
76.8
74.4
72.0
Inductor
I
L_max
(A)
2.60
2.36
2.20
I
L_min
(A)
0.96
0.68
0.48
Power Off
MOSFET
Vds (V)
64.8
63.2
63.2
Diode
Vca (V)
75.2
73.6
72.0
Inductor
I
L_max
(A)
2.68
2.48
2.24
I
L_min
(A)
-0.20
-0.20
-0.24
9.1. Switching Waveforms
Test Conditions
Connect the power resistor (85 Ω) to CON2 and measure the voltage and current stress on the BoostPak (FDD850N10LD) under the specified conditions below.
Table 5. Test Result
© 2013 Fairchild Semiconductor Corporation 12 FEBFDD850N10LD_CS001 Rev. 1.0.0
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9.1.1. Power On
Waveforms: C1 (Vgs: 5 V/div), C2 (Vds: 20 V/div), C3 (IL: 1 A/div), C4 (Vka: 20 V/div), Time (20 ms/div)
Figure 11. VIN=20.4 V
Figure 12. VIN=24 V
Figure 13. VIN=24 V
© 2013 Fairchild Semiconductor Corporation 13 FEBFDD850N10LD_CS001 Rev. 1.0.0
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9.1.2. Normal
Figure 14. VIN=20.4 V
Figure 15. VIN=24 V
Figure 16. VIN=24 V
Waveforms: C1 (Vgs: 5 V/div), C2 (Vds: 20 V/div), C3 (IL: 1 A/div), C4 (Vka: 20 V/div), Time (10 µs/div)
© 2013 Fairchild Semiconductor Corporation 14 FEBFDD850N10LD_CS001 Rev. 1.0.0
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9.1.3. Power Off
Figure 17. VIN=20.4 V
Figure 18. VIN=24 V
Figure 19. VIN=24 V
Waveforms: C1 (Vgs: 5 V/div), C2 (Vds: 20 V/div), C3 (IL: 1 A/div), C4 (Vka: 20 V/div), Time (50 ms/div)
© 2013 Fairchild Semiconductor Corporation 15 FEBFDD850N10LD_CS001 Rev. 1.0.0
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9.2. Output Regulation Characteristics
Input
Voltage (V)
P
out
=35 W
P
out
=45 W
Remarks
V
OUT
(V)
I
OUT
(A)
V
OUT
(V)
I
OUT
(A)
20.4
55.39
0.639
64.83
0.640
24.0
55.42
0.639
64.97
0.639
27.6
55.43
0.639
65.04
0.642
Figure 20. Output Regulation Characteristics
50.00
52.00
54.00
56.00
58.00
60.00
62.00
64.00
66.00
68.00
70.00
20.42427.6
Output voltage [V]
Input Voltage, Vin [V]
Vout=55V(35W)
Vout=65V(45W)
Test Conditions
Connect the power resistor (85 Ω, 100 Ω) to the CON2 and measure the output voltage and current on the BoostPak (FDD850N10LD) after 30 minutes aging.
Table 6. Test Results
© 2013 Fairchild Semiconductor Corporation 16 FEBFDD850N10LD_CS001 Rev. 1.0.0
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9.3. Loss Analysis
Input
Voltage
(V)
MOSFET
Diode
Total
PD
(W)
PON (W)
P
OFF
(W)
P
COND
(W)
P
TOT
(W)
PON (W)
P
OFF
(W)
P
COND
(W)
P
TOT
(W)
20.4
0.17
0.11
0.14
0.42
0.02
0.38
0.53
0.93
1.34
24
0.15
0.09
0.09
0.34
0.02
0.37
0.52
0.91
1.24
27.6
0.13
0.09
0.07
0.28
0.02
0.36
0.52
0.90
1.18
Figure 21. Loss Analysis for VIN=24 V
Figure 22. Loss Distribution for VIN=24 V
Eon_M
45%
Eoff_M
28%
Econd_M
27%
Power Loss of MOSFET
Eon_D
2%
Eoff_D
41%
Econd_D
57%
Power Loss of Diode
Eon_M
12%
Eoff_M
8%
Econd_M
7%
Eon_D
2%
Eoff_D
30%
Econd_D
41%
Total Power Loss
0.00
0.20
0.40
0.60
0.80
1.00
MOSFET
Diode
Conduction loss
0.09
0.52
Turn off loss
0.09
0.37
Turn on loss
0.15
0.02
Power Loss [W]
Power distribution
Test Conditions
Connect the power resistor (85 Ω) to the CON2 and measure the output voltage and current on the BoostPak (FDD850N10LD) after 30 minutes aging.
