onsemi J175, J176, MMBFJ175, MMBFJ176, MMBFJ177 Data Sheet

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Page 1

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177

1. Drain

Straight Lead Bent Lead

TO-92

Bulk Packing T ape & Reel

Ammo Packing

2. Gate

3. Source

SOT-23

Mark: 6W / 6X / 6Y

Note: Source & drain are interchangeable.

P-Channel Switch

Description

This device is designed for low-level analog switching sample-and-hold circuits and chopper-stabilized amplifiers. Sourced from process 88.

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch

Figure 1. J175 / J176 Device Package Figure 2. MMBFJ175 / 176 / 177 Device Package

Ordering Information

Part Number

175-D26Z J175 TO-92 3L Tape and Reel

176-D74Z J176 TO-92 3L Ammo

MMBFJ175 6W SOT-23 3L Tape and Reel

MMBFJ176 6X SOT-23 3L Tape and Reel

MMBFJ177 6Y SOT-23 3L Tape and Reel

October-2017, Rev. 2

onductor Components Industries, LLC.

Marking

Package Packing Method

Publication Order Number:

J175/D

Page 2

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch

Absolute Maximum Ratings

(1),(2)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at T

Symbol

, T

STG

Drain-Gate Voltage -30 V

Gate-Source Voltage 30 V

Forward Gate Current 50 mA Operating and Storage Junction Temperature Range -55 to + 150 °C

Parameter

= 25°C unless otherwise noted.

Value Unit

Notes:

1. Thes

e ratings are based on a maximum junction temperature of 150°C.

2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or low- duty cycle operations.

Thermal Characteristics

Values are at TA = 25°C unless otherwise noted.

Max.

Symbol Parameter

θJC

θJA

Total Device Dissipation 350 225 mW

Derate Above 25°C2.81.8mW/°C Thermal Resistance, Junction to Case 125 °C/W Thermal Resistance, Junction to Ambient 357 556 °C/W

J175 / J176

Note:

3. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.

MMBFJ175 /

(3)

MMBFJ176 /

MMBFJ177

Unit

(3)

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Page 3

Electrical Characteristics

Values are at TA = 25°C unless otherwise noted.

Symbol Parameter Conditions Min. Max. Unit

Off Characteristics

(BR)GSS

GSS

GS(off)

On Characteristics

DSS

DS(on)

Gate-Source Breakdown Voltage IG = 1.0 μA, VDS = 0 30 V

Gate Reverse Current VGS = 20 V, VDS = 0 1.0 nA

J175 / MMBFJ175

Gate-Source Cut-Off Voltage VDS = -15 V, ID = -10 nA

MMBFJ176

3.0 6.0

1.0 4.0

MMBFJ177 0.8 2.5

Zero-Gate Voltage Drain Current

(4)

VDS = -15 V, IGS = 0

J175 / MMBFJ175

MMBFJ176

-7.0 -60.0

-2.0 -25.0

MMBFJ177 -1.5 -20.0

Drain-Source On Resistance V

≤ 0.1 V, V

J175 / MMBFJ175

= 0

MMBFJ176

125

250

MMBFJ177 300

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch

VJ176 /

mAJ176 /

ΩJ176 /

Note:

4. Pulse test: pulse width ≤ 300 μs, duty cycle ≤ 2.0%.

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Page 4

Typical Performance Characteristics

-5-4-3-2-10

-20

-16

-12

-8

-4

V - DRAIN-SOURCE VOLTAGE (V)

I - DRAIN CURRENT (mA)

1.0 V

2.5 V

2.0 V

0.5 V

1.5 V

V = 0 V

T = 25°C

TYP V = 4.5 V

GS(off)

3.0 V

3.5 V

r - DRAIN "ON" RESISTANCE

(

ΩΩ

)

12 510

100

500

1,000

V - GATE CUTOFF VOLTAGE (V)

g - TRANSCONDUCTANCE (mmhos)

GS (OFF)

I , g @ V = 15V, V = 0 PULSED r @ -100 mV, V = 0 V @ V = - 15V, I = - 1.0 μA

GS(off)

DSS

01234

-32

-24

-16

-8

V - GATE-SOURCE VOLTAGE (V)

I - DRAIN CURRENT (mA)

