ON Semiconductor CS8182 Technical data

查询CS8182YDF8供应商
CS8182
Micropower 200 mA Low Dropout Tracking Regulator/Line Driver
The CS8182 is a monolithic integrated low dropout tracking
regulator designed to provide adjustable buffered output voltage that closely tracks (±10 mV) the reference input. The output delivers up to 200 mA while being able to be configured higher, lower or equal to the reference voltages.
The output has been designed to operate over a wide range (2.8 V to 45 V) while still maintaining excellent DC characteristics. The CS8182 is protected from reverse battery, short circuit and thermal runaway conditions. The device also can withstand 45 V load dump transients and −50 V reverse polarity input voltage transients. This makes it suitable for use in automotive environments.
The V the input voltage as a reference for the output and it also can be pulled low to place the device in sleep mode where it nominally draws less than 30A from the supply.
Features
200 mA Source Capability
Output Tracks within ±10 mV Worst Case
Low Dropout (0.35 V Typ. @ 200 mA)
Low Quiescent Current
Thermal Shutdown
Short Circuit Protection
Wide Operating Range
Internally Fused Leads in SO−8 Package
For Automotive and Other Applications Requiring Site and Change
Control
V
IN
/ENABLE lead serves two purposes. It is used to provide
REF
V
OUT
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1
SO−8
DF SUFFIX
CASE 751
1
PIN CONNECTIONS AND
MARKING DIAGRAMS
1
V
OUT
GND GND
Adj
CS8182
AWLYWW
1
A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week
ALYW
8182
V
IN
GND GND V
REF
Tab GND Pin 1. V
5
D2PAK−5
DPS SUFFIX
CASE 936AC
/ENABLE
IN
2. V
OUT
3. GND
4. Adj
5. V
REF
Current Limit &
SAT Sense
ENABLE
+
Thermal
Shutdown
Semiconductor Components Industries, LLC, 2004
August, 2004 − Rev. 21
Figure 1. Block Diagram
ORDERING INFORMATION*
Device Package Shipping
CS8182YDF8
Adj
V
/ENABLE
REF
+
GND
2.0 V
1 Publication Order Number:
CS8182YDFR8 CS8182YDPS5 CS8182YDPSR5 *Consult your local sales representative for SO−8 with
exposed pads package option.
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
SO−8 SO−8
2
D
PAK 5−PIN
2
PAK 5−PIN
D
95 Units/Rail
2500 Tape & Reel
50 Units/Rail
750 Tape & Reel
CS8182/D
CS8182
PACKAGE PIN DESCRIPTION
Package Lead Number
SO−8 D2PAK 5−PIN
8 1 V 1 2 V
2, 3, 6, 7 3 GND Ground.
4 4 Adj Adjust lead. 5 5 V
MAXIMUM RATINGS
Rating Value Unit
Storage Temperature −65 to 150 °C Supply Voltage Range (continuous) −15 to 45 V Supply Voltage Range (normal, continuous) 3.4 to 45 V Peak Transient Voltage (VIN = 14 V, Load Dump Transient = 31 V) 45 V Voltage Range (Adj, V Maximum Junction Temperature 150 °C Package Thermal Resistance, SO−8:
Junction−to−Case, R Junction−to−Ambient, R
Package Thermal Resistance, D2PAK, 5−Pin:
Junction−to−Case, R Junction−to−Ambient, R
ESD Capability (Human Body Model) (Machine Model)
Lead Temperature Soldering: Reflow: (SO−8) (Note 1) (D2PAK)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. 60 second maximum above 183°C.
2. −5°C/+0°C allowable conditions. *Depending on thermal properties of substrate. R
OUT
, V
/ENABLE) −10 to 45 V
REF
JC
JA
JC
JA
= R
JA
JC
Lead Symbol Function
Input voltage. Regulated output.
+ R
IN
OUT
/ENABLE Reference voltage and ENABLE input.
REF
CA
25
110
4.0
10−50**
2.0
200
240 peak 225 peak
(Note 2)
°C/W °C/W
°C/W °C/W
kV
V
°C
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CS8182
ELECTRICAL CHARACTERISTICS (V
0.1 < C
OUT−ESR
< 1.0 @ 10 kHz, unless otherwise specified.)
