ON Semiconductor ESD7484 User Manual
ESD7484
ESD Protection Diode
4−Line, Ultra Large Bandwidth
Functional Description
The ESD7484 chip is a monolithic, application specific discrete
device dedicated to ESD protection of the HDMI connection. It also
offers the same high level of protection for IEEE 1394a and IEEE
1394b/c, USB2.0, Ethernet links, and video lines.
Its ultra high cutoff frequency (5.3 GHz) secures a high level of
signal integrity. The device topology provides this integrity without
compromising the complete protection of ICs against the most
stringent ESD strikes.
Features
• Wideband Performance
• Flow−Through Layout
• Low Profile with Small Footprint: 1.6 mm x 1.1 mm Package
• 0.4 mm Pitch WLCSP Package
• IEC61000−4−2 Level 4 (At External Pins)
♦ ± 15 kV (Air Discharge)
♦ ± 15 kV (Contact Discharge)
• These Devices are Pb−Free, Halogen Free and are RoHS II
Compliant
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MARKING
DIAGRAM
84
WLCSP10
CASE 567DE
84 = Specific Device Code
Y = Year
W = Work Week
G = Pb−Free Package
YW
G
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Applications
• Mobile Phones and Communications Systems
• HDMI Ports at 1.65 Gb/s and up to 3.2 Gb/s
• Video Out Protection
A
B
C
External
(Connector)
D
E
F
Figure 1. Pin Configuration (Bump View)
123
_1+
OUT
GND
D
_1−
OUT
_2+
OUT
GND
_2−
OUT
DIN_1+D
D
_1−
IN
Internal
(ASIC)
_2+D
D
IN
DIN_2−D
© Semiconductor Components Industries, LLC, 2011
November, 2017 − Rev. 1
1 Publication Order Number:
ESD7484/D
ESD7484
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
P
T
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
ELECTRICAL CHARACTERISTICS (Note 1)
Symbol Test Condition Min Typ Max Unit
V
I
C
DC
1. All parameters specified at TA = 25°C unless otherwise noted.
2. Standard IEC 61000−4−2 with C
ESD IEC61000−4−2, level 4 – air discharge (external pins)
PP
ESD IEC61000−4−2, level 4 – contact discharge (external pins)
Peak Pulse Power Dissipation (8/20 ms)
PP
T
Maximum Junction Temperature 125 °C
J
Storage Temperature Range −55 to +150 °C
stg
BR
RM
line
I/O−I/O
Breakdown Voltage (Ir = 1 mA) 6 9 V
Leakage Current @ Vrm (Vrm = 3 V per line) 3 100 nA
V
line
V
line
V
line
= 0 V, V
= 0 V, V
= 0 V, V
= 30 mV, F = 1 MHz, Capacitor between I/O and GND 1.6 1.75
osc
= 30 mV, F = 1 MHz, Capacitor between I/O 0.8
osc
= 30 mV, F = 1 MHz, Capacitance Variation between I/O 0.006 pF
osc
Discharge
= 150 pF, R
Discharge
= 330 W.
±15
±15
70 W
kV
pF
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ESD7484
TYPICAL CHARACTERISTICS
Figure 2. HDMI1.4 Test Conditions
3.4 Gb/s Datarate;
Clears HDMI Source Mask
Figure 3. S21 Plot Figure 4. Crosstalk Measurements
Figure 5. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
Figure 6. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC61000−4−2
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