ON Semiconductor CM1451 Users manual

EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers
Handheld PCs / PDAs
LCD and Camera Modules
Publication Order Number:
CM1451/D
15Bump, 3.006 mm x 1.376 mm Footprint Chip Scale Package (CM145106CP)
20Bump, 4.006 mm x 1.376 mm Footprint Chip Scale Package (CM145108CP)
These Devices are PbFree and are RoHS Compliant
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

CM1451

LCD and Camera EMI Filter Array with ESD Protection

Description

The CM1451 is an inductorcapacitor (LC) based EMI filter array with integrated ESD protection in CSP. The CM145106 and CM145108 are configured in 6 and 8 channel formats respectively. Each channel is implemented as a 5pole LC filter with the component values 9.5 pF 17 nH 9.5 pF 17 nF 9.5 pF. The CM1451’s rolloff frequency at 10 dB attenuation is 500 MHz. It can be used in applications where the data rates are as high as 200 Mbps while providing greater than 35 dB attenuation over the 800 MHz to 2.7 GHz frequency range. The device has ESD protection diodes on every pin that provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV, exceeding the Level 4 requirement of the IEC6100042 international standard. Using the MILSTD883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV.

This device is particularly wellsuited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easytouse pin assignments. In particular, the CM1451 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in wireless handsets while maintaining the integrity of signals that have rise/fall times as fast as 2 ns.

The CM1451 incorporates OptiGuard, a coating that results in improved reliability at assembly. The CM1451 is available in a spacesaving, lowprofile Chip Scale Package with RoHS compliant leadfree finishing.

Features

High Bandwidth, High RF Rejection Filter Array

Six and Eight Channels of EMI Filtering

Utilizes InductorBased Design Technology for True LC Filter Implementation

OptiGuard Coating for Improved Reliability

Chip Scale Package (CSP) Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance

15 kV ESD Protection on Each Channel (IEC 6100042 Level 4, Contact Discharge)

30 kV ESD Protection on Each Channel (HBM)

Better than 40 dB of Attenuation at 1 GHz

Maintains Signal Integrity for Signals that Have a Risetime and Falltime as Fast as 2 ns

Applications

LCD and Camera Data Lines in Mobile Handsets

I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs, etc.

Wireless Handsets / Cell Phones

http://onsemi.com

 

WLCSP15

 

 

 

WLCSP20

 

CP SUFFIX

 

 

CP SUFFIX

 

CASE 567BT

 

CASE 567CL

 

 

 

 

 

 

MARKING DIAGRAM

 

 

 

 

 

 

 

 

 

N516

 

 

 

 

N518

 

 

 

 

 

 

 

 

 

 

CM1451−06

 

 

 

 

CM1451−08

15−Bump CSP Package

20−Bump CSP Package

 

N516

= CM1451−06CP

 

N518

= CM1451−08CP

 

 

 

 

 

 

 

 

ORDERING INFORMATION

 

 

 

 

 

 

 

 

 

Device

 

Package

 

Shipping

CM1451−06CP

 

CSP−15

 

3500/Tape & Reel

 

 

 

(Pb−Free)

 

 

 

 

 

 

 

 

 

 

 

CM1451−08CP

 

CSP−20

 

3500/Tape & Reel

 

 

 

(Pb−Free)

 

 

 

 

 

 

 

 

 

 

 

 

Semiconductor Components Industries, LLC, 2013

1

April, 2013 − Rev. 3

 

CM1451

BLOCK DIAGRAM

L1 L2

FILTERn* FILTERn*

C1 C2 C3

GND

(Pins B1−Bm)

1 of n EMI Filtering + ESD Channels

(n = 6 for CM1451−06, 8 for CM1451−08, m=n/2)

*See Package/Pinout Diagrams for expanded pin information.

PACKAGE / PINOUT DIAGRAMS

 

 

 

 

 

Top View

 

 

 

 

Bottom View

 

 

 

Orientation

 

(Bumps Down View)

 

 

 

(Bumps Up View)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Marking

+ 1

2

3

4

5

6

 

 

 

 

 

 

 

 

(see Note)

 

 

 

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

C1

C2

C3

C4

C5

C6

 

 

 

B

 

 

N516

 

Orientation

 

B1

 

B2

B3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

Marking

 

A1

A2

A3

A4

A5

A6

 

 

 

 

 

 

 

 

 

 

A1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CM1451−06CP

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

15−Bump CSP Package

 

 

 

 

 

 

 

 

Orientation

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Marking

 

+ 1

2

3

4

5

6

7 8

 

 

 

 

 

 

 

 

(see Note)

A

C1

C2

C3

C4

C5

C6

C7

C8

 

 

 

 

 

 

 

 

 

B

 

 

 

N518

 

Orientation

B1

B2

 

B3

 

B4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

Marking

A1

A2

A3

A4

A5

A6

A7

A8

 

 

 

 

 

 

 

A1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CM1451−08CP

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20−Bump CSP Package

 

 

 

 

 

 

 

 

Note: Lead−free devices are specified by using a “+” character for the top side orientation mark.