Parameter
= 14 V; V
IN
/ENABLE > 2.75 V; −40°C < TJ < +125°C; C
REF
OUT
10 F;
Test Conditions Min Typ Max Unit
Regular Output
V
− V
REF
OUT
V
Tracking Error
OUT
Dropout Voltage (VIN − V
OUT
4.5 V VIN 26 V, 100 A I V
= 12 V, I
IN
) I
OUT
I
OUT
I
OUT
= 100 A = 30 mA = 200 mA
= 30 mA, V
OUT
200 mA, Note 3
OUT
= 5.0 V, Note 3
REF
−10
−5.0
100
350
10
5
150 500
600 Line Regulation 4.5 V VIN 26 V, Note 3 10 mV Load Regulation 100 A I
200 mA, Note 3 10 mV
OUT
Adj Lead Current Loop in Regulation 0.2 1.0 A Current Limit VIN = 14 V, V Quiescent Current (IIN − I
Reverse Current V
) VIN = 12 V, I
OUT
V V
IN IN
OUT
= 12 V, I = 12 V, V
= 5.0 V, VIN = 0 V 0.2 1.5 mA
Ripple Rejection f = 120 Hz, I
= 5.0 V, V
REF
= 200 mA
OUT
= 100 A
OUT
/ENABLE = 0 V
REF
= 200 mA, 4.5 V VIN 26 V 60 dB
OUT
= 90% of V
OUT
, Note 3 225 700 mA
REF
15 75 30
25
150
55
Thermal Shutdown GBD 150 180 210 °C
V
/ENABLE
REF
Enable Voltage 0.80 2.00 2.75 V Input Bias Current V
3. V
connected to Adj lead.
OUT
/ENABLE 0.2 1.0 A
REF
mV mV
mV mV mV
mA
AA
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CS8182
TYPICAL CHARACTERISTICS
18 16 14 12 10
8 6 4
QUIESCENT CURRENT (mA)
2 0
0 20 40 60 80 100 120 140 160 180 200
OUTPUT CURRENT (mA)
Figure 2. Quiescent Current vs. Output Current
1
0.9
0.8
0.7
0.6
0.5
0.4
I (V
OUT
) = 20 mA
0.3
0.2
QUIESCENT CURRENT (mA)
0.1 0
0 5 10 15 20 25 30 35 40 45
I (V
) = 1 mA
OUT
V
, INPUT VOLTAGE (V)
IN
Figure 3. Quiescent Current vs. Input Voltage
(Operating Mode)
20
* Graph is duplicate for VIN > 1.6 V.
18
**Dip (@5 V) shifts with V
16
(mA)
14
OUT
12 10
8
VIN = 6 V* V
= 5 V**
REF
CURRENT INTO V
6 4 2 0
0 5 10 15 20 25
FORCED V
REF
VIN = 0 V
VOLTAGE (V)
OUT
voltage.
100
90 80 70 60 50 40 30 20
QUIESCENT CURRENT (A)
10
0
0 5 10 15 20 25 30 35 40 45
V
, INPUT VOLTAGE (V)
IN
V
/ ENABLE = 0 V
REF
Figure 4. Quiescent Current vs. Input Voltage
(Sleep Mode)
140
* Graph is duplicate for VIN > 1.6 V. **Dip (@5 V) shifts with V
120
(mA)
100
OUT
80
60
40
CURRENT INTO V
20
0
0 5 10 15 20 25
FORCED V
voltage.
REF
VOLTAGE (V)
OUT
VIN = 6 V* V
REF
30 35 40
VIN = 0 V
= 5 V**
Figure 5. V
Reverse Current Figure 6. V
OUT
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Reverse Current
OUT
CS8182
CIRCUIT DESCRIPTION
ENABLE Function
By pulling the V
/ENABLE lead below 2.0 V typically,
REF
(see Figure 10 or Figure 11), the IC is disabled and enters a sleep state where the device draws less than 55 A from supply . W h e n th e V V
tracks the V
OUT
, 200 mA
V
Loads
Loads
OUT
C2**
10 F
Figure 7. Tracking Regulator at the Same Voltage
, 200 mA
V
OUT
C2**
10 F
/ENABLE lead i s g reater t han 2 .75 V,
REF
/ENABLE lead normally.
