ON Semiconductor CM1406 User Manual

CM1406
*
4 and 8-Channel EMI Filter Arrays with ESD Protection
Product Description
integrates either four or eight pi filters (C−R−C). Each CM1406 filter has component values of 15 pF − 200 W 15 pF. These parts include ESD protection diodes on every pin, providing a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV contact discharge, twice the specification requirement of the IEC 61000−4−2, Level 4 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV.
This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy−to−use pin assignments. In particular, the CM1406 is ideal for EMI filtering and protecting data lines from ESD in wireless handsets.
The CM1406 is available in space−saving, low−profile, 8−lead and 16lead WDFN packages. It is fabricated with Centuriont process and available with lead−free finishing.
DE SUFFIX
CASE 511BE
FILTERn*
GND
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WDFN8
BLOCK DIAGRAM
15 pF
WDFN16
DE SUFFIX
CASE 511AU
200 W
FILTERn*
15 pF
Features
Four and Eight Channels of EMI Filtering with ESD Protection
1 of 4/8 EMI Filtering + ESD Channels
See Package/Pinout Diagrams for Expanded Pin Information.
Greater than 30 dB of Attenuation from 800 MHz to 3 GHz
±15 kV ESD Protection (IEC 6100042, Contact Discharge)
MARKING DIAGRAM
±30 kV ESD Protection (HBM)
Fabricated with Centuriont Advanced Low Capacitance Zener
Process Technology
N06
4E
N68E M
Space Saving, LowProfile 8 and 16Lead WDFN Packages
These Devices are PbFree and are RoHS Compliant
Applications
N06 4E = CM1406−04DE N68E = CM1406−08DE
I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs etc.
EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
EMI Filtering for LCD, Camera and ChiptoChip Data Lines
CM140604DE WDFN8
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
ORDERING INFORMATION
Device Package Shipping
(PbFree)
WDFN16
(PbFree)
3000/Tape & Reel
3000/Tape & ReelCM140608DE
© Semiconductor Components Industries, LLC, 2011
March, 2011 Rev. 3
1 Publication Order Number:
CM1406/D
CM1406
PACKAGE / PINOUT DIAGRAMS
CM140604DE
8Lead WDFN Package
CM140608DE
16Lead WDFN Package
with Exposed End Pads
Pin 1 Marking
Top View
(Pins Down View)
87 65
N06
Pin 1
Marking
16 15 14 13 12 11 10 9
12 345678
4E
12 34
N68E
16 15 14 13 12 11 10 9
Bottom View
(Pins Up View)
1234
GND
PAD
8765
12345678
GND PAD
Table 1. PIN DESCRIPTIONS
Pins
140604Dx 140608Dx 140604Dx 140608Dx
1 1 FILTER1 Filter Channel 1 8 16 FILTER1 Filter Channel 1
2 2 FILTER2 Filter Channel 2 7 15 FILTER2 Filter Channel 2
3 3 FILTER3 Filter Channel 3 6 14 FILTER3 Filter Channel 3
4 4 FILTER4 Filter Channel 4 5 13 FILTER4 Filter Channel 4
5 FILTER5 Filter Channel 5 12 FILTER5 Filter Channel 5
6 FILTER6 Filter Channel 6 11 FILTER6 Filter Channel 6
7 FILTER7 Filter Channel 7 10 FILTER7 Filter Channel 7
8 FILTER8 Filter Channel 8 9 FILTER8 Filter Channel 8
GND Pad GND Device Ground
Name Description
Pins
Name Description
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2
CM1406
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range –65 to +150 °C
DC Power per Resistor 100 mW
Package DC Power Rating 300 mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range –40 to +85 °C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol Parameter Conditions Min Typ Max Units
R Resistance 160 200 240
C Capacitance At 2.5 V DC, 1 MHz, 30 mV AC 12 15 18 pF
V
DIODE
I
LEAK
V
V
SIG
ESD
Diode Standoff Voltage
Diode Leakage Current (Reverse Bias) V
Signal Voltage
Positive Clamp Negative Clamp
Insystem ESD Withstand Voltage
a) Human Body Model, MILSTD883,
I
= 10 mA
DIODE
= 3.3 V 0.1 1
DIODE
I
LOAD
I
LOAD
= 10 mA = 10 mA
5.6
1.5
(Note 2)
30
6.0 V
6.8
0.8
Method 3015
b) Contact Discharge per
15
IEC 61000−4−2 Level 4
f
C
1. T
= 25°C unless otherwise specified.