Table 7. Test Results
© 2013 Fairchild Semiconductor Corporation 17 FEBFDD850N10LD_CS001 Rev. 1.0.0
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Figure 23. Loss Comparison for Input Voltage, VIN
4-Period Waveforms, Time (2 µs/div)
Conduction Waveforms, Time (500 ns/div)
Turn-On Waveforms, Time (50 ns/div)
Turn-Off Waveforms, Time (50 ns/div)
Figure 24. MOSFET Waveforms for VIN=24 V
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
20.42427.6
Power Loss [W]
Input Voltage, Vin [V]
MOSFET
Diode
Total loss
Waveforms: C1 (Vgs: 5 V/div), C2 (Vds: 20 V/div), C3 (Id: 1 A/div)
© 2013 Fairchild Semiconductor Corporation 18 FEBFDD850N10LD_CS001 Rev. 1.0.0
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Waveforms : C1(Vgs:5V/div), C4(Vak:20V/div), M2(Ia:1A/div)
4-Period Waveforms, Time (2 µs/div)
Conduction Waveforms, Time (500 ns/div)
Turn-On Waveforms, Time (50 ns/div)
Turn-Off Waveforms, Time (50 ns/div)
Figure 25. Diode Waveforms for VIN=24 V
© 2013 Fairchild Semiconductor Corporation 19 FEBFDD850N10LD_CS001 Rev. 1.0.0
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9.4. Efficiency
Input Voltage
Input Power
Output Power
Efficiency
Remark
20.4 V
37.75 W
35.39 W
93.75%
24.0 V
37.54 W
35.42 W
94.36%
27.6 V
37.38 W
35.43 W
94.78%
Input Voltage
Input Power
Output Power
Efficiency
Remark
20.4 V
44.48 W
41.47 W
93.23%
24.0 V
44.20 W
41.52 W
93.92%
27.6 V
44.14 W
41.73 W
94.54%
Figure 26. Efficiency Curve
90.00
91.00
92.00
93.00
94.00
95.00
96.00
97.00
98.00
99.00
100.00
20.42427.6
Efficiency [%]
Input Voltage, Vin [V]
Vout=55V
Vout=65V
Test Conditions
Connect the power resistor (85 Ω, 100 Ω) to the CON2 and measure the output voltage and current on the BoostPak (FDD850N10LD) after 30 minutes aging.
Table 8. Test Results of V
= 55 V ( 35 W)
OUT
Table 9. Test Results of V
= 65 V (45 W)
OUT
© 2013 Fairchild Semiconductor Corporation 20 FEBFDD850N10LD_CS001 Rev. 1.0.0
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9.5. Temperature
VIN=20.4 V
VIN=24 V
VIN=27.6 V
Remark
BoostPak (Q11)
66.9°C
61.5°C
59.3°C
PKG Top
Inductor
63.7°C
59.6°C
56.6°C
R8~R14
57.6°C
52.8°C
49.8°C
MOSFET (Q12)
50.8°C
50.0°C
52.1°C
R45~R49
58.9°C
57.3°C
60°C
Figure 27. Temperature Curve
Figure 28. IR Image for VIN=24 V
50.0
52.0
54.0
56.0
58.0
60.0
62.0
64.0
66.0
68.0
70.0
72.0
74.0
20.42427.6
Temperat ure [℃]
Input Voltage, V in [V]
BoostPak (FDD850N10LD, Q11) = 61.5
Test Conditions
Connect the power resistor (85 Ω) to the CON2 and measure the saturated temperature.
Table 10. Test Result of V
= 55 V (35 W)
OUT
© 2013 Fairchild Semiconductor Corporation 21 FEBFDD850N10LD_CS001 Rev. 1.0.0
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9.6. EMI
Figure 29. Radiated Emissions: VIN=24 V
30 100050 100 500
10
60
20
30
40
50
Frequency
Level
[MHz]
[dB(uV/ m)]
Vertical
Horizontal
CISPR22 ClassB
Test Conditions
Frequency Sub-Range: 30 MHz ~ 1000 MHz Load is five strings of LEDs.
© 2013 Fairchild Semiconductor Corporation 22 FEBFDD850N10LD_CS001 Rev. 1.0.0
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10. Revision History
Rev.
Date
Description
1.0.0
May 2013
Initial Release
WARNING AND DISCLAIMER
Replace components on the Evaluation Board only with those parts shown on the parts list (or Bill of Materials) in the Users’ Guide. Contact an authorized Fairchild representative with any questions.
This board is intended to be used by certified professionals, in a lab environment, following proper safety procedures. Use at your own risk. The Evaluation board (or kit) is for demonstration purposes only and neither the Board nor this User’s Guide constitute a sales contract or create any kind of warranty, whether express or implied, as to the applications or products involved. Fairchild warrantees that its products meet Fairchild’s published specifications, but does not guarantee that its products work in any specific application. Fairchild reserves the right to make changes without notice to any products described herein to improve reliability, function, or design. Either the applicable sales contract signed by Fairchild and Buyer or, if no contract exists, Fairchild’s standard Terms and Conditions on the back of Fairchild invoices, govern the terms of sale of the products described herein.
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO
IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
EXPORT COMPLIANCE STATEMENT
These commodities, technology, or software were exported from the United States in accordance with the Export Administration Regulations for the ultimate destination listed on the commercial invoice. Diversion contrary to U.S. law is prohibited.
U.S. origin products and products made with U.S. origin technology are subject to U.S Re-export laws. In the event of re-export, the user will be responsible to ensure the appropriate U.S. export regulations are followed.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
© 2013 Fairchild Semiconductor Corporation 23 FEBFDD850N10LD_CS001 Rev. 1.0.0
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