NUP5150MU
5-Line Transient Voltage
Suppressor Array
This 5-line transient voltage suppressor array is designed for
applications requiring transient voltage protection capability. It is
intended for use in over-transient voltage and ESD sensitive
equipment such as cell phones, portables, computers, printers and
other applications. This device features a monolithic common anode
design which protects five independent lines in a single
UDFN package. This device is ideal for situations where board space
is at a premium.
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UDFN6 5-LINE TRANSIENT
VOLTAGE SUPPRESSOR
Features
•Protects up to 5 Lines in a Single UDFN Package
•ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model
•Compliance with IEC 61000-4-2
•This is a Pb-Free Device
Applications
•Hand Held Portable Applications
•Serial and Parallel Ports
•Notebooks, Desktops, Servers
MAXIMUM RATINGS (T
Symbol Rating Value Unit
T
J
T
STG
T
L
ESD Human Body Model (HBM)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Operating Junction Temperature Range -40 to 125 °C
Storage Temperature Range -55 to 150 °C
Lead Solder Temperature – Maximum
(10 seconds)
IEC 61000-4-2 Contact (ESD)
= 25°C, unless otherwise specified)
J
260 °C
16000
8000
V
PIN ASSIGNMENT
1
2
3
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
6
5
4
MARKING
DIAGRAM
UDFN6
CASE 517AA
1
5 = Specific Device Code
M = Month Code
G = Pb-Free Package
*Specific Device Code orientation may vary
depending upon manufacturing location.
5 M
G
© Semiconductor Components Industries, LLC, 2007
September, 2007 - Rev. 0
ORDERING INFORMATION
Device Package Shipping
NUP5150MUTBG UDFN6
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1 Publication Order Number:
3000/Tape & Reel
†
NUP5150/D
NUP5150MU
ELECTRICAL CHARACTERISTICS (T
Parameter
= 25°C, unless otherwise specified)
J
Conditions Symbol Min Typ Max Unit
Reverse Working Voltage (Note 1) V
Breakdown Voltage IT = 1 mA, (Note 2) V
Reverse Leakage Current V
= 3 V I
RWM
Capacitance VR = 0 V, f = 1 MHz (Line to GND) C
1. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
RWM
2. VBR is measured at pulse test current IT.
RWM
BR
R
J
6.2 6.8 7.2 V
- 0.1
- 12 15 pF
- 5.0 V
mA
), which should be equal or greater than the DC
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2
NUP5150MU
14
12
10
8
6
4
1 MHz FREQUENCY
TYPICAL CAPACITANCE (pF)
2
0
01 2 3 6
BIAS VOLTAGE (V)
TA = 25°C
45
Figure 1. Capacitance
1.0
TA = 25 °C
TJ = 125 °C
0.1
100E-9
TA = 25 °C
10E-9
TJ = 125 °C
1.0E-9
100E-12
10E-12
REVERSE CURRENT (A)
1.0E-12
123456
TJ = 25 °C
TJ = -40°C
Figure 2. Typical Reverse Current vs. Reverse
REVERSE VOLTAGE (V)
Voltage
TJ = 25 °C
0.01
FORWARD CURRENT (A)
TJ = -40°C
0.001
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
FORWARD VOLTAGE (V)
Figure 3. Typical Forward Current vs. Forward Voltage
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3
NUP5150MU
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA-01
ISSUE B
10X
b
6X
0.10 B
0.05ACC
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
0.08 C
NOTE 3
0.10 C
L2
D
TOP VIEW
SIDE VIEW
1
3
46
BOTTOM VIEW
A1
A
B
E
(A3)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L2 0.40 0.50
A
MOUNTING FOOTPRINT*
6X
0.42
6X
0.22
C
SEATING
PLANE
L5X
0.40
PITCH
e
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
NUP5150/D
4
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