ON Semiconductor CM1402 User manual

CM1402

SIM Card EMI Filter Array with ESD Protection

Product Description

The CM1402 is an EMI filter array with ESD protection, which integrates three pi filters (C−R−C) and two additional channels of ESD protection. The CM1402 has component values of 20 pF − 47 W − 20 pF, and 20 pF − 100 W − 20 pF. The parts include avalanche−type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±10 kV, beyond the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25 kV.

The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10 kV, well beyond the maximum requirement of the IEC 61000−4−2 international standard.

This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy−to−use pin assignments. In particular, the CM1402 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets.

The CM1402 incorporates OptiGuardt coating which results in improved reliability at assembly. The CM1402 is available in a space−saving, low−profile Chip Scale Package.

Features

•Functionally and Pin−Compatible with CSPEMI400 Device

•OptiGuardt Coated for Improved Reliability at Assembly

•Three Channels of EMI Filtering, Each with ESD Protection

•Two Additional Channels of ESD−Only Protection

•±10 kV ESD Protection (IEC 61000−4−2, Contact Discharge) on All Pins

•±25 kV ESD Protection (HBM)

•Greater than 30 dB of Attenuation at 1 GHz

•10−Bump, 1.960 mm x 1.330 mm Footprint Chip Scale Package (CSP)

•Chip Scale Package Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance

•These Devices are Pb−Free and are RoHS Compliant

Applications

•SIM Card Slot in Mobile Handsets

•I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs, etc.

•EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers

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		WLCSP10
		CP SUFFIX
		CASE 567BL
	MARKING DIAGRAM
		CE MG
		G
CE	= CM1402−03CP
M	= Date Code

G= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

Device	Package	Shipping†
CM1402−03CP	CSP−10	3500/Tape & Reel
	(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

♥ Semiconductor Components Industries, LLC, 2011	1	Publication Order Number:
March, 2011 − Rev. 4		CM1402/D

CM1402

ELECTRICAL SCHEMATIC

			R1			R2
		A1		C1	A2				C2
			C	C		C	C
				GND
			R1
		A3		C3	A4				C4
			C	C		C	C
									R1 = 100 W
				B1,B2					R2 = 47 W
	Table 1. PIN DESCRIPTIONS					PACKAGE / PINOUT DIAGRAMS
		10−bump CSP Package					Top View
	Type	Pin	Description		Orientation		(Bumps Down View)
						1	2	3	4
	EMI Filter	A1	EMI Filter with ESD Protection for RST		Marking
						+
			Signal		A
		C1	EMI Filter with ESD Protection for RST
			Signal				CE
	EMI Filter	A2	EMI Filter with ESD Protection for CLK		B
			Signal
		C2	EMI Filter with ESD Protection for CLK		C
			Signal
	Device	B1	Device Ground
	Ground	B2	Device Ground				Bottom View		Orientation
							(Bumps Up View)		Marking
	EMI Filter	A3
			EMI Filter with ESD Protection for DAT						A1
			Signal
		C3	EMI Filter with ESD Protection for DAT			A4	A3	A2	A1
			Signal
	ESD Channel	A4	ESD Protection Channel − VCC Supply				B2	B1
	ESD Channel	C4	ESD Protection Channel			C4	C3	C2	C1
							CM1402
						CSP Package with OptiGuard coating
				SPECIFICATIONS
	Table 2. ABSOLUTE MAXIMUM RATINGS
			Parameter				Rating		Units
	Storage Temperature Range						–65 to +150		°C
	DC Power per Resistor							100	mW
	DC Package Power Rating							300	mW

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

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CM1402

Table 3. STANDARD OPERATING CONDITIONS

Parameter	Rating	Units
Operating Temperature Range	–40 to +85	°C

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol	Parameter	Conditions	Min	Typ	Max	Units
R1	Resistance of R1		80	100	120	W
R2	Resistance of R2		38	47	56	W
C	Capacitance	VIN = 2.5 VDC, 1 MHz, 30 mV ac	16	20	24	pF
VSTANDOFF	Stand−off Voltage	I = 10 mA		6.0		V
ILEAK	Diode Leakage Current	VBIAS = 3.3 V		0.1	1.0	mA
VSIG	Signal Voltage					V
	Positive Clamp	ILOAD = 10 mA	5.6	6.8	9.0
	Negative Clamp	ILOAD = −10 mA	−1.5	–0.8	−0.4
VESD	In−system ESD Withstand Voltage	(Notes 2 and 4)	±25			kV
	a) Human Body Model, MIL−STD−883,
	Method 3015		±10
	b) Contact Discharge per IEC 61000−4−2
VCL	Clamping Voltage during ESD Discharge	(Notes 2, 3 and 4)				V
	MIL−STD−883 (Method 3015), 8 kV
	Positive Transients				+12
	Negative Transients				−7
fC1	Cut−off Frequency	R = 100 W, C = 20 pF		77		MHz
	ZSOURCE = 50 W, ZLOAD = 50 W
fC2	Cut−off Frequency	R = 47 W, C = 20 pF		85		MHz
	ZSOURCE = 50 W, ZLOAD = 50 W

1.TA = 25°C unless otherwise specified.

2.ESD applied to input and output pins with respect to GND, one at a time.

3.Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1.

4.Unused pins are left open.

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