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EMI6316FCTBG
EMI Filter with ESD
Protection for MicroSD Card
Applications
Product Description
The EMI6316 is a 4 x 4, 15−bump EMI filter with ESD protection
device for MicroSD card applications in a 0.4 mm pitch CSP form
factor. It is fully compliant with IEC 61000−4−2. The EMI6316 is also
RoHS II compliant.
A1 Corner
Indicator
A
B
C
D
PACKAGE / PINOUT DIAGRAMS
A
63
YW
Top View
(Bumps Down View)
B
C
D
43 2112 34
Bottom View
(Bumps Up View)
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MARKING
DIAGRAM
WLCSP15
CASE 567FX
63 = Specific Device Code
Y = Year
W = Work Week
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 3 of this data sheet.
63
YW
G
© Semiconductor Components Industries, LLC, 2012
September, 2012 − Rev. 1
1 Publication Order Number:
EMI6316/D
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EMI6316FCTBG
External
Internal
(B2)
(B1)
(C1)
(A1)
(A2)
(D2)
(D1)
(B4)
(C4)
(A4)
(A3)
(D3)
(D4)
(B3, C3)
Figure 1. Electrical Schematic
Table 1. PIN DESCRIPTIONS
Pin Description Pin Description Pin Description Pin Description
A1 dat0 Internal B1 clk Internal C1 cmd Internal D1 data3 Internal
A2 dat1 Internal B2 VCC External D2 data2 Internal
A3 SDdat1 External B3 GND C3 GND D3 SDdata2 External
A4 SDdat0 External B4 SDclk External C4 SDcmd External D4 SDdata3 External
External
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EMI6316FCTBG
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter Rating Unit
Storage Temperature Range −55 to +150 °C
Operating Temperature Range −40 to +85 °C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
R1 R2 R
R4 R5 R
R9 R
1
R
R
I
LEAK
12
13
Resistance 34 40 46
3
6
Resistance
R
0
11
Resistance 12.75 15 17.25
Leakage Current per Channel VIN = 3.0 V 10 100 nA
C Line Capacitance
V
V
ESD
Breakdown Voltage (Positive) I
B
ESD Protection Peak Discharge Voltage at A3, A4, B2,
B4, C4, D3 and D4 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
ESD Protection Peak Discharge Voltage at A1, A2, B1,
C1, D1 and D2 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
1. All parameters specified at TA = 25°C unless otherwise noted.
2. MicroSD version 3.0 SDR104 compliant.
3. Standard IEC 61000−4−2 with C
Parameter Conditions Min Typ Max Unit
42.5
At 1 MHz, V
At 1 MHz, V
(Note 2)
At 1 MHz, V
= 1 mA 6 7 9 V
R
= 0 V 9 11.5 14 pF
IN
= 1.8 V
IN
= 2.5 V 7 pF
IN
50 57.5
8 pF
(Note 3)
±8
±15
(Note 3)
±2
±2
Discharge
= 150 pF, R
Discharge
= 330 W.
W
kW
kW
kV
Table 4. CSP TAPE AND REEL SPECIFICATIONS
Part Number Chip Size (mm) Package Shipping
EMI6316FCTBG
1.56 x 1.56 x 0.50
†
†
WLCSP15
5000 / Tape & Reel
(Pb−Free)
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
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EMI6316FCTBG
RF CHARACTERISTICS
2.5V
0V
Figure 2. S21 Attenuation Simulation
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
WLCSP15, 1.56x1.56
CASE 567FX
ISSUE O
DATE 07 JUN 2012
REFERENCE
2X
2X
NOTE 3
0.03
PIN A1
0.05 C
15X
A0.05 BC
C
0.10 C
0.10 C
0.10 C
A1
b
D
TOP VIEW
SIDE VIEW
e
D
C
B
A
12 3
BOTTOM VIEW
4
e/2
A
A2
A
B
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIMAMIN MAX
0.47
A1
A2 0.305 REF
b 0.24 0.29
D 1.56 BSC
E
e 0.40 BSC
0.53
0.185 0.205
1.56 BSC
GENERIC
MARKING DIAGRAM*
SEATING
C
PLANE
XX = Specific Device Code
e
e/2
Y = Year
W = Work Week
G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
XX
YW
G
RECOMMENDED
SOLDERING FOOTPRINT*
15X
0.23
0.40
PITCH
PACKAGE
OUTLINE
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
A1
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON81359E
WLCSP15, 1.56X1.56
© Semiconductor Components Industries, LLC, 2019
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