ON Semiconductor 74FST3257 User Manual

74FST3257

Quad 2:1 Multiplexer/ Demultiplexer Bus Switch

The ON Semiconductor 74FST3257 is a quad 2:1, high performance multiplexer/demultiplexer bus switch. The device is CMOS TTL compatible when operating between 4 and 5.5 Volts. The device exhibits extremely low R The device adds no noise or ground bounce to the system.

Features

• R

t 4 W Typical

• Less Than 0.25 ns−Max Delay Through Switch

• Nearly Zero Standby Current

• No Circuit Bounce

• Control Inputs are TTL/CMOS Compatible

• Pin−For−Pin Compatible With QS3257, FST3257, CBT3257

• All Popular Packages: SOIC−16, TSSOP−16, QFN16

• NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

and adds nearly zero propagation delay.

SOIC−16

D SUFFIX

CASE 751B

TSSOP−16 DT SUFFIX

CASE 948F

www.onsemi.com

MARKING

DIAGRAMS

FST3257G

AWLYWW

FST

3257

ALYW G

GND 3A

16 15 14 13 12 11 10

OE 4B

4A 3B

1 2

2B 2B

Figure 1. 16−Lead Pinout Diagrams

X L H

L L

Function

Disconnect

Figure 2. Truth Table

4 5

A = B A = B

GND

GND 3A

1 2

15 14 13 12 11 10

OE 4B

4A 3B

QFN16

MN SUFFIX

1 2

CASE 485AW

A = Assembly Location WL, L = Wafer Lot Y = Year WW, W = Work Week G or G = Pb−Free Package

(Note: Microdot may be in either location)

3257

ALYWG

PIN NAMES

OE1, OE

B1, B2, B3, B

S0, S

A Bus A

Description

Bus Switch Enables

Select Inputs

Bus B

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

May, 2018 − Rev. 8

1 Publication Order Number:

74FST3257/D

74FST3257

FLOW CONTROL

Figure 3. Logic Diagram

ORDERING INFORMATION

Device Order Number Package Shipping

74FST3257DR2G NLV74FST3257DR2G* 74FST3257DTR2G TSSOP−16

SOIC−16

(Pb−Free)

2500 Units / Tape & Reel

(Pb−Free)

74FST3257MNTWG QFN16

3000 Units / Tape & Reel

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

†

www.onsemi.com

74FST3257

MAXIMUM RATINGS

Symbol Parameter Value Units

GND

STG

T T

MSL Moisture Sensitivity Level 1

ESD

Latchup

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

1. Tested to EIA/JESD22−A114−A.

2. Tested to EIA/JESD22−A115−A.

3. Tested to JESD22−C101−A.

4. Tested to EIA/JESD78.

DC Supply Voltage −0.5 to +7.0 V DC Input Voltage −0.5 to +7.0 V

DC Output Voltage −0.5 to +7.0 V

DC Input Diode Current

t GND −50

DC Output Diode Current

t GND −50

DC Output Sink Current 128 mA DC Supply Current per Supply Pin ±100 mA DC Ground Current per Ground Pin ±100 mA Storage Temperature Range −65 to +150 Lead Temperature, 1 mm from Case for 10 Seconds 260

Junction Temperature Under Bias +150

Thermal Resistance

Flammability Rating

SOIC TSSOP QFN

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

125 170 N/A

ESD Withstand Voltage

Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3)

u2000

u200

N/A

Latchup Performance

Above V

and Below GND at 85_C (Note 4)

±500

_C _C _C

_C/W

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Units

Dt/DV

Supply Voltage

Operating, Data Retention Only

Input Voltage (Note 5) 0 5.5 V

Output Voltage (HIGH or LOW State) 0 5.5 V

Operating Free−Air Temperature −40 +85

4.0 5.5

Input Transition Rise or Fall Rate Switch Control Input Switch I/O V

= 5.0 V ± 0.5 V

5. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level.

www.onsemi.com

ns/V

74FST3257

DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Conditions (V) Min Typ* Max Units

V V

Clamp Diode Voltage IIN = −18 mA 4.5 −1.2 V

High−Level Input Voltage 4.0 to 5.5 2.0 V

Low−Level Input Voltage 4.0 to 5.5 0.8 V

Input Leakage Current 0 ≤ VIN ≤ 5.5 V 5.5 ±1.0

Off−State Leakage Current 0 ≤ A, B ≤ V

Switch On Resistance (Note 6) VIN = 0 V, IIN = 64 mA 4.5 4 7

5.5 ±1.0

VIN = 0 V, IIN = 30 mA 4.5 4 7 VIN = 2.4 V, IIN = 15 mA 4.5 8 15 VIN = 2.4 V, IIN = 15 mA 4.0 11 20

Quiescent Supply Current VIN = VCC or GND, I

Increase In ICC per Input One input at 3.4 V,

Other inputs at V

= 0 5.5 3

OUT

5.5 2.5 mA

or GND

*Typical values are at VCC = 5.0 V and TA = 25_C.

6. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower

of the voltages on the two (A or B) pins.

TA = −40_C to +85_C

mA mA

AC ELECTRICAL CHARACTERISTICS

TA = −40_C to +85_C

= 50 pF, RU = RD = 500 W

VCC = 4.5−5.5 V VCC = 4.0 V

Symbol Parameter Conditions Min Max Min Max Units

PHL

PZH

PHZ

PLH

PZL

PLZ

Prop Delay Bus to Bus (Note 7) Prop Delay, Select to Bus A 1.0 4.7 5.2

Output Enable Time, Select to Bus B VI = 7 V for t Output Enable Time, IOE to Bus A, B VI = OPEN for t

Output Disable Time, Select to Bus B VI = 7 V for t Output Disable Time, IOE to Bus A, B VI = OPEN for t

VI = OPEN

PZL

PLZ

PZH

PHZ

0.25 0.25

1.0 5.2 5.7

1.0 5.1 5.6

1.0 5.2 5.5

1.0 5.5 5.5

7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the

typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance).

CAPACITANCE (Note 8)

Symbol

C C C

Control Pin Input Capacitance VCC = 5.0 V 3 pF

A Port Input/Output Capacitance VCC, OE = 5.0 V 7 pF

I/O

B Port Input/Output Capacitance VCC, OE = 5.0 V 5 pF

I/O

8. TA = )25_C, f = 1 MHz, Capacitance is characterized but not tested.

Parameter Conditions Typ Max Units

www.onsemi.com

74FST3257

AC Loading and Waveforms

FROM

OUTPUT

UNDER

TEST

CL*

NOTES:

1. Input driven by 50 W source terminated in 50 W.

2. CL includes load and stray capacitance. *C

= 50 pF

Figure 4. AC Test Circuit

= 2.5 nS

90 %

SWITCH INPUT

OUTPUT

90 %

10 % 10 %

PLH

1.5 V 1.5 V

500 W

= 2.5 nS

3.0 V

1.5 V1.5 V GND

PLH

ENABLE INPUT

= 2.5 nS

OUTPUT

Figure 5. Propagation Delays

90 %

PZL

PZH

1.5 V 10 %10 %

1.5 V

90 %

1.5 V

Figure 6. Enable/Disable Delays

= 2.5 nS

PLZ

PHZ

3.0 V

GND

+ 0.3 V

− 0.3 V

www.onsemi.com

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SCALE 2:1

16X

NOTE 4

PIN ONE

REFERENCE

C0.10

C0.08

16X

DETAIL A

C0.15

TOP VIEW

DETAIL B

SIDE VIEW

e/2

BOTTOM VIEW

0.15

A B

(A3)

C A B

0.15

QFN16, 2.5x3.5, 0.5P

CASE 485AW−01

ISSUE O

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTIONS

DETAIL B

ALTERNATE

CONSTRUCTIONS

SEATING

PLANE

C A B

16X

0.10 C

A B

0.05

NOTE 3

DATE 11 DEC 2008

NOTES:

1. DIMENSIONING AND TOLERANCING PER

MOLD CMPDEXPOSED Cu

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.

MILLIMETERS

DIM MIN MAX

0.80 1.00

A1 0.00 0.05 A3

0.20 REF

b 0.20 0.30 D 2.50 BSC

D2 0.85 1.15

E 3.50 BSC

1.85 2.15

e 0.50 BSC K 0.20 --- L 0.35 0.45

L1 --- 0.15

GENERIC MARKING

DIAGRAM*

XXXX

ALYWG

XXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package

(Note: Microdot may be in either location)

*This information is generic. Please refer to

device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present.

SOLDERING FOOTPRINT*

3.80

2.10

0.50 PITCH

2.80

1.10

PACKAGE

16X

0.60

16X

0.30

DIMENSIONS: MILLIMETERS

OUTLINE

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

DOCUMENT NUMBER:

DESCRIPTION:

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.

