CSPEMI202FCTAG
_
_
2 Channel Headset
Microphone EMI Filter with
ESD Protection
Product Description
The CSPEMI202FCTAG is a dual low−pass filter array integrating
two pi−style filters (C−R−C) that reduce EMI/RFI emissions while at
the same time providing ESD protection. This part is custom−designed
to interface with a microphone port on a cellular telephone or similar
device. Each high quality filter provides more than 35 dB attenuation
in the 800−2700 MHz range. These pi−style filters support
bidirectional filtering, controlling EMI both to and from a microphone
element. They also support bipolar signals, enabling audio signals to
pass through without distortion.
In addition, the CSPEMI202AG provides a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The diodes safely dissipate ESD
strikes of ±8 kV, the maximum requirement of the IEC 61000−4−2
international standard. Using the MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater than ±15 kV.
The CSPEMI202FCTAG is particularly well−suited for portable
electronics (e.g. cellular telephones, PDAs, notebook computers)
because of its small package format and low weight. The
CSPEMI202FCTAG is available in a space−saving, low−profile Chip
Scale Package with RoHS compliant lead−free finishing.
Features
• Two Channels of EMI Filtering
• Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
Network
• Greater than 40 dB Attenuation at 1 GHz
• ±8 kV ESD Protection on each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
• ±15 kV ESD Protection on each Channel (HBM)
• Supports Bipolar Signals − Ideal for Audio Applications
• Chip Scale Package Features Extremely Low Lead Inductance for
Optimum Filter and ESD Performance
• 5−Bump, 0.930 x 1.410 mm Footprint Chip Scale Package (CSP)
• These Devices are Pb−Free and are RoHS Compliant
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WLCSP5
AG SUFFIX
CASE 567LT
ELECTRICAL SCHEMATIC
A1
A3
MIC_IN2 MIC_IN1
B2
GND
MARKING DIAGRAM
AE = CSPEMI202FC
ORDERING INFORMATION
Device Package Shipping
68 W
47 pF 47 pF
68 W
47 pF 47 pF
+
AE
C1
C3
†
OUT1
MIC
OUT2
MIC
Applications
• EMI Filtering and ESD Protection for Headset Microphone Ports
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. 0
1 Publication Order Number:
CSPEMI202FCTAG CSP−5
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
3500 / Tape &
Reel
CSPEMI202FC/D
CSPEMI202FCTAG
Table 1. PIN DESCRIPTIONS
5−bump CSP Package
Pin Name Description
A1 MIC_IN1 Microphone Input 1 (from microphone)
A3 MIC_IN2 Microphone Input 2 (from microphone)
B2 GND Device Ground
C1 MIC_OUT1 Microphone Output 1 (to audio circuitry)
C3 MIC_OUT1 Microphone Output 2 (to audio circuitry)
Orientation
Marking
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
1 2 3
+
A
B
C
Orientation
Marking
(Pins Up View)
Bottom View
C1 C3
B2
A1
A1 A3
CSPEMI202FC
CSP Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range −65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 200 mW
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range −40 to +85 °C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
R
C
I
LEAK
V
Resistance 61 68 75
1
Channel Capacitance 76 94 112 pF
1
Diode Leakage Current V
Signal Voltage
SIG
Positive Clamp
Negative Clamp
V
ESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
V
Clamping Voltage during ESD Discharge
CL
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
f
Cut−off frequency
C
Z
SOURCE
= 50 W, Z
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. T
= 25°C unless otherwise specified.
A
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
Parameter Conditions Min Typ Max Units
W
= 5.0 V 1.0
IN
I
= 10 mA
LOAD
5
mA
V
−157−1015−5
(Note 2)
kV
±15
±8
(Notes 2 and 3)
V
+15
−19
60 MHz
= 50 W
LOAD
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2
CSPEMI202FCTAG
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3−C3 to GND B2)
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CSPEMI202FCTAG
APPLICATION INFORMATION
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition Non−Solder Mask defined pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous 60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C
±50 mm
±20 mm
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
250
200
150
100
Temperature (5C)
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
WLCSP5, 1.41x0.94
CASE 567LT
ISSUE O
DATE 05 JUN 2015
REFERENCE
2X
2X
NOTE 3
0.03
PIN A1
0.05 C
0.05 C
0.05 C
5X
A0.05 BC
C
0.05 C
A1
b
C
B
A
BOTTOM VIEW
E
TOP VIEW
SIDE VIEW
eE
123
A
A2
A
B
D
C
eD
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIMAMIN MAX
A1
A2 0.23 REF
b 0.29 0.35
D 1.41 BSC
E
eD 0.435 BSC
eE 0.25 BSC
0.50
0.40
0.21 0.27
0.94 BSC
GENERIC
MARKING DIAGRAM*
XM
X = Specific Device Code
M = Month Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
A1
OUTLINE
0.87
0.44
5X
0.25
0.25
0.50
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON98954F
WLCSP5, 1.41X0.94
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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