Lead mounted standard recovery rectifiers are designed for use in
power supplies and other applications having need of a device with the
following features:
Features
• High Current to Small Size
• High Surge Current Capability
• Low Forward Voltage Drop
• Void−Free Economical Plastic Package
• Available in Volume Quantities
• Plastic Meets UL 94 V−0 for Flammability
• These are Pb−Free Devices
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.1 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Cathode Indicated by Polarity Band
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STANDARD RECOVERY
RECTIFIERS
50−1000 VOLTS
3.0 AMPERES
AXIAL LEAD
CASE 267−05
STYLE 1
MARKING DIAGRAM
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
A
1N
540x
YYWWG
G
A= Assembly Location
1N540x = Device Number
x= 0, 1, 2, 4, 6, 7 or 8
YY= Year
WW= Work Week
G= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
(Single Phase Resistive Load,
1/2 in. Leads, TL = 105°C)
Non−repetitive Peak Surge Current
(8 ms Single Half−Sine−Wave)
Operating and Storage Junction
Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
CharacteristicSymbolTypUnit
Thermal Resistance, Junction−to−Ambient (PC Board Mount, 1/2 in. Leads)
ELECTRICAL CHARACTERISTICS
CharacteristicSymbolMinTy pMaxUnit
Forward Voltage (IF = 3.0 A, TA = 25°C)v
Reverse Current (Rated DC Voltage)
TA = 25°C
TA = 100°C
Ratings at 25°C ambient temperature unless otherwise specified.
60 Hz resistive or inductive loads.
For capacitive load, derate current by 20%.
V
V
I
RRM
RWM
V
R
RSM
I
O
FSM
T
J
T
stg
501002004006008001000V
10020030052580010001200V
3.0A
200 (one cycle)A
− 65 to +150
− 65 to +175
R
q
JA
F
I
R
−−1.0V
−
−
53°C/W
−
−
10
50
°C
mA
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2
1N5400 thru 1N5408
NOTE 1 — AMBIENT MOUNTING DATA
Data shown for thermal resistance junction−to−ambient (R
qJA
) for the
mountings shown is to be used as typical guideline values for preliminary
engineering or in case the tie point temperature cannot be measured.
TYPICAL VALUES FOR R
Mounting
Method
1
2
3
MOUNTING METHOD 1
P.C. Board Where Available
Copper Surface area is small
LL
MOUNTING METHOD 2
Vector Push−In Terminals T−28
LL
1/81/41/2
50
58
Lead Length, L (IN)
IN STILL AIR
q
JA
3/4
5153
5961
28
MOUNTING METHOD 3
55
63
P.C. Board with
1−1/2” x 1−1/2”
Copper Surface
L = 1/2”
Board Ground Plane
R
q
°C/W
°C/W
°C/W
JA
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3
1N5400 thru 1N5408
200
T
= 25°C
J
100
70
TYPICAL
50
30
20
10
7.0
5.0
3.0
2.0
, INSTANTANEOUS FORWARD CURRENT (AMPS)
F
i
1.0
0.7
0.5
0.3
0.2
0.82.01.22.8
0.41.62.4
v
INSTANTANEOUS VOLTAGE (V)
F,
Figure 1. Forward Voltage
6
R
= 28°C/W
q
5
JA
R
q
JA
= 50°C/W
4
DC
3
DC
2
Square
1
Wave
0
40 50 60 70 80 90 100 110 120 130 140 150 160
T
A, AMBIENT
TEMPERATURE (°C)
Figure 4. Maximum Current Derating, Ambient, PC
Board Mounting
400
300
200
100
90
80
70
60
, PEAK HALF WAVE CURRENT (A)
50
FSM
40
I
1.0
5
4
3
2
1
, AVERAGE FORWARD CURRENT (A)
F(AV)
I
3.2
0
40 50 60 70 80 90 100 110 120 130 140 150 160
16
14
12
10
8
6
4
2
, AVERAGE POWER DISSIPATION (W)
0
F(AV)
012
P
Surge Applied @
TJ = 25°C
f = 60 Hz
1 CYCLE
2.0 3.05.010
7.020 3050 70
100
NUMBER OF CYCLES
Figure 2. Maximum Nonrepetitive Surge Current
DC
Square
Wave
1/2”
T
LEAD TEMPERATURE (°C)
L,
Both Leads to
Heat Sink
with Lengths
as Shown
1/4”L = 1/32”
Figure 3. Maximum Current Derating, Lead,
Various Lengths
IPK/IAV = 20
10
345678910
I
AVERAGE FORWARD CURRENT (A)
F(AV),
5
Square
Wave
TJ = 25°C
dc
Figure 5. Forward Power Dissipation
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4
1N5400 thru 1N5408
ORDERING INFORMATION
DevicePackageShipping
1N5400GAxial Lead*500 Units/Box
1N5400RLGAxial Lead*1200/Tape & Reel
1N5401GAxial Lead*500 Units/Box
1N5401RLGAxial Lead*1200/Tape & Reel
1N5402GAxial Lead*500 Units/Box
1N5402RLGAxial Lead*1200/Tape & Reel
1N5404GAxial Lead*500 Units/Box
1N5404RLGAxial Lead*1200/Tape & Reel
1N5406GAxial Lead*500 Units/Box
1N5406RLGAxial Lead*1200/Tape & Reel
1N5407GAxial Lead*500 Units/Box
1N5407RLGAxial Lead*1200/Tape & Reel
1N5408GAxial Lead*500 Units/Box
1N5408RLGAxial Lead*1200/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
†
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5
1N5400 thru 1N5408
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267−05
ISSUE G
D
1
B
K
A
2
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
1N5400/D
6
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