Table 1. PIN DESCRIPTIONS

CM1451−06

CM1451−08

 

 

 

CM1451−06

CM1451−08

 

 

 

 

 

 

 

 

 

 

 

Pin(s)

Pin(s)

Name

Description

 

Pin(s)

Pin(s)

Name

Description

 

 

 

 

 

 

 

 

 

A1

A1

FILTER1

Filter Channel 1

 

C1

C1

FILTER1

Filter Channel 1

 

 

 

 

 

 

 

 

 

A2

A2

FILTER2

Filter Channel 2

 

C2

C2

FILTER2

Filter Channel 2

 

 

 

 

 

 

 

 

 

A3

A3

FILTER3

Filter Channel 3

 

C3

C3

FILTER3

Filter Channel 3

 

 

 

 

 

 

 

 

 

A4

A4

FILTER4

Filter Channel 4

 

C4

C4

FILTER4

Filter Channel 4

 

 

 

 

 

 

 

 

 

A5

A5

FILTER5

Filter Channel 5

 

C5

C5

FILTER5

Filter Channel 5

 

 

 

 

 

 

 

 

 

A6

A6

FILTER6

Filter Channel 6

 

C6

C6

FILTER6

Filter Channel 6

 

 

 

 

 

 

 

 

 

A7

FILTER7

Filter Channel 7

 

C7

FILTER7

Filter Channel 7

 

 

 

 

 

 

 

 

 

A8

FILTER8

Filter Channel 8

 

C8

FILTER8

Filter Channel 8

 

 

 

 

 

 

 

 

 

B1−B3

B1−B4

GND

Device Ground

 

 

 

 

 

 

 

 

 

 

 

 

 

 

http://onsemi.com

2

CM1451

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Units

 

 

 

Storage Temperature Range

−65 to +150

°C

 

 

 

Current per Inductor

30

mA

 

 

 

DC Package Power Rating

500

mW

 

 

 

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter

Rating

Units

 

 

 

Operating Temperature Range

−40 to +85

°C

 

 

 

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

 

 

 

 

 

 

 

LTOT

Total Channel Inductance (L1 + L2)

 

 

34

 

nH

L1, L2

Inductance

 

 

17

 

nH

RDC IN−OUT

DC Channel Resistance

 

 

18

 

W

CTOT

Total Channel Capacitance (C1 + C2 + C3)

At 2.5 V DC, 1 MHz,

22.8

28.5

34.2

pF

 

 

30 mV AC

 

 

 

 

 

 

 

 

 

 

 

C1, C2, C3

Capacitance

At 2.5 V DC, 1 MHz,

7.6

9.5

11.4

pF

 

 

30 mV AC

 

 

 

 

 

 

 

 

 

 

 

fC

Cut−off Frequency

 

 

260

 

MHz

 

ZSOURCE = 50 W, ZLOAD = 50 W

 

 

 

 

fRO

Roll−off Frequency at −10 dB Attenuation

 

 

500

 

MHz

 

ZSOURCE = 50 W, ZLOAD = 50 W

 

 

 

 

VDIODE

Diode Standoff Voltage

IDIODE = 10 mA

 

6.0

 

V

ILEAK

Diode Leakage Current

VDIODE = +3.3 V

 

0.1

1.0

mA

VSIG

Signal Clamp Voltage

ILOAD = 10 mA

5.6

6.8

9.0

V

 

Positive Clamp

 

 

 

Negative Clamp

 

−1.5

−0.8

−0.4

 

 

 

 

 

 

 

 

VESD

In−system ESD Withstand Voltage

(Note 2)

 

 

 

kV

 

a) Human Body Model, MIL−STD−883, Method 3015

 

30

 

 

 

 

b) Contact Discharge per IEC 61000−4−2 Level 4

 

15

 

 

 

 

 

 

 

 

 

 

RDYN

Dynamic Resistance

 

 

 

 

W

 

Positive

 

 

2.30

 

 

 

Negative

 

 

0.90

 

 

 

 

 

 

 

 

 

1.TA = 25°C unless otherwise specified.

2.ESD applied to input and output pins with respect to GND, one at a time.

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3

ON Semiconductor CM1451 Users manual

CM1451

PERFORMANCE INFORMATION

Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)

Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B1)

Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B1)

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