REF
V
OUT
GND GND Adj
V
OUT
V
OUT
GND GND Adj
V GND GND
CS8182
V
REF
ENABLE
V
REF
V GND GND
CS8182
V
REF
ENABLE
IN
/
C3*** 10 nF
IN
/
C3***
R2
10 nF
C1*
1.0 F
C1*
1.0 F
R1
B+
5.0 V
B+
V
REF
Output Voltage
The output is capable of supplying 200 mA to the load while configured as a similar (Figure 7), lower (Figure 9), or higher (Figure 8) voltage as the reference lead. The Adj lead acts as the inverting terminal of the op amp and the V
REF
lead as the non−inverting.
The device can also be configured as a high−side driver as displayed in Figure 12.
, 200 mA
V
C2**
10 F
OUT
R
R
V
OUT
GND
F
A
V
GND Adj
OUT
V GND GND
CS8182
V
REF
ENABLE
V
REF
IN
/
(1
C3*** 10 nF
R
E
R
A
C1*
1.0 F
)
Figure 8. Tracking Regulator at Higher Voltages
, 200 mA
V
C2**
10 F
OUT
V
OUT
GND GND Adj
V GND GND
CS8182
V
REF
ENABLE
IN
/
C3*** 10 nF
C1*
1.0 F
R
B+
V
B+
V
REF
REF
Loads
from MCU
V
OUT
V
REF
R2
(
R1 R2
)
Figure 9. Tracking Regulator at Lower Voltages
6.0 V−40 V
5.0 V
To Load
(e.g. sensor)
100 nF
10 F
V
IN
NCV8501
V
OUT
GND GND Adj
V GND GND
CS8182
V
REF
ENABLE
IN
V
(5.0 V)
REF
C1*
1.0 F
I/O
/
C3*** 10 nF
Figure 11. Alternative ENABLE Circuit
* C1 is required if the regulator is far from the power source filter. ** C2 is required for stability. *** C3 is recommended for EMC susceptibility.
Figure 10. Tracking Regulator with ENABLE Circuit
V
IN
GND GND
CS8182
V
REF
ENABLE
B V
/
C3*** 10 nF
SAT
C
V
V GND GND Adj
OUT
OUT
Figure 12. High−Side Driver
B+200 mA
MCU
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APPLICATION NOTES
V
Short to Battery
OUT
The CS8182 will survive a short to battery when hooked up the conventional way as shown in Figure 13. No damage to the part will occur. The part also endures a short to battery when powered by an isolated supply at a lower voltage as in
Short to battery
CS8182
Figure 14. In this case the CS8182 supply input voltage is set at 7 V when a short to battery (14 V typical) occurs on V which normally runs at 5 V. The current into the device (ammeter in Figure 14) will draw additional current as displayed in Figure 15.
OUT
V
70 mA
C2**
10 F
OUT
V
OUT
GND
GND
Adj
V
OUT
GND
GND
CS8182
V
ENABLE
= V
REF
Loads
Figure 13.
Short to battery
A
Automotive Battery typically 14 V
* C1 is required if the regulator is far from the power source filter. ** C2 is required for stability. *** C3 is recommended for EMC susceptibility.
Loads
C2**
10 F
V
OUT
70 mA
Figure 14.
V
REF
B+
IN
/
V
GND
GND
Adj
OUT
V
C3*** 10 nF
OUT
C1*
1.0 F
V
GND
GND
CS8182
V
REF
ENABLE
= V
REF
IN
+
Automotive Battery typically 14 V
5.0 V
+
5.0 V
B+
7 V
5.0 V
+
5.0 V
+
C1*
1.0 F
/
C3*** 10 nF
2.0
1.8
1.6
1.4
1.2
1.0
0.8
CURRENT (mA)
0.6
0.4
0.2 0
6510152025
7 8 9 11121314 16171819 21222324 26
V
VOLTAGE (V)
OUT
Figure 15. V
Short to Battery
OUT
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Switched Application
The CS8182 has been designed for use in systems where
the reference voltage on the V
/ENABLE pin is
REF
continuously on. Typically, the current into the V
/ENABLE pin will be less than 1.0 A when the
REF
voltage on the VIN pin (usually the ignition line) has been switched out (VIN can be at high impedance or at ground.) Reference Figure 16.
Ignition
V
OUT
C2
10 F
V
OUT
GND
GND
Adj
V
GND
GND
CS8182
V
REF
ENABLE
IN
/
< 1.0 A
Figure 16.
