Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
R
q
JA
R
q
JC
200°C/W
83.3°C/W
TO−92
CASE 29
STYLE 17
2
BASE
3
EMITTER
1
2
3
STRAIGHT LEAD
BULK PACK
MARKING DIAGRAM
BC
489x
AYWWG
G
1
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All V oltage Polarities
Figure 1. Switching Time Test Circuits
http://onsemi.com
2
V
CC
+40 V
R
L
OUTPUT
*CS < 6.0 pF
BC489, BC489A
300
= 2.0 V
V
CE
T
200
= 25°C
J
100
70
50
30
T
f, CURRENT−GAIN BANDWIDTH PRODUCT (MHz)
IC, COLLECTOR CURRENT (mA)
Figure 2. Current−Gain — Bandwidth Product
1.0 k
700
500
300
200
100
70
t, TIME (ns)
50
V
30
I
C/IB
20
I
B1
TJ = 25°C
10
CC
= I
= 40 V
= 10
B2
C, CAPACITANCE (pF)
100
20070503020107.05.03.02.0
td @ V
BE(off)
= 0.5 V
IC, COLLECTOR CURRENT (mA)
8.0
6.0
4.0
80
T
= 25°C
60
40
C
ibo
J
20
10
C
obo
1005020105.02.01.00.50.20.1
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Capacitance
t
s
t
f
t
r
20010070300
500503020107.05.0
Figure 4. Switching Time
1.0
0.7
0.5
0.3
0.2
0.1
0.07
(NORMALIZED)
0.05
0.03
0.02
r(t) TRANSIENT THERMAL RESISTANCE
D = 0.5
0.2
0.1
SINGLE PULSE
0.02
0.01
SINGLE PULSE
Z
Z
q
JC(t)
q
JA(t)
= r(t) • R
= r(t) • R
q
JC
q
JA
0.01
1.02.05.01020501002005001.0k2.0k5.0k10k20k
t, TIME (ms)
Figure 5. Thermal Response
P
(pk)
t
1
t
− TC = P
− TA = P
2
2
(SEE AN−469)
1
Z
q
JC(t)
(pk)
Z
q
JA(t)
(pk)
DUTY CYCLE, D = t1/t
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
T
J(pk)
T
J(pk)
50k
100k
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3
BC489, BC489A
)
400
200
100
, DC CURRENT GAIN
80
FE
h
60
TJ =125°C
25°C
1.0 k
700
500
1.0 s
TC = 25°C
BC489
, COLLECTOR CURRENT (mA)
C
I
300
200
100
TA = 25°C
70
50
30
20
10
1.0
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
3.0102050307.070 100
2.05.0
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
Figure 6. Active Region — Safe Operating Area
−55°C
100 ms
1.0 ms
VCE = 1.0 V
40
0.50.71.02.03.05.07.0
1.0
TJ = 25°C
0.8
V
@ IC/IB = 10
BE(sat)
0.6
0.4
V, VOLTAGE (VOLTS)
0.2
V
0
0.51.020020
CE(sat)
2.050050
V
@ VCE = 1.0 V
BE(on)
@ IC/IB = 10
5.01050100
IC, COLLECTOR CURRENT (mA)
Figure 8. “On” Voltages
1020305070100200
IC, COLLECTOR CURRENT (mA)
Figure 7. DC Current Gain
1.0
0.8
IC = 10 mA
0.6
0.4
0.2
, COLLECTOR−EMITTER VOLTAGE (VOLTS
CE
V
0
0.050.20.52.05.020
0.1101.0
50
100 mA250 mA
mA
, COLLECTOR CURRENT (mA)
I
C
Figure 9. Collector Saturation Region
300500
TJ = 25°C
500 mA
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4
BC489, BC489A
−0.8
−1.2
−1.6
R
for V
q
VB
−2.0
−2.4
, TEMPERATURE COEFFICIENT (mV/ C)°
VB
θ
R
−2.8
0.52.05.02050200
1.010010
BE
IC, COLLECTOR CURRENT (mA)
Figure 10. Base−Emitter Temperature Coefficient
−1.0
−0.8
−0.6
−0.4
IC = −10 mA
−50 mA
−100 mA−250 mA −500 mA
TJ = 25°C
500
V, VOLTAGE (VOLTS)
−1.0
−0.8
−0.6
−0.4
−0.2
−0.8
−1.2
−1.6
−2.0
TJ = 25°C
V
@ IC/IB = 10
BE(sat)
V
@ VCE = −1.0 V
BE(on)
V
@ IC/IB = 10
CE(sat)
0
−0.5
−1.0 −2.0−5.0 −10−20−50 −100 −200 −500
, COLLECTOR CURRENT (mA)
I
C
Figure 11. “On” Voltages
R
for V
q
BE
VB
−0.2
, COLLECTOR−EMITTER VOLTAGE (VOLTS)
CE
V
0
−0.05−0.2−0.5−2.0−5.0−20
−0.1−10−1.0
IB, BASE CURRENT (mA)
Figure 12. Collector Saturation Region
−50
−2.4
, TEMPERATURE COEFFICIENT (mV/ C)°
VB
θ
R
−2.8
−1.0−100−10
−0.5−2.0−5.0−20−50−200
I
, COLLECTOR CURRENT (mA)
C
Figure 13. Base−Emitter Temperature Coefficient
−500
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5
BC489, BC489A
TO−92 (TO−226)
PACKAGE DIMENSIONS
CASE 29−1 1
ISSUE AM
SEATING
PLANE
R
T
SEATING
PLANE
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
K
XX
H
V
1
G
C
N
D
J
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
DIM MINMAXMINMAX
A 0.175 0.2054.455.20
B 0.170 0.2104.325.33
C 0.125 0.1653.184.19
D 0.016 0.021 0.407 0.533
G 0.045 0.0551.151.39
H 0.095 0.1052.422.66
J0.015 0.0200.390.50
K 0.500−−− 12.70−−−
L0.250−−−6.35−−−
N 0.080 0.1052.042.66
P−−− 0.100−−−2.54
R0.115−−−2.93−−−
V0.135−−−3.43−−−
MILLIMETERSINCHES
N
A
B
BENT LEAD
TAPE & REEL
AMMO PACK
P
K
XX
G
D
J
V
1
C
SECTION X−X
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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BC489/D
6
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