NCP81172
2-Phase Synchronous Buck
Controller with Integrated
Gate Drivers and PWM VID
Interface
The NCP81172, a general−purpose two−phase synchronous buck
controller, integrates gate drivers and PWM VID interface in a
QFN−24 package and provides a compact−footprint power
management solution for new generation computing processors. It
receives power save command (PSI) from processors and operates in
1−phase diode emulation mode to obtain high efficiency in light−load
condition. Operating in high switching frequency up to 800 kHz
allows employing small size inductor and capacitors. The part is able
to support all−ceramic−capacitor applications.
Features
4.5 V to 24 V Input Voltage Range
Output Voltage up to 2.0 V with PWM VID Interface
Differential Output Voltage Sense
Integrated Gate Drivers
200 kHz ~ 800 kHz Switching Frequency
Power Saving Interface (PSI)
Power Good Output
Programmable Over Current Protection
Over Voltage Protection
Under Voltage Protection
Temperature Sense and Alert Output
Thermal Shutdown Protection
QFN−24, 4 x 4 mm, 0.5 mm Pitch Package
This is a Pb−Free Device
Typical Applications
GPU and CPU Power
Graphics Card Applications
Desktop and Notebook Applications
http://onsemi.com
24
1
QFN24
CASE 485L
MARKING DIAGRAM
81172
ALYWG
G
81172 = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
PINOUT
HG2
BST2
PH219
LG220
PVCC21
PGND22
LG123
PH124
BST1
HG1
PGOOD
25
GND
EN
VCC
PSI
TALERT#
VID
131415161718
TSNS
COMP
FBRTN
VREF
REFIN
VIDBUF
654321
12
11
FB
10
9
FS
8
7
Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 1
(Top View)
ORDERING INFORMATION
Device Package Shipping
NCP81172MNTXG QFN24
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1 Publication Order Number:
4000 / Tape &
†
Reel
NCP81172/D
NCP81172
+5 V
+3.3 V
EN
PSI
VID
PG
TALT
15 VCC
25 GND
3
EN
4
PSI
16
PGOOD
14
TALERT#
5
VID
13 TSNS
8 VREF
7 REFIN
NCP81172
21PVCC
22PGND
2HG1
1BST1
24PH1
23LG1
17HG2
18BST2
19PH2
20LG2
10FBRTN
+5 V
VIN
VOUT
VIN
6 VIDBUF
9 FS
11FB
12COMP
Figure 1. Typical Application Circuit with PWM−VID Interface
http://onsemi.com
2
NCP81172
+5 V
+3.3 V
EN
PSI
PG
TALT
15 VCC
25 GND
EN
3
PSI
4
16
PGOOD
14
TALERT#
5
VID
13 TSNS
8 VREF
7 REFIN
NCP81172
21PVCC
22PGND
2HG1
1BST1
24PH1
23LG1
17HG2
18BST2
19PH2
20LG2
10FBRTN
+5 V
VIN
VOUT
VIN
6 VIDBUF
9 FS
11FB
12COMP
Figure 2. Typical Application Circuit without PWM−VID Interface
http://onsemi.com
3
NCP81172
15
3
16
13
14
4
9
8
VCC
EN
PGOOD
TSNS
TALERT#
PSI
FS
VREF
UVLO
&
PGOOD
Thermal
Management
PSI
Control
Ramp
Generator
Reference
Voltage
FAULT
RAMP1
PH1
RAMP2
2/1 Phase
PWM
Control
&
Protections
(OVP, UVP, OCP)
PWM1
PWM2
Gate Drive
1
Gate Drive
2
PVCC
PVCC
PVCC
PVCC
BST1
HG1
PH1
LG1
PGND
BST2
HG2
PH2
LG2
21
1
2
24
23
22
18
17
19
20
5
6
7
11
10
25
12
VID
VIDBUF
REFIN
FB
FBRTN
GND
COMP
CS1
Current
CS2
Figure 3. Functional Block Diagram
Sense
PGND
PWM1
PH1
LG1
PWM2
PH2
LG2
GND
http://onsemi.com
4
NCP81172
PIN DESCRIPTION
Pin Name Type Description
1 BST1 Analog Power Bootstrap 1. Provides bootstrap voltage for the high−side gate drive of phase 1.
2 HG1 Analog Output High−Side Gate 1. Directly connected with the gate of the high−side power MOSFET
3 EN Logic Input Enable. Logic high enables the device and logic low makes the device in standby
4 PSI Logic Input Power Saving Interface. Logic high enables 2 phase CCM operation, mid level
5 VID Logic Input Voltage ID. Voltage ID input from processor.
6 VIDBUF Analog Output Voltage ID Buffer. VID PWM pulse output from an internal buffer.
7 REFIN Analog Input Reference Input. Reference voltage input for output voltage regulation. The pin is
8 VREF Analog Output Output Reference Voltage. Precise 2 V reference voltage output. A 10 nF ceramic
9 FS Analog Input Frequency Selection. A resistor from this pin to ground programs switching frequency.
10 FBRTN Analog Input Voltage Feedback Return Input. An inverting input of internal error amplifier.
11 FB Analog Input Feedback. An inverting input of internal error amplifier.
12 COMP Analog Output Compensation. Output pin of error amplifier.
13 TSNS Analog Input Temperature Sensing. Temperature sensing input.
14 TALERT# Logic Output Thermal Alert. Open drain output and active low indicates over temperature.
15 VCC Analog Power
16 PGOOD Logic Output Power GOOD. Open−drain output. Provides a logic high valid power good output
17 HG2 Analog Output High−Side Gate 2. Connected with the gate of the high−side power MOSFET in
18 BST2 Analog Power Bootstrap 2. Provides bootstrap voltage for the high−side gate drive of phase 2.
19 PH2 Analog Input Phase Node 2. Connected to interconnection between high−side MOSFET and
20 LG2 Analog Output Low−Side Gate 2. Connected with the gate of the low−side power MOSFET in
21 PVCC Analog Power Voltage Supply of Gate Drivers. Power supply input pin of internal gate drivers.
22 PGND Analog Ground Power Ground. Power ground of internal gate drivers. Must be connected to the
23 LG1 Analog Output Low−Side Gate 1. Connected with the gate of the low−side power MOSFET in
24 PH1 Analog Input Phase Node 1. Connected to interconnection between high−side MOSFET and
25 THERM/GND Analog Ground Thermal Pad and Analog Ground. Ground of internal control circuits. Must be
A 0.1 mF ~ 1 mF ceramic capacitor is required from this pin to PH1 (pin 24).
of phase 1.
mode.
enables 1−phase CCM operation, and logic low enables 1−phase CCM/DCM
operation.
connected to a non−inverting input of internal error amplifier.
capacitor is required from this pin to GND.
Voltage Supply of Controller. Power supply input pin of control circuits. A 1 mF or larger
ceramic capacitor bypasses this input to GND. This capacitor should be placed as
close as possible to this pin.
signal, indicating the regulator’s output is in regulation window.
phase 2.
A 0.1 mF ~ 1 mF ceramic capacitor is required from this pin to PH2 (pin 19).
low−side MOSFET in phase 2.
phase 2.
A 4.7 mF or larger ceramic capacitor bypasses this input to ground. This capacitor
should be placed as close as possible to this pin.
system ground.
phase 1.
A resistor may be applied between this pin and GND to program OCP threshold.
low−side MOSFET in phase 1.
connected to the system ground.
http://onsemi.com
5