ON Semiconductor CSPEMI606, CSPEMI608 User Manual

CSPEMI606/608

LCD EMI Filter Array with
ESD Protection

Description

The CSPEMI606 and CSPEMI608 are EMI filter arrays with ESD
protection, which integrate six and eight Pi−filters (C−R−C),
respectively. The CSPEMI606/608 has component values of 15 pF −
100  − 15 pF. These devices include ESD protection diodes on every
pin, which provide a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). The ESD diodes connected to the filter ports are designed and
characterized to safely dissipate ESD strikes of ±15 kV, beyond the
maximum requirement of the IEC 61000−4−2 international standard.
Using the MIL−STD−883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for contact
discharges at greater than ±30 kV.

These devices are particularly well suited for portable electronics
(e.g. wireless handsets, PDAs, notebook computers) because of their
small package format and easy−to−use pin assignments. They are ideal
for EMI filtering and protecting data lines from ESD for the LCD
display in clamshell handsets. The CSPEMI606 and CSPEMI608 are
available in space−saving, low−profile chip−scale packages.

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WLCSP15

CASE 567BS

MARKING DIAGRAM

606

CSPEMI606

15−Bump CSP

WLCSP20

CASE 567BZ

EMI608

CSPEMI608

20−Bump CSP

Features

• Six and Eight Channels of EMI Filtering

• ±15 kV ESD Protection on each Channel

(IEC 61000−4−2 Level 4, Contact Discharge)

• ±30 kV ESD Protection on each Channel (HBM)

• Better than 30 dB of Attenuation at 1 GHz to 3 GHz

• 15−Bump, 2.960 mm x 1.330 mm Footprint

Chip Scale Package (CSPEMI606)

• 20−Bump, 4.000 mm x 1.458 mm Footprint

Chip Scale Package (CSPEMI608)

• Chip Scale Package Features Extremely Low Lead Inductance for

Optimum Filter and ESD Performance

• These Devices are Pb−Free and are RoHS Compliant

Applications

• LCD Data Lines in Clamshell Wireless Handsets

• EMI Filtering & ESD Protection for High−Speed I/O Data Ports

• Wireless Handsets / Cell Phones

• Notebook Computers

• PDAs / Handheld PCs

• EMI Filtering for High−Speed Data Lines

606 = CSPEMI606
EMI608 = CSPEMI608

ORDERING INFORMATION

Device Package Shipping

CSPEMI606G CSP−15

(Pb−Free)

CSPEMI608G CSP−20

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.

3500/Tape & Reel

3500/Tape & Reel

†

© Semiconductor Components Industries, LLC, 2011

May, 2011 − Rev. 4

1 Publication Order Number:

CSPEMI606/608/D

CSPEMI606/608

ELECTRICAL SCHEMATIC

100 

FILTERn*

15 pF 15 pF

GND

(Pins B1−Bn)

1 of 6 or 8 EMI Filtering + ESD Channels

*See Package/Pinout Diagrams for expanded pin information.

PACKAGE / PINOUT DIAGRAMS

FILTERn*

Bottom View

(Bumps Up View)

C3 C4

B1

C3 C4

A3 A4

B2

A3 A4

B2

C5 C6

A5 A6

C5 C6

B3

A5 A6

B3

C7 C8

A7 A8

Orientation

Marking

Orientation

Marking

A

B

C

123

+

A

B

C

(Bumps Down View)

123

+

Top View

564

56748

Orientation

CSPEMI606

CSP Package

Orientation

Marking

CSPEMI608

CSP Package

Marking

C1 C2

A1 A2

A1

C1 C2

B1

A1 A2

A1

Table 1. PIN DESCRIPTIONS

Pin(s)

CSPEMI606 CSPEMI608 CSPEMI606 CSPEMI608

A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1

A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2

A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3

A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4

A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5

A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6

− A7 FILTER7 Filter Channel 7 − C7 FILTER7 Filter Channel 7

− A8 FILTER8 Filter Channel 8 − C8 FILTER8 Filter Channel 8

B1−B3 B1−B4 GND Device Ground

Name Description

Pin(s)

Name Description

B4

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CSPEMI606/608

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range −65 to +150 °C

DC Power per Resistor 100 mW

DC Package Power Rating 500 mW

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range −40 to +85 °C

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol

R Resistance 80 100 120

C Capacitance At 2.5 V DC, 1 MHz,

V

DIODE

I

LEAK

V

Diode Standoff Voltage

Diode Leakage Current (reverse bias) V

Signal Voltage

SIG

Positive Clamp
Negative Clamp

V

ESD

In−system ESD Withstand Voltage

a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4

V

Clamping Voltage during ESD Discharge

CL

MIL−STD−883 (Method 3015), 8 kV

Positive Transients
Negative Transients

f

1. T

A

2. ESD applied to input and output pins with respect to GND, one at a time.

Cut−off Frequency

C

= 25°C unless otherwise specified.

Z

SOURCE

= 50 , Z

3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping

voltage is measured at Pin C1.

4. Unused pins are left open.

Parameter Conditions Min Typ Max Units



12 15 18 pF

30 mV AC

I

= 10 A

DIODE

= 3.3 V 200 nA

DIODE

I

= 10 mA

LOAD

5.6

−1.5

(Notes 2 and 4)

6.0 V

6.8

−0.8

9.0

−0.4

V

kV

±30
±15

(Notes 2, 3 and 4)

V

+12

−7

120 MHz

LOAD

= 50 

R = 100 , C = 15 pF

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CSPEMI606/608

PERFORMANCE INFORMATION

Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)

Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B1)

Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B1)

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