V = - 4.5 V

GS(off)

25°C

V = - 15 V

V = 2.5 V

GS(off)

125°C

- 55°C

25°C

125°C

- 55°C

01234

V - GATE-SOURCE VOLTAGE (V)

I - DRAIN CURRENT (mA)

V = - 4.5 V

GS(off)

25°C

V = - 15 V

V = 2.5 V

GS(off)

125°C

- 55°C

25°C

- 55°C

125°C

0 0.2 0.4 0.6 0.8 1

100

V /V - NORMALIZED GATE-SOURCE VOLTAGE (V)

r - NORMALIZED RESISTANCE

r =

V @ 5.0V, 10 μA

GS(off)

________

GS(off)

1 -

GS(off)

(

Ω ) Ω )

Ω )

0.01 0.1 1 10

100

1000

I - DRAIN CURRENT (mA)

g - OUTPUT CONDUCTANCE ( mhos)

V = - 4.5V

GS(off)

f = 1.0 kHz

V = - 2.5V

GS(off)

-20V

-10V

-20V

-5.0V

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch

Figure 3. Common Drain-Source

Figure 5. Transfer Characteristics

Figure 4. Parameter Interactions

Figure 6. Transfer Characteristics

Figure 7. Normalized Drain Resistance vs.

Bias Voltage

Figure 8. Output Conductance vs. Drain Current

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Typical Performance Characteristics (Continued)

0.1 1 10 100

0.1

0.5

I - DRAIN CURRENT (mA)

g - TRANSCONDUCTANCE (mmhos)

V = 2.5V

GS(off)

V = -15V

f = 1.0 kHz

V = 6.0V

GS(off)

- 55°C 25°C

125°C

25°C

048121620

100

V - GATE-SOURCE VOLTAGE (V)

C (C ) - CAPACITANCE (pF)

C (V = -15V)

f = 0.1 - 1.0 MHz

0.01 0.1 1 10 100

100

f - FREQUENCY (kHz)

e - NOISE VOLTAGE (nV / Hz)

V = - 15V

BW = 6.0 Hz @ f = 10 Hz, 100 Hz

= 0.2f @ f ≥ 1.0 kHz

I = 5.0 mA

I = - 0.2 mA

√

-50 0 50 100 150

100

500

1000

T - AMBIENT TEMPERATURE ( C)

r - DRAIN "ON" RESISTANCE

(

)

V = 2.5V

GS(off)

V = 4.5V

GS(off)

V = 8.0V

GS(off)

V = -100 mV

V = 0

0 25 50 75 100 125 150

100

150

200

250

300

350

TEMPERATURE ( C)

P - POWER DISSIPATION (mW)

TO-92

SOT-23

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch

Figure 9. Transconductance vs. Drain Current

Figure 11. Noise Voltage vs. Frequency

Figure 10. Capacitance vs. Voltage

Figure 12. Channel Resistance vs. Temperature

Figure 13. Power Dissipation vs.

Ambient Temperature

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Page 6

Physical Dimensions

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch

Figure 14. 3-Lead, TO-92, Molded, 0.2 In Line Spacing Lead Form

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Physical Dimensions (Continued)

LAND PATTERN

RECOMMENDATION

NOTES: UNLESS OTHERWISE SPECIFIED

A) RE

FERENCE JEDEC REGISTRATION

TO-236, VARIATION AB, ISSUE H.

B) ALL DIME

NSIONS ARE IN MILLIMETERS.

DIMENSIONS ARE INCLUSIVE OF BURRS,

MOLD FLASH AND TIE BAR EXTRUSIONS.

DIMENSIONING AND TOLERANCING PER

SME Y14.5M - 1994.

E) DRAWING FILE

NAME: MA03DREV10

SEE DETAIL A

SEATING PLANE

SCALE: 2X

GAGE PLANE

(0.55)

(0.93)

1.20 MAX

0.10

0.00

0.10 C

2.40±0.30

2.92±0.20

1.30

+0.20

-0.15

0.60

0.37

0.20 A B

1.90

0.95

(0.29)

0.95

1.40

2.20

1.00

1.90

0.25

0.23

0.08

0.20 MIN

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch

Figure 15. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE

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Page 8

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