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CM1220
User Manual
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ON Semiconductor CM1220 User Manual

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CM1220
,
4 and 8-Channel ESD Protection Arrays in CSP
Description
These devices are particularly well−suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easy−to−use pin assignments. In particular, the CM1220 is ideal for protecting high speed I/O ports and data and control lines for the LCD display and camera interface in mobile handsets.
The CM1220 incorporates ON Semiconductor’s OptiGuardt coating for improved reliability at assembly in a space−saving, low−profile Chip Scale Package.
Features
• Four and Eight Channels of ESD Protection
• OptiGuardtCoated for Improved Reliability
• ±15 kV ESD Protection on each Channel (IEC 61000−4−2 Level 4,
contact discharge)
• ±30 kV ESD Protection on each Channel (HBM)
• Chip Scale Package (CSP) Features Extremely Low Lead Inductance
for Optimum ESD Protection
• 5 bump, 0.960 mm X 1.330 mm CSP Footprint for CM1220−04
• 10 bump, 1.960 mm X 1.330 mm CSP Footprint for CM1220−08
• These Devices are Pb−Free and are RoHS Compliant
Applications
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
• Keypads and Buttons
• Wireless Handsets
• Handheld PCs/PDAs
• LCD and Camera Modules
±15 kV, exceeding the maximum requirement of the
±30 kV.
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WLCSP5
CP SUFFIX
CASE 567AY
BLOCK DIAGRAM
ESD_1 A1
B2
GND
ESD_1
ESD_2
A1 A3 A5 A7
B1, B2
GND
J
CM1220−04
5−Bump CSP Package
J = CM1220−04CP L208 = CM1220−08CP
ORDERING INFORMATION
Device Package Shipping
CM1220−04CP CSP−5
CM1220−08CP CSP−10
ESD_3
MARKING DIAGRAM
(Pb−Free)
(Pb−Free)
WLCSP10
CP SUFFIX
CASE 567BL
ESD_2
A3 C1
CM1220−04
ESD_4
CM1220−08
10−Bump CSP Package
ESD_3
ESD_4
C3
ESD_5
ESD_6
C1 C3 C5 C7
CM1220−08
3500/Tape & Reel
3500/Tape & Reel
ESD_7
L208
†
ESD_8
© Semiconductor Components Industries, LLC, 2011
February, 2011 − Rev. 3
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure
1 Publication Order Number:
BRD8011/D.
CM1220/D
CM1220
PACKAGE / PINOUT DIAGRAMS
Bottom View
(Bumps Up View)
C1 C3
B2
A1 A3
A1
C1 C3
B2
A1 A3
A1
C5 C7
B6
A5 A7
Orientation
Marking
Orientation
Marking
Top View
(Bumps Down View)
+
A
B
C
123
+
A
B
C
L208
123
J
Orientation
Marking
CM1220−04
5−bump CSP Package
with OptiGuard
567
Orientation
Marking
CM1220−08
10−bump CSP Package
with OptiGuard
Table 1. PIN DESCRIPTIONS
CM1220−08 CM1220−04
Pins Name Pins Name Pins Name Pins Name
A1 ESD1 A1 ESD1 ESD Channel C1 ESD5 C1 ESD3 ESD Channel
A3 ESD2 A3 ESD2 ESD Channel C3 ESD6 C3 ESD4 ESD Channel
A5 ESD3 − − ESD Channel C5 ESD7 − − ESD Channel
A7 ESD4 − − ESD Channel C7 ESD8 − − ESD Channel
B2 GND B2 GND Device Ground B6 GND − − Device Ground
Description
CM1220−08 CM1220−04
Description
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range −40 to +85 °C
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2
CM1220
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
C
DIODE
V
DIODE
I
LEAK
V
Diode (Channel) Capacitance At 2.5 VDC Reverse Bias,
Diode Standoff Voltage
Diode Leakage Current V
Signal Clamp Voltage
SIG
Positive Clamp Negative Clamp
V
ESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2
R
DYN
Dynamic Resistance
Positive Negative
1. T
= 25 °C unless otherwise specified.
A
2. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open.
Parameter Conditions Min Typ Max Units
1 MHz, 30 mVAC
I
= 10 mA
DIODE
= +3.3 V
IN
(reverse bias voltage)
I
= 10 mA
DIODE
(Note 2)
PERFORMANCE INFORMATION
11 14 17 pF
6.0 V
0.1 1
5.6
−1.5
6.8
−0.8
9.0
−0.4
±30 ±15
2.3
0.9
mA
V
kV
W
Diode Characteristics (nominal conditions unless specified otherwise)
Capacitance (Normalized)
DC Voltage
Figure 1. Insertion Loss vs. Frequency (0 V Bias)
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CM1220
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition Non−Solder Mask defined pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C) 60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C
±50 mm
±20 mm
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 2. Recommended Non−Solder Mask Defined Pad Illustration
Figure 3. Lead−free (SnAgCu) Solder Ball Reflow Profile
OptiGuardt is a trademark of Semiconductor Components Industries, LLC.
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
WLCSP5, 0.96x1.33
CASE 567AY−01
ISSUE O
DATE 26 JUL 2010
REFERENCE
2X
2X
NOTE 3
0.03
PIN A1
0.05 C
0.05 C
0.05 C
5X
A0.05 BC
C
0.05 C
OptiGuard Option
A1
b
C
B
A
BOTTOM VIEW
D
TOP VIEW
SIDE VIEW
123
eD/2
eD
A
B
E
A2
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS.
MILLIMETERS
DIMAMIN MAX
A1 A2 0.40 REF
b 0.29 0.35 D 0.96 BSC
E eD 0.50 BSC eE 0.435 BSC
0.72
0.56
0.21 0.27
1.33 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
5X
0.25
eE
C
SEATING PLANE
A1
0.87
0.44
0.25
0.50
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON49808E
WLCSP5, 0.96X1.33
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
WLCSP10, 1.96x1.33
CASE 567BL−01
ISSUE O
DATE 26 JUL 2010
REFERENCE
2X
2X
NOTE 3
0.03 C
PIN A1
0.05 C
0.05 C
0.05 C
10X
A0.05 BC
0.05 C
A1
b
TOP VIEW
OptiGuard Option
SIDE VIEW
C
B
A
123
BOTTOM VIEW
D
eD
eD/2
456
A
A2
B
E
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS.
MILLIMETERS
DIMAMIN MAX
A1 A2 0.40 REF
b 0.29 0.35 D 1.96 BSC
E eD 0.50 BSC eE 0.435 BSC
0.72
0.56
0.21 0.27
1.33 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
eE
C
SEATING PLANE
0.25
A1
0.87
0.44
0.50
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
0.25
PACKAGE
OUTLINE
10X
0.25
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON49820E
WLCSP10, 1.96X1.33
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
. ON Semiconductor reserves the right to make changes without further notice to any products herein.
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