ON Semiconductor CM1402 User manual

CM1402

SIM Card EMI Filter Array with ESD Protection

Product Description

The CM1402 is an EMI filter array with ESD protection, which

integrates three pi filters (C−R−C) and two additional channels of ESD protection. The CM1402 has component values of 20 pF − 47  − 20 pF, and 20 pF − 100  − 20 pF. The parts include avalanche−type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±10 kV, beyond the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method

3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25 kV.

The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10 kV, well beyond the maximum requirement of the IEC 61000−4−2 international standard.

This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy−to−use pin assignments. In particular, the CM1402 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets.

The CM1402 incorporates OptiGuardt coating which results in improved reliability at assembly. The CM1402 is available in a space−saving, low−profile Chip Scale Package.

Features

• Functionally and Pin−Compatible with CSPEMI400 Device

• OptiGuardt Coated for Improved Reliability at Assembly

• Three Channels of EMI Filtering, Each with ESD Protection

• Two Additional Channels of ESD−Only Protection

• ±10 kV ESD Protection (IEC 61000−4−2, Contact Discharge) on

All Pins

• ±25 kV ESD Protection (HBM)

• Greater than 30 dB of Attenuation at 1 GHz

• 10−Bump, 1.960 mm x 1.330 mm Footprint Chip Scale Package

(CSP)

• Chip Scale Package Features Extremely Low Lead Inductance for

Optimum Filter and ESD Performance

• These Devices are Pb−Free and are RoHS Compliant

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WLCSP10

CP SUFFIX

CASE 567BL

MARKING DIAGRAM

CE MG

CE = CM1402−03CP M = Date Code G = Pb−Free Package (Note: Microdot may be in either location)

ORDERING INFORMATION

Device Package Shipping

CSP−10

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

3500/Tape & ReelCM1402−03CP

†

Applications

• SIM Card Slot in Mobile Handsets

• I/O Port Protection for Mobile Handsets, Notebook Computers,

PDAs, etc.

• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook

Computers

March, 2011 − Rev. 4

1 Publication Order Number:

CM1402/D

CM1402

ELECTRICAL SCHEMATIC

C1 A2

CC CC

GND

C4A4

Table 1. PIN DESCRIPTIONS

10−bump CSP Package

Type Pin Description

EMI Filter

Device

Ground

EMI Filter

ESD Channel A4 ESD Protection Channel − VCC Supply

ESD Channel C4 ESD Protection Channel

EMI Filter with ESD Protection for RST Signal

EMI Filter with ESD Protection for CLK Signal

Device Ground

EMI Filter with ESD Protection for DAT Signal

B1,B2

Orientation

Marking

PACKAGE / PINOUT DIAGRAMS

Top View

(Bumps Down View)

123

Bottom View

(Bumps Up View)

A3 A2 A1

C3 C2 C1

R1 = 100  R

= 47 

Orientation Marking

CSP Package with OptiGuard coating

CM1402

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range –65 to +150 °C

DC Power per Resistor 100 mW

DC Package Power Rating 300 mW

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

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CM1402

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range –40 to +85 °C

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol

Resistance of R

C Capacitance VIN = 2.5 VDC, 1 MHz, 30 mV ac 16 20 24 pF

STANDOFF

LEAK

SIG

Stand−off Voltage

Diode Leakage Current V

Signal Voltage

Positive Clamp Negative Clamp

ESD

In−system ESD Withstand Voltage

a) Human Body Model, MIL−STD−883,

Method 3015

b) Contact Discharge per IEC 61000−4−2

Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV

Positive Transients Negative Transients

1. T

= 25°C unless otherwise specified.

2. ESD applied to input and output pins with respect to GND, one at a time.

Cut−off Frequency

SOURCE

Cut−off Frequency

SOURCE

3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping

voltage is measured at Pin C1.

4. Unused pins are left open.

Parameter Conditions Min Typ Max Units

I = 10 A

= 3.3 V 0.1 1.0

BIAS

= 10 mA

LOAD

= −10 mA

LOAD

80 100 120

38 47 56

6.0 V

5.6

−1.5

6.8

–0.8

9.0

−0.4

(Notes 2 and 4)

±25

±10

(Notes 2, 3 and 4)

+12

−7

R = 100 , C = 20 pF

= 50 , Z

LOAD

= 50 

R = 47 , C = 20 pF

= 50 , Z

LOAD

= 50 



A

MHz

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CM1402

PERFORMANCE INFORMATION

Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)

Figure 1. A1−C1 EMI Filter Performance

Figure 2. A2−C2 EMI Filter Performance

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CM1402

PERFORMANCE INFORMATION (Cont’d)

Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)

Figure 3. A3−C3 EMI Filter Performance

Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC)

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CM1402

APPLICATION INFORMATION

The CM1402 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high−frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Typical Application Diagram for the SIM Card Interface.

Note: One channel of the CM1402 with a zener diode is not shown on the diagram.

Figure 5. Typical Application Diagram for the SIM Card Interface

For best filter and ESD performance, both GND bumps (B1, B2) of the CM1402 should be directly connected to the Ground plane. A small capacitor of about 1

F is required next to the V

pin of the SIM connector in order to improve

stability of the SIM card supply rail.

For information on the assembly of the CM1402 to the PCB (printed circuit board), please refer to the Chip Scale Package (CSP) Application Note AP217, or contact factory at 800−282−9855 for technical support.

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CM1402

APPLICATION INFORMATION

Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS

Parameter Value

Pad Size on PCB 0.240 mm

Pad Shape Round

Pad Definition Non−Solder Mask defined pads

Solder Mask Opening 0.290 mm Round

Solder Stencil Thickness 0.125 − 0.150 mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round

Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish OSP (Entek Cu Plus 106A)

Tolerance − Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous (183°C) 60 seconds

Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C

±50 m

±20 m

Non−Solder Mask Defined Pad

0.240 mm DIA.

Solder Stencil Opening

0.300 mm DIA.

Solder Mask Opening

0.290 mm DIA.

Figure 6. Recommended Non−Solder Mask Defined Pad Illustration

Figure 7. Lead−free (SnAgCu) Solder Ball Reflow Profile

OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC).

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MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SCALE 4:1

WLCSP10, 1.96x1.33

CASE 567BL−01

ISSUE O

DATE 26 JUL 2010

REFERENCE

NOTE 3

0.03 C

PIN A1

0.05 C

10X

A0.05 BC

TOP VIEW

OptiGuard Option

SIDE VIEW

123

BOTTOM VIEW

eD/2

456

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS.

MILLIMETERS

DIMAMIN MAX

A1 A2 0.40 REF

b 0.29 0.35

D 1.96 BSC

E eD 0.50 BSC eE 0.435 BSC

0.72

0.56

0.21 0.27

1.33 BSC

RECOMMENDED

SOLDERING FOOTPRINT*

SEATING PLANE

0.25

0.87

0.44

0.50

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

0.25

PACKAGE

OUTLINE

10X

0.25

DIMENSIONS: MILLIMETERS

DOCUMENT NUMBER:

DESCRIPTION:

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.

98AON49820E

WLCSP10, 1.96X1.33

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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ON Semiconductor CM1402 User manual

Specifications and Main Features

Frequently Asked Questions

User Manual