ON SMF05T1 Schematic [ru]

SMF05T1
Quad Array for ESD Protection
ESD Protection Diodes with Low Clamping Voltage
This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium.
Specification Features
Low Clamping Voltage
Stand Off Voltage 5 V
Low Leakage < 5 mA @ 5 V
SC88A Package Allows Four Separate Unidirectional
Configurations
IEC610042 Level 4 ESD Protection
PbFree Packages are Available*
Mechanical Characteristics
Void Free, TransferMolded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
MAXIMUM RATINGS (T
Characteristic
Peak Power Dissipation @ 8 X 20 ms
@T
25°C
A
Steady State Power 1 Diode
(Note 1)
Thermal Resistance
JunctiontoAmbient Above 25°C, Derate
Maximum Junction Temperature T
Operating Junction and Storage
Temperature Range
ESD Discharge
IEC61000−4−2, Air Discharge IEC61000−4−2, Contact Discharge
Lead Solder Temperature
(10 seconds duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Only 1 diode under power. For all 4 diodes under power, P
Mounted on FR−4 board with min pad.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
See Application Note AND8308/D for further description of survivability specs.
= 25°C unless otherwise noted)
A
Symbol Value Unit
P
pk
P
D
R
q
JA
Jmax
TJ T
T
55 to +150 °C
stg
L
200 W
385 mW
325
3.1
150 °C
30 30
260 °C
°C/W
mW/°C
kV
will be 25%.
D
Cathode
Cathode
SMF05T1 SC88A 3000/Tape & Reel
SMF05T1G SC88A
SMF05T2G SC88A
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MARKING DIAGRAM
45
SC88A/SOT323
CASE 419A
STYLE 5
60 = Device Marking M = One Digit Date Code G = Pb−Free Package (Note: Microdot may be in either location)
1
2
Anode
3
60 MG
G
132
5
Cathode
4
Cathode
ORDERING INFORMATION
Device Package Shipping
(PbFree)
(PbFree)
3000/Tape & Reel
3000/Tape & Reel
© Semiconductor Components Industries, LLC, 2009
August, 2009 Rev. 4
1 Publication Order Number:
SMF05T1/D
SMF05T1
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol
V
I
V
RWM
V
V
P
Maximum Reverse Peak Pulse Current
PP
Clamping Voltage @ I
C
Working Peak Reverse Voltage
I
Maximum Reverse Leakage Current @ V
R
Breakdown Voltage @ I
BR
I
Test Current
T
I
Forward Current
F
Forward Voltage @ I
F
Peak Power Dissipation
pk
C Capacitance @ VR = 0 and f = 1.0 MHz
Parameter
PP
T
F
RWM
VCV
V
RWM
BR
UniDirectional TVS
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
ELECTRICAL CHARACTERISTICS
Breakdown
Voltage
@ 1 mA
V
BR
(V)
Device
Min Max Max Max IPP (A) VC (V) IPP (A) VC (V)
SMF05 6.0 7.2 5.0 90 1.25 1.0 9.5 12 12.5 Figures 1 and 2
2. Nonrepetitive current per Figure 5. Derate per Figure 6.
3. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
Leakage
Current
@ V
I
R
5 V (mA)
RWM
=
Capacitance
@ 0 V Bias
(pF)
Max VF @
= 200 mA
I
F
(V)
Max Clamping
Voltage (V
@ I
(Note 2)
PP
C
)
I
I
F
I
V
R
F
I
T
I
PP
Max Clamping
Voltage (V
@ I
(Note 2)
PP
C
)
Per IEC61000−4−2
(Note 3)
See Below
V
V
C
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC61000−4−2
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