98AON36347E

QFN16, 2.5X3.5, 0.5P

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

www.onsemi.com

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SCALE 1:1

−A−

16 9

−B−

−T−

SEATING

PLANE

16 PL

0.25 (0.010) A

CASE 751B−05

8 PLP

0.25 (0.010) B

SOIC−16

ISSUE K

X 45

DATE 29 DEC 2006

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

DIM MIN MAX MIN MAX

A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7

____

P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019

INCHESMILLIMETERS

STYLE 1:

PIN 1. COLLECTOR

2. BASE

3. EMITTER

4. NO CONNECTION

5. EMITTER

6. BASE

7. COLLECTOR

8. COLLECTOR

9. BASE

10. EMITTER

11. NO CONNECTION

12. EMITTER

13. BASE

14. COLLECTOR

15. EMITTER

16. COLLECTOR

STYLE 5:

PIN 1. DRAIN, DYE #1

2. DRAIN, #1

3. DRAIN, #2

4. DRAIN, #2

5. DRAIN, #3

6. DRAIN, #3

7. DRAIN, #4

8. DRAIN, #4

9. GATE, #4

10. SOURCE, #4

11. GATE, #3

12. SOURCE, #3

13. GATE, #2

14. SOURCE, #2

15. GATE, #1

16. SOURCE, #1

STYLE 2:

PIN 1. CATHODE

2. ANODE

3. NO CONNECTION

4. CATHODE

5. CATHODE

6. NO CONNECTION

7. ANODE

8. CATHODE

9. CATHODE

10. ANODE

11. NO CONNECTION

12. CATHODE

13. CATHODE

14. NO CONNECTION

15. ANODE

16. CATHODE

STYLE 6:

PIN 1. CATHODE

2. CATHODE

3. CATHODE

4. CATHODE

5. CATHODE

6. CATHODE

7. CATHODE

8. CATHODE

9. ANODE

10. ANODE

11. ANODE

12. ANODE

13. ANODE

14. ANODE

15. ANODE

16. ANODE

STYLE 3:

PIN 1. COLLECTOR, DYE #1

2. BASE, #1

3. EMITTER, #1

4. COLLECTOR, #1

5. COLLECTOR, #2

6. BASE, #2

7. EMITTER, #2

8. COLLECTOR, #2

9. COLLECTOR, #3

10. BASE, #3

11. EMITTER, #3

12. COLLECTOR, #3

13. COLLECTOR, #4

14. BASE, #4

15. EMITTER, #4

16. COLLECTOR, #4

STYLE 7:

PIN 1. SOURCE N‐CH

2. COMMON DRAIN (OUTPUT)

3. COMMON DRAIN (OUTPUT)

4. GATE P‐CH

5. COMMON DRAIN (OUTPUT)

6. COMMON DRAIN (OUTPUT)

7. COMMON DRAIN (OUTPUT)

8. SOURCE P‐CH

9. SOURCE P‐CH

10. COMMON DRAIN (OUTPUT)

11. COMMON DRAIN (OUTPUT)

12. COMMON DRAIN (OUTPUT)

13. GATE N‐CH

14. COMMON DRAIN (OUTPUT)

15. COMMON DRAIN (OUTPUT)

16. SOURCE N‐CH

STYLE 4:

PIN 1. COLLECTOR, DYE #1

2. COLLECTOR, #1

3. COLLECTOR, #2

4. COLLECTOR, #2

5. COLLECTOR, #3

6. COLLECTOR, #3

7. COLLECTOR, #4

8. COLLECTOR, #4

9. BASE, #4

10. EMITTER, #4

11. BASE, #3

12. EMITTER, #3

13. BASE, #2

14. EMITTER, #2

15. BASE, #1

16. EMITTER, #1

SOLDERING FOOTPRINT

16X

0.58

6.40

16X

1.12

DIMENSIONS: MILLIMETERS

1.27

PITCH

DOCUMENT NUMBER:

DESCRIPTION:

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.

98ASB42566B

SOIC−16

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

www.onsemi.com

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SCALE 2:1

16X REFK

0.10 (0.004)

−T−

SEATING PLANE

U0.15 (0.006) T

PIN 1 IDENT.

U0.15 (0.006) T

2X L/2

0.10 (0.004) V

−V−

CASE 948F−01

−U−

TSSOP−16

ISSUE B

DETAIL E

SECTION N−N

0.25 (0.010)

DATE 19 OCT 2006

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−.

DIM MIN MAX MIN MAX

A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011

−W−

J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC M 0 8 0 8

____

INCHESMILLIMETERS

SOLDERING FOOTPRINT

7.06

GENERIC

MARKING DIAGRAM*

XXXX

XXXX ALYW

XXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year

0.65 PITCH

W = Work Week G or G = Pb−Free Package

*This information is generic. Please refer to

16X

0.36

DOCUMENT NUMBER:

DESCRIPTION:

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.

16X

1.26

98ASH70247A

TSSOP−16

DIMENSIONS: MILLIMETERS

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present.

PAGE 1 OF 1

www.onsemi.com

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

. ON Semiconductor reserves the right to make changes without further notice to any products herein.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

TECHNICAL SUPPORT North American Technical Support:

Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910

Europe, Middle East and Africa Technical Support:

Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative

◊

www.onsemi.com

ON Semiconductor 74FST3257 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual