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CSPEMI606
User Manual
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ON Semiconductor CSPEMI606, CSPEMI608 User Manual

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CSPEMI606/608
LCD EMI Filter Array with ESD Protection
Description
These devices are particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package format and easy−to−use pin assignments. They are ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets. The CSPEMI606 and CSPEMI608 are available in space−saving, low−profile chip−scale packages.
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WLCSP15
CASE 567BS
MARKING DIAGRAM
606
CSPEMI606
15−Bump CSP
WLCSP20
CASE 567BZ
EMI608
CSPEMI608
20−Bump CSP
Features
• Six and Eight Channels of EMI Filtering
• ±15 kV ESD Protection on each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
• ±30 kV ESD Protection on each Channel (HBM)
• Better than 30 dB of Attenuation at 1 GHz to 3 GHz
• 15−Bump, 2.960 mm x 1.330 mm Footprint
Chip Scale Package (CSPEMI606)
• 20−Bump, 4.000 mm x 1.458 mm Footprint
Chip Scale Package (CSPEMI608)
• Chip Scale Package Features Extremely Low Lead Inductance for
Optimum Filter and ESD Performance
• These Devices are Pb−Free and are RoHS Compliant
Applications
• LCD Data Lines in Clamshell Wireless Handsets
• EMI Filtering & ESD Protection for High−Speed I/O Data Ports
• Wireless Handsets / Cell Phones
• Notebook Computers
• PDAs / Handheld PCs
• EMI Filtering for High−Speed Data Lines
606 = CSPEMI606 EMI608 = CSPEMI608
ORDERING INFORMATION
Device Package Shipping
CSPEMI606G CSP−15
(Pb−Free)
CSPEMI608G CSP−20
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
3500/Tape & Reel
3500/Tape & Reel
†
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 4
1 Publication Order Number:
CSPEMI606/608/D
CSPEMI606/608
ELECTRICAL SCHEMATIC
100
FILTERn*
15 pF 15 pF
GND
(Pins B1−Bn)
1 of 6 or 8 EMI Filtering + ESD Channels
*See Package/Pinout Diagrams for expanded pin information.
PACKAGE / PINOUT DIAGRAMS
FILTERn*
Bottom View
(Bumps Up View)
C3 C4
B1
C3 C4
A3 A4
B2
A3 A4
B2
C5 C6
A5 A6
C5 C6
B3
A5 A6
B3
C7 C8
A7 A8
Orientation
Marking
Orientation
Marking
A
B
C
123
+
A
B
C
(Bumps Down View)
123
+
Top View
564
56748
Orientation
CSPEMI606
CSP Package
Orientation
Marking
CSPEMI608
CSP Package
Marking
C1 C2
A1 A2
A1
C1 C2
B1
A1 A2
A1
Table 1. PIN DESCRIPTIONS
Pin(s)
CSPEMI606 CSPEMI608 CSPEMI606 CSPEMI608
A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1
A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2
A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3
A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4
A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5
A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6
− A7 FILTER7 Filter Channel 7 − C7 FILTER7 Filter Channel 7
− A8 FILTER8 Filter Channel 8 − C8 FILTER8 Filter Channel 8
B1−B3 B1−B4 GND Device Ground
Name Description
Pin(s)
Name Description
B4
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2
CSPEMI606/608
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range −65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 500 mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range −40 to +85 °C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
R Resistance 80 100 120
C Capacitance At 2.5 V DC, 1 MHz,
V
DIODE
I
LEAK
V
Diode Standoff Voltage
Diode Leakage Current (reverse bias) V
Signal Voltage
SIG
Positive Clamp Negative Clamp
V
ESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4
V
Clamping Voltage during ESD Discharge
CL
MIL−STD−883 (Method 3015), 8 kV
Positive Transients Negative Transients
f
1. T
A
2. ESD applied to input and output pins with respect to GND, one at a time.
Cut−off Frequency
C
= 25°C unless otherwise specified.
Z
SOURCE
= 50 , Z
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
4. Unused pins are left open.
Parameter Conditions Min Typ Max Units
12 15 18 pF
30 mV AC
I
= 10 A
DIODE
= 3.3 V 200 nA
DIODE
I
= 10 mA
LOAD
5.6
−1.5
(Notes 2 and 4)
6.0 V
6.8
−0.8
9.0
−0.4
V
kV
±30 ±15
(Notes 2, 3 and 4)
V
+12
−7
120 MHz
LOAD
= 50
R = 100 , C = 15 pF
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3
CSPEMI606/608
PERFORMANCE INFORMATION
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B1)
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4
CSPEMI606/608
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 3. Insertion Loss vs. Frequency (A3−C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4−C4 to GND B2)
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5
CSPEMI606/608
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 5. Insertion Loss vs. Frequency (A5−C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6−C6 to GND B3)
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6
CSPEMI606/608
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 7. Insertion Loss vs. Frequency
(A7−C7 to GND B4, CSPEMI608 Only)
Figure 8. Insertion Loss vs. Frequency
(A8−C8 to GND B4, CSPEMI608 Only)
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7
CSPEMI606/608
PERFORMANCE INFORMATION (Cont’d)
Figure 9. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5 VDC and 255C)
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8
CSPEMI606/608
APPLICATION INFORMATION
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition Non−Solder Mask defined pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous 60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C
±50 m
±20 m
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 10. Recommended Non−Solder Mask Defined Pad Illustration
250
200
150
100
Temperature (5C)
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Figure 11. Lead−free (SnAgCu) Solder Ball Reflow Profile
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
PIN A1
REFERENCE
2X
2X
0.05 C
0.05 C
0.05 C
D
TOP VIEW
WLCSP15, 2.96x1.33
CASE 567BS−01
ISSUE O
A
B
E
A2
DATE 26 JUL 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS.
MILLIMETERS
DIMAMIN MAX
A1 A2 0.40 REF
b 0.29 0.35 D 2.96 BSC
E eD 0.50 BSC eE 0.435 BSC
0.65
0.56
0.21 0.27
1.33 BSC
NOTE 3
0.03
0.05 C
15X
A0.05 BC
C
A1
b
SIDE VIEW
C
B
A
123 789
456
BOTTOM VIEW
eD/2
eD
A
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
15X
0.25
eE
C
SEATING PLANE
A1
0.87
0.44
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON49826E
WLCSP15, 2.96X1.33
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
PIN A1
REFERENCE
2X
2X
0.05 C
0.05
0.05 C
C
D
TOP VIEW
WLCSP20, 4.00x1.46
CASE 567BZ−01
ISSUE O
A
B
E
A2
A
DATE 26 JUL 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS.
MILLIMETERS
DIMAMIN MAX
A1 A2 0.40 REF
b 0.29 0.35 D 4.00 BSC
E eD 0.50 BSC eE 0.435 BSC
0.65
0.56
0.21 0.27
1.46 BSC
0.05 C
NOTE 3
A1
SIDE VIEW
eD/2
eD
0.03
20X
C
b
A0.05 BC
C
B
A
123 789 10 11 12
456
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.87
0.44
0.50
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SEATING
C
PLANE
eE
PACKAGE
OUTLINE
20X
0.25
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON49833E
WLCSP20, 4.00X1.46
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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