6
Switch
C1
1.0 F
V
REF
5.0 V
V
BAT
CS8182
External Capacitors
The output capacitor for the CS8182 is required for stability. Without it, the regulator output will oscillate. Actual size and type may vary depending upon the application load and temperature range. Capacitor effective series resistance (ESR) is also a factor in the IC stability. Worst−case is determined at the minimum ambient temperature and maximum load expected.
The output capacitor can be increased in size to any desired value above the minimum. One possible purpose of this would be to maintain the output voltage during brief conditions of negative input transients that might be characteristic of a particular system.
The capacitor must also be rated at all ambient temperatures expected in the system. To maintain regulator stability down to −40°C, a capacitor rated at that temperature must be used.
More information on capacitor selection for SMART REGULATORs is available in the SMART R EGULATOR application note, “Compensation for Linear Regulators,” document number SR003AN/D, available through our website at http://www.onsemi.com.
Calculating Power Dissipation in a Single Output Linear Regulator
The maximum power dissipation for a single output regulator (Figure 17) is:
PD(max) {VIN(max) V
VIN(max)I
Q
OUT
(min)}I
OUT
(max)
(1)
where:
V
V
I
OUT(max)
is the maximum input voltage,
IN(max) OUT(min)
is the minimum output voltage,
is the maximum output current, for the application,and IQ is the quiescent current the regulator consumes at I
OUT(max)
. Once the value of PD(max) is known, the maximum
permissible value of R
R
can be calculated:
JA
150°C  T
JA
A
P
D
(2)
The value of R
can then be compared with those in the
JA
package section of the data sheet. Those packages with R
’s less than the calculated value in equation 2 will keep
JA
the die temperature below 150°C.
In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heat sink will be required.
I
V
Heatsinks
IN
IN
Figure 17. Single Output Regulator with Key
Performance Parameters Labeled
SMART
REGULATOR
Control Features
I
Q
I
OUT
V
OUT
A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air.
Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of R
R
R
JA
JC
JA:
R
CS
R
SA
(3)
where:
R
= the junction−to−case thermal resistance,
JC
R
= the case−to−heatsink thermal resistance, and
CS
R
= the heatsink−to−ambient thermal resistance.
SA
appears in the package section of the data sheet. Like
R
JC
R
, it is a function of package type. R
JA
CS
and R
are
SA
functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heatsink manufacturers.
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−Y−
−Z−
CS8182
PACKAGE DIMENSIONS
SOIC−8
DF SUFFIX
CASE 751−07
ISSUE AB
NOTES:
−X− A
58
B
1
S
0.25 (0.010)
4
M
M
Y
K
G
N
C
SEATING PLANE
0.10 (0.004)
H
D
0.25 (0.010) Z
M
Y
SXS
X 45
M
J
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS
DIMAMIN MAX MIN MAX
4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8

N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244
INCHES
SOLDERING FOOTPRINT
7.0
0.275
0.6
0.024
Figure 18. SOIC−8
1.52
0.060
4.0
0.155
1.270
0.050
SCALE 6:1
inches
mm
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CS8182
PACKAGE DIMENSIONS
D2PAK−5
DP SUFFIX
CASE 936AC−01
ISSUE O
A
K
S
B
H
W
G
D
R
−A−
C
L
E
M
N
P
TERMINAL 6
V
U
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH AND METAL BURR.
4. PACKAGE OUTLINE INCLUSIVE OF PLATING THICKNESS.
5. FOOT LENGTH MEASURED AT INTERCEPT POINT BETWEEN DATUM A AND LEAD SURFACE.
DIM MIN MAX MIN MAX
A 0.396 0.406 10.05 10.31 B 0.330 0.340 8.38 8.64 C 0.170 0.180 4.31 4.57 D 0.026 0.036 0.66 0.91 E 0.045 0.055 1.14 1.40 G 0.067 REF 1.70 REF H 0.580 0.620 14.73 15.75 K 0.055 0.066 1.40 1.68 L 0.000 0.010 0.00 0.25 M 0.098 0.108 2.49 2.74 N 0.017 0.023 0.43 0.58 P 0.090 0.110 2.29 2.79 R 0 8

S 0.095 0.105 2.41 2.67 U 0.30 REF 7.62 REF V 0.305 REF 7.75 REF W 0.010 0.25
MILLIMETERSINCHES
0 8

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CS8182
SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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CS8182/D
10
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