4 and 8-Channel EMI Filter
Arrays with ESD Protection
Product Description
The CM1406 is an EMI filter array with ESD protection, which
integrates either four or eight pi filters (C−R−C). Each CM1406 filter
has component values of 15 pF − 200 W − 15 pF. These parts include
ESD protection diodes on every pin, providing a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD diodes connected to the
filter ports safely dissipate ESD strikes of ±15 kV contact discharge,
twice the specification requirement of the IEC 61000−4−2, Level 4
international standard. Using the MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than ±30 kV.
This device is particularly well suited for portable electronics
(e.g. mobile handsets, PDAs, notebook computers) because of its
small package and easy−to−use pin assignments. In particular, the
CM1406 is ideal for EMI filtering and protecting data lines from ESD
in wireless handsets.
The CM1406 is available in space−saving, low−profile, 8−lead and
16−lead WDFN packages. It is fabricated with Centuriont process
and available with lead−free finishing.
DE SUFFIX
CASE 511BE
FILTERn*
GND
http://onsemi.com
WDFN8
BLOCK DIAGRAM
15 pF
WDFN16
DE SUFFIX
CASE 511AU
200 W
FILTERn*
15 pF
Features
• Four and Eight Channels of EMI Filtering with ESD Protection
1 of 4/8 EMI Filtering + ESD Channels
See Package/Pinout Diagrams for Expanded Pin Information.
• Greater than 30 dB of Attenuation from 800 MHz to 3 GHz
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Figure 13. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5 V DC and 255C)
Centurion is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
16
1
SCALE 4:1
B
A1
A
E
(A3)
16X
A
L
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
0.08 C
NOTE 4
DETAIL A
D
TOP VIEW
DETAIL B
SIDE VIEW
D2
18
WDFN16, 4x1.6, 0.5P
CASE 511AU−01
ISSUE O
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
MOLD CMPDEXPOSED Cu
CONSTRUCTIONS
E2
C
SEATING
PLANE
L
DETAIL B
ALTERNATE
A1
DATE 06 JUL 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER
L
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MINMAX
A3
A0.700.80
A1 0.000.05
A30.20 REF
b0.200.30
D4.00 BSC
D2 3.103.30
E1.60 BSC
E2 0.300.50
e0.50 BSC
F0.25 REF
K0.30 REF
L0.200.40
L1−−−0.15
K
F
e
e/2
916
16X
b
0.10B
0.05ACC
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
4.30
2X
0.35
3.30
3X
0.50
16X
0.30
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
PITCH
16X
0.53
1.90
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 2:1
B
DETAIL B
A1
4
5
A
8X
E
A
8X
E2
b
0.10 C
0.05 C
L
A3
8X
0.50
C
PIN ONE
REFERENCE
2X
2X
NOTE 4
DETAIL A
PACKAGE
OUTLINE
D
C0.10
C0.10
TOP VIEW
C0.10
C0.08
SIDE VIEW
D2
1
K
8
e
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
1.70
WDFN8 2x2, 0.5P
CASE 511BE−01
ISSUE A
L1
SEATING
PLANE
A
BB
NOTE 3
L
DETAIL A
ALTERNATE
CONSTRUCTIONS
MOLD CMPDEXPOSED Cu
DETAIL B
ALTERNATE
CONSTRUCTIONS
DATE 27 MAY 2011
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
A3
A1
DIM MINMAX
A0.700.80
A10.000.05
A30.20 REF
b0.200.30
D2.00 BSC
D21.501.70
E2.00 BSC
E20.801.00
e0.50 BSC
K0.25 REF
L0.200.40
L1−−−0.15
GENERIC
MARKING DIAGRAM*
1
XX MG
G
XX = Specific Device Code
M= Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X
0.30
2.30
1.00
0.50
PITCH
1
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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