ON Semiconductor CM1420, CM1422 User Manual

CM1420, CM1422

LCD EMI Filter Array with ESD Protection

Description

The CM1420 and CM1422 are EMI filter arrays with ESD protection, which integrate six and eight Pi−filters (C−R−C), respectively. The CM1420/22 has component values of 15 pF − 100  − 15 pF. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV, well beyond the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV.

This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easy−to−use pin assignments. In particular, the CM1420/22 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets.

The CM1420 and CM1422 incorporate OptiGuardt coating which results in improved reliability at assembly. The CM1420 and CM1422 are available in space−saving, low−profile chip scale packages with RoHS compliant lead−free finishing.

Features

• Functionally and Pin Compatible with CSPEMI606 (CM1420) and

CSPEMI608 (CM1422) Devices

• OptiGuardtCoated for Improved Reliability at Assembly

• Six and Eight Channels of EMI Filtering

• ±15 kV ESD Protection on Each Channel

(IEC 61000−4−2 Level 4, Contact Discharge)

• ±30 kV ESD Protection on Each Channel (HBM)

• Better than 30 dB of Attenuation at 1 GHz to 3 GHz

• Chip Scale Package Features Extremely Low Lead Inductance for

Optimum Filter and ESD Performance

• 15−Bump, 2.960 mm x 1.330 mm Footprint Chip Scale Package

(CM1420)

• 20−Bump, 4.000 mm x 1.458 mm Footprint Chip Scale Package

(CM1422)

• These Devices are Pb−Free and are RoHS Compliant

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WLCSP15

CP SUFFIX

CASE 567BS

MARKING DIAGRAM

N203

CM1420

15−Bump CSP Package

N203 = CM1420−03CP N223 = CM1422−03CP

ORDERING INFORMATION

Device Package Shipping

CM1420−03CP CSP−15

(Pb−Free)

CM1422−03CP CSP−20

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

WLCSP20

CP SUFFIX

CASE 567BZ

N223

CM1422

20−Bump CSP Package

†

3500/Tape & Reel

Applications

• LCD Data Lines in Clamshell Wireless Handsets

• EMI Filtering & ESD Protection for High−Speed I/O Data Ports

• Wireless Handsets / Cell Phones

• Notebook Computers

• PDAs / Handheld PCs

• EMI Filtering for High−Speed Data Lines

March, 2011 − Rev. 4

1 Publication Order Number:

CM1420/D

CM1420, CM1422

BLOCK DIAGRAM

100 

FILTERn*

15 pF 15 pF

GND

(Pins B1−Bn)

1 of n EMI Filtering + ESD Channels

(n = 6 for CM1420, 8 for CM1422)

*See Package/Pinout Diagrams for expanded pin information.

PACKAGE / PINOUT DIAGRAMS

FILTERn*

Bottom View

(Bumps Up View)

C3 C4

A3 A4

C3 C4

A3 A4

C5 C6

A5 A6

C5 C6

A5 A6

Orientation

Marking

Orientation

Marking

123

(Bumps Down View)

123

Top View

564

N203

CM1420 CSP Package

56748

N223

CM1422 CSP Package

Orientation

Marking

Orientation

Marking

C1 C2

A1 A2

C1 C2

A1 A2

Table 1. PIN DESCRIPTIONS

CM1420 CM1422

Pin(s) Pin(s) Pin(s) Pin(s)

A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1

A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2

A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3

A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4

A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5

A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6

− A7 FILTER7 Filter Channel 7 − C7 FILTER7 Filter Channel 7

− A8 FILTER8 Filter Channel 8 − C8 FILTER8 Filter Channel 8

B1−B3 B1−B4 GND Device Ground

Name Description

CM1420 CM1422

Name Description

C7 C8

A7 A8

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CM1420, CM1422

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range −65 to +150 °C

DC Power per Resistor 100 mW

DC Package Power Rating 500 mW

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range −40 to +85 °C

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol Parameter Conditions Min Typ Max Units

R Resistance 80 100 120

C Capacitance At 2.5 V DC, 1 MHz,

12 15 18 pF

30 mV AC

DIODE

LEAK

ESD

DYN

1. T

2. ESD applied to input and output pins with respect to GND, one at a time.

Diode Standoff Voltage

Diode Leakage Current (reverse bias) V

Signal Clamp Voltage

SIG

Positive Clamp Negative Clamp

In−system ESD Withstand Voltage

a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4

Dynamic Resistance

Positive Negative

Cut−off Frequency

= 25 °C unless otherwise specified.

SOURCE

= 50 , Z

LOAD

= 50 

= 10 A

DIODE

= 3.3 V 100 200 nA

DIODE

= 10 mA

LOAD

(Note 3)

5.6

−1.5

6.0 V

6.8

−0.8

(Note 2)

±30 ±15

2.30

0.90

R = 100 , C = 15 pF

120

9.0

−0.4

3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping

voltage is measured at Pin C1.



MHz

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CM1420, CM1422

PERFORMANCE INFORMATION

Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)

Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B1)

Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B1)

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