ON Semiconductor BAS21SLT1G Technical data

BAS21SLT1G

Dual Series High Voltage
Switching Diode

Features

• Moisture Sensitivity Level: 1

• ESD Rating − Human Body Model: Class 1

ESD Rating − Machine Model: Class B

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MAXIMUM RATINGS

Rating Symbol Value Unit

Continuous Reverse Voltage V

Repetitive Peak Reverse Voltage V

Peak Forward Current I

Peak Forward Surge Current I

R

RRM

F

FM(surge)

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Total Device Dissipation FR− 5 Board
(Note 1)
TA = 25°C
Derate above 25°C

Thermal Resistance,
Junction to Ambient

Total Device Dissipation
Alumina Substrate, (Note 2)
TA = 25°C
Derate above 25°C

Thermal Resistance,
Junction to Ambient

Junction and Storage
Temperature Range

Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.

1. FR− 5 = 1.0  0.75  0.062 in.

2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.

P

R

P

R

TJ, T

D



JA

D



JA

stg

250 Vdc

250 Vdc

225 mAdc

625 mAdc

225

1.8

556 °C/W

300

2.4

417 °C/W

−55 to
+150

mW/°C

mW/°C

mW

mW

°C

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ANODE

1

3

CATHODE/ANODE

1

2

SOT−23
CASE 318
STYLE 11

CATHODE

2

3

MARKING DIAGRAM

JT M G

G

1

JT = Device Code
M = Date Code*
G = Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or overbar may

vary depending upon manufacturing location.

ORDERING INFORMATION

Device Package Shipping

BAS21SLT1G SOT−23

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

3000/Tape & Reel

†

© Semiconductor Components Industries, LLC, 2009

August, 2009 − Rev. 5

1 Publication Order Number:

BAS21SLT1/D

BAS21SLT1G

ELECTRICAL CHARACTERISTICS (T

Characteristic

OFF CHARACTERISTICS

Reverse Voltage Leakage Current
(VR = 200 Vdc)
(VR = 200 Vdc, TJ = 150°C)

Reverse Breakdown Voltage

= 100 Adc)

(I

BR

Forward Voltage
(IF = 100 mAdc)
(IF = 200 mAdc)

Diode Capacitance
(V

= 0, f = 1.0 MHz)

R

Reverse Recovery Time
(IF = IR = 30 mAdc, RL = 100 )

820 

+10 V

50  OUTPUT

PULSE

GENERATOR

0.1 F

2.0 k

100 H

I

F

D.U.T.

= 25°C unless otherwise noted)

A

0.1 F

50  INPUT

SAMPLING

V

R

OSCILLOSCOPE

Symbol Min Max Unit

I

R

V

(BR)

V

F

C

D

t

rr

t

t

r

p

10%

−

−

0.1

100

250 − Vdc

−

−

1000
1250

− 5.0 pF

− 50 ns

I

t

F

t

rr

90%

i

R(REC)

OUTPUT PULSE

at i

= 3.0 mA)

R(REC)

INPUT SIGNAL

I

R

(IF = IR = 30 mA; MEASURED

Adc

mV

t

= 3.0 mA

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 30 mA.

Notes: 2. Input pulse is adjusted so I
Notes: 3. tp » t

rr

Figure 1. Recovery Time Equivalent Test Circuit

1200

TA = −55°C

1000

800

155°C

600

400

FORWARD VOLTAGE (mV)

200

1

1 10 100 1000

FORWARD CURRENT (mA)

Figure 2. Forward Voltage Figure 3. Reverse Leakage

25°C

is equal to 30 mA.

R(peak)

7000
6000

5000

4000
3000

6

5

4

3

REVERSE CURRENT (nA)

2

1
0

21

TA = 155°C

TA = 25°C

TA = −55°C

5 10 20 50 100 200

REVERSE VOLTAGE (V)

300

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2

BAS21SLT1G

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AN

D

H

SEE VIEW C

E

c

0.25

3

E

12

b

e

q

A

L

A1

L1

VIEW C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.

DIMAMIN NOM MAX MIN

A1 0.01 0.06 0.10 0.001

b 0.37 0.44 0.50 0.015
c 0.09 0.13 0.18 0.003
D 2.80 2.90 3.04 0.110
E 1.20 1.30 1.40 0.047
e 1.78 1.90 2.04 0.070
L 0.10 0.20 0.30 0.004
L1

H

E

STYLE 11:

PIN 1. ANODE

MILLIMETERS

0.89 1.00 1.11 0.035

0.35 0.54 0.69 0.014 0.021 0.029

2.10 2.40 2.64 0.083 0.094 0.104

2. CATHODE

3. CATHODE‐ANODE

INCHES

NOM MAX

0.040 0.044

0.002 0.004

0.018 0.020

0.005 0.007

0.114 0.120

0.051 0.055

0.075 0.081

0.008 0.012

SOLDERING FOOTPRINT*

0.95

0.95

0.037

0.9

0.035

0.8

0.031

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

0.037

SCALE 10:1

2.0

0.079

ǒ

inches

mm

Ǔ

PUBLICATION ORDERING INFORMATION

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BAS21SLT1/D