ON Semiconductor CM1402 User manual

CM1402

SIM Card EMI Filter Array
with ESD Protection

Product Description

The CM1402 is an EMI filter array with ESD protection, which

integrates three pi filters (C−R−C) and two additional channels of ESD
protection. The CM1402 has component values of 20 pF − 47  −
20 pF, and 20 pF − 100  − 20 pF. The parts include avalanche−type
ESD diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD diodes connected to the
filter ports are designed and characterized to safely dissipate ESD
strikes of ±10 kV, beyond the maximum requirement of the IEC
61000−4−2 international standard. Using the MIL−STD−883 (Method

3015) specification for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than ±25 kV.

The ESD diodes on pins A4 and C4 ports are designed and
characterized to safely dissipate ESD strikes of ±10 kV, well beyond
the maximum requirement of the IEC 61000−4−2 international
standard.

This device is particularly well suited for portable electronics (e.g.
mobile handsets, PDAs, notebook computers) because of its small
package format and easy−to−use pin assignments. In particular, the
CM1402 is ideal for EMI filtering and protecting data lines from ESD
for the SIM card slot in mobile handsets.

The CM1402 incorporates OptiGuardt coating which results in
improved reliability at assembly. The CM1402 is available in a
space−saving, low−profile Chip Scale Package.

Features

• Functionally and Pin−Compatible with CSPEMI400 Device

• OptiGuardt Coated for Improved Reliability at Assembly

• Three Channels of EMI Filtering, Each with ESD Protection

• Two Additional Channels of ESD−Only Protection

• ±10 kV ESD Protection (IEC 61000−4−2, Contact Discharge) on

All Pins

• ±25 kV ESD Protection (HBM)

• Greater than 30 dB of Attenuation at 1 GHz

• 10−Bump, 1.960 mm x 1.330 mm Footprint Chip Scale Package

(CSP)

• Chip Scale Package Features Extremely Low Lead Inductance for

Optimum Filter and ESD Performance

• These Devices are Pb−Free and are RoHS Compliant

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WLCSP10

CP SUFFIX

CASE 567BL

MARKING DIAGRAM

CE MG

G

CE = CM1402−03CP
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)

ORDERING INFORMATION

Device Package Shipping

CSP−10

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.

3500/Tape & ReelCM1402−03CP

†

Applications

• SIM Card Slot in Mobile Handsets

• I/O Port Protection for Mobile Handsets, Notebook Computers,

PDAs, etc.

• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook

Computers

© Semiconductor Components Industries, LLC, 2011

March, 2011 − Rev. 4

1 Publication Order Number:

CM1402/D

A1

A3

CM1402

ELECTRICAL SCHEMATIC

R

1

C1 A2

CC CC

GND

R

1

C3

R

2

C2

C4A4

CC

Table 1. PIN DESCRIPTIONS

10−bump CSP Package

Type Pin Description

EMI Filter

EMI Filter

Device

Ground

EMI Filter

ESD Channel A4 ESD Protection Channel − VCC Supply

ESD Channel C4 ESD Protection Channel

A1

EMI Filter with ESD Protection for RST
Signal

C1

EMI Filter with ESD Protection for RST
Signal

A2

EMI Filter with ESD Protection for CLK
Signal

C2

EMI Filter with ESD Protection for CLK
Signal

B1

Device Ground

B2

Device Ground

A3

EMI Filter with ESD Protection for DAT
Signal

C3

EMI Filter with ESD Protection for DAT
Signal

B1,B2

Orientation

Marking

CC

PACKAGE / PINOUT DIAGRAMS

Top View

(Bumps Down View)

123

4

+

A

B

C

A4

C4

CE

Bottom View

(Bumps Up View)

A3 A2 A1

B2

C3 C2 C1

B1

R1 = 100 
R

= 47 

2

Orientation
Marking

A1

CSP Package with OptiGuard coating

CM1402

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range –65 to +150 °C

DC Power per Resistor 100 mW

DC Package Power Rating 300 mW

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

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CM1402

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range –40 to +85 °C

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol

R

1

R

2

Resistance of R

Resistance of R

C Capacitance VIN = 2.5 VDC, 1 MHz, 30 mV ac 16 20 24 pF

V

STANDOFF

I

LEAK

V

SIG

Stand−off Voltage

Diode Leakage Current V

Signal Voltage

Positive Clamp
Negative Clamp

V

ESD

In−system ESD Withstand Voltage

a) Human Body Model, MIL−STD−883,

Method 3015

b) Contact Discharge per IEC 61000−4−2

V

CL

Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV

Positive Transients
Negative Transients

f

C1

f

C2

1. T

= 25°C unless otherwise specified.

A

2. ESD applied to input and output pins with respect to GND, one at a time.

Cut−off Frequency

Z

SOURCE

Cut−off Frequency

Z

SOURCE

3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping

voltage is measured at Pin C1.

4. Unused pins are left open.

Parameter Conditions Min Typ Max Units

1

2

I = 10 A

= 3.3 V 0.1 1.0

BIAS

I

= 10 mA

LOAD

I

= −10 mA

LOAD

80 100 120

38 47 56

6.0 V

5.6

−1.5

6.8

–0.8

9.0

−0.4

(Notes 2 and 4)

±25

±10

(Notes 2, 3 and 4)

+12

−7

R = 100 , C = 20 pF

= 50 , Z

LOAD

= 50 

77

R = 47 , C = 20 pF

= 50 , Z

LOAD

= 50 

85





A

V

kV

V

MHz

MHz

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