A
2. ESD applied to input and output pins with respect to GND, one at a time.
Cutoff Frequency
SOURCE
= 50 W, Z
Z
LOAD
= 50 W
R = 200 W, C = 15 pF
105
9.0
0.4
W
mA
V
kV
MHz
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3
CM1406
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 1. Channel 1 EMI Filter Performance (CM140604 only)
Figure 2. Channel 2 EMI Filter Performance (CM140604 only)
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4
CM1406
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 3. Channel 3 EMI Filter Performance (CM140604 only)
Figure 4. Channel 4 EMI Filter Performance (CM140604 only)
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5
CM1406
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 5. Channel 1 EMI Filter Performance (CM140608 only)
Figure 6. Channel 2 EMI Filter Performance (CM140608 only)
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6
CM1406
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 7. Channel 3 EMI Filter Performance (CM140608 only)
Figure 8. Channel 4 EMI Filter Performance (CM140608 only)
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7
CM1406
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 9. Channel 5 EMI Filter Performance (CM140608 only)
Figure 10. Channel 6 EMI Filter Performance (CM140608 only)
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8
CM1406
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment)
Figure 11. Channel 7 EMI Filter Performance (CM140608 only)
Figure 12. Channel 8 EMI Filter Performance (CM140608 only)
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9
CM1406
PERFORMANCE INFORMATION (Cont’d)
Figure 13. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5 V DC and 255C)
Centurion is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
16
1
SCALE 4:1
B
A1
A
E
(A3)
16X
A
L
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
0.08 C
NOTE 4
DETAIL A
D
TOP VIEW
DETAIL B
SIDE VIEW
D2
18
WDFN16, 4x1.6, 0.5P
CASE 511AU−01
ISSUE O
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
MOLD CMPDEXPOSED Cu
CONSTRUCTIONS
E2
C
SEATING PLANE
L
DETAIL B
ALTERNATE
A1
DATE 06 JUL 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER
L
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A3
A 0.70 0.80 A1 0.00 0.05 A3 0.20 REF
b 0.20 0.30
D 4.00 BSC D2 3.10 3.30
E 1.60 BSC
E2 0.30 0.50
e 0.50 BSC F 0.25 REF
K 0.30 REF
L 0.20 0.40
L1 −−− 0.15
K
F
e
e/2
916
16X
b
0.10 B
0.05ACC
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
4.30
2X
0.35
3.30
3X
0.50
16X
0.30
DIMENSION: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
0.50 PITCH
16X
0.53
1.90
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON48925E
WDFN16, 4X1.6, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 2:1
B
DETAIL B
A1
4
5
A
8X
E
A
8X
E2
b
0.10 C
0.05 C
L
A3
8X
0.50
C
PIN ONE
REFERENCE
2X
2X
NOTE 4
DETAIL A
PACKAGE
OUTLINE
D
C0.10
C0.10
TOP VIEW
C0.10
C0.08
SIDE VIEW
D2
1
K
8
e
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
1.70
WDFN8 2x2, 0.5P
CASE 511BE−01
ISSUE A
L1
SEATING PLANE
A
BB
NOTE 3
L
DETAIL A
ALTERNATE
CONSTRUCTIONS
MOLD CMPDEXPOSED Cu
DETAIL B
ALTERNATE
CONSTRUCTIONS
DATE 27 MAY 2011
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
MILLIMETERS
A3
A1
DIM MIN MAX
A 0.70 0.80 A1 0.00 0.05 A3 0.20 REF
b 0.20 0.30
D 2.00 BSC D2 1.50 1.70
E 2.00 BSC E2 0.80 1.00
e 0.50 BSC
K 0.25 REF
L 0.20 0.40 L1 −−− 0.15
GENERIC
MARKING DIAGRAM*
1
XX MG
G
XX = Specific Device Code M = Date Code G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking. PbFree indicator, “G” or microdot “ G”, may or may not be present.
8X
0.30
2.30
1.00
0.50 PITCH
1
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON48936E
WDFN8, 2X2, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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