ON SL05T1, SL12T1, SL15T1, SL24T1 Schematic [ru]

SL05T1 Series
300 Watt, SOT-23 Low Capacitance TVS for High Speed Line Protections
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1
Features
TVS Diode in Series with a Compensating Diode Offers <5 pF
Capacitance
ESD Protection Meeting IEC 6100042, 44, 45
Peak Power Rating of 300 W, 8 × 20 ms
BiDirection Protection Can Be Achieved By Using Two Devices
Flammability Rating UL 94 V0
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics: CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds Package designed for optimal automated board assembly Small package size for high density applications Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
3
(NC)
MARKING DIAGRAM
3
1
2
SOT23 (TO236)
CASE 318 STYLE 26
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may vary
depending upon manufacturing location.
ORDERING INFORMATION
Device Package Shipping
SL05T1 SOT23 3000/Tape & Reel
SL05T1G SOT23
SL12T1G SOT23
SL15T1 SOT23
SL15T1G SOT23
SL24T1 SOT23 3000/Tape & Reel
Lxx = Device Code
M = Date Code* G = Pb−Free Package
(PbFree)
(PbFree)
(PbFree)
Lxx M G
G
xx = 05, 12, 15, or 24
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
© Semiconductor Components Industries, LLC, 2013
March, 2013 Rev. 8
SL24T1G SOT23
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the table on page 3 of this data sheet.
1 Publication Order Number:
(PbFree)
3000/Tape & Reel
SL05T1/D
SL05T1 Series
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation @ 8x20 usec (Note 1)
25°C
@ T
L
IEC 61000−4−2 Level 4
Contact Discharge
Air Discharge IEC 61000−4−4 EFT IEC 61000−4−5 Lightning
Total Power Dissipation on FR5 Board (Note 2) @ TA = 25°C
Derate above 25°C
Thermal Resistance Junction to Ambient
Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C
Derate above 25°C
Thermal Resistance JunctiontoAmbient
Junction and Storage Temperature Range TJ, T
Lead Solder Temperature − Maximum (10 Second Duration) T
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 2
2. FR5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
P
pk
V
pp
300 W
±8
±16
40 12
°P 225
1.8
R
q
JA
556 °C/W
°P 300
2.4
R
q
JA
stg
L
417 °C/W
55 to +150 °C
260 °C
kV kV
A A
°mW°
mW/°C
°mW
mW/°C
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
UNIDIRECTIONAL
Symbol Parameter
V
QV
I
PP
V
RWM
I
V
I
I
V
Z
I
ZK
Z
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
C
PP
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
R
Breakdown Voltage @ I
BR
Test Current
T
Maximum Temperature Coefficient of V
BR
Forward Current
F
Forward Voltage @ I
F
Maximum Zener Impedance @ I
ZT
F
Reverse Current
Maximum Zener Impedance @ I
ZK
T
ZT
ZK
BR
RWM
VCV
I
V
RWM
BR
UniDirectional TVS
I
F
I
V
R
F
I
T
I
PP
V
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