mESD3.3DT5G SERIES
ESD Protection Diodes
In Ultra Small SOT-723 Package
The mESD Series is designed to protect voltage sensitive components
from ESD. Excellent clamping capability, low leakage, and fast response
time, make these parts ideal for ESD protection on designs where board
space is at a premium. Because of its small size, it is suited for use in
cellular phones, portable devices, digital cameras, power supplies and
many other portable applications.
Specification Features:
•Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
•Low Body Height: 0.020″ (0.5 mm)
•Stand-off Voltage: 3.3 V - 6.0 V
•Low Leakage
•Response Time is Typically < 1 ns
•ESD Rating of Class 3 (> 16 kV) per Human Body Model
•IEC61000-4-2 Level 4 ESD Protection
•IEC61000-4-4 Level 4 EFT Protection
•These are Pb-Free Devices
Mechanical Characteristics:
CASE:
Void‐free, transfer‐molded, thermosetting plastic
Epoxy Meets UL 94 V-0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Value Unit
IEC 61000-4-2 (ESD) Air
IEC 61000-4-4 (EFT) 40 A
ESD Voltage Per Human Body Model
Total Power Dissipation on FR-5 Board
(Note 1) @ T
Derate above 25°C
Thermal Resistance Junction-to-Ambient
Junction and Storage Temperature Range TJ, T
Lead Solder Temperature - Maximum
(10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR-5 = 1.0 x 0.75 x 0.62 in.
Per Machine Model
= 25°C
A
Contact
⎪
P
D
R
q
JA
T
L
stg
±30
±30
16
400
240
1.9
525
-55 to
+150
260 °C
mW/°C
kV
kV
V
mW
°C/W
°C
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PIN 1. CATHODE
2. CATHODE
3. ANODE
1
3
2
MARKING
3
2
1
SOT-723
CASE 631AA
STYLE 4
DIAGRAM
xx M
xx = Device Code
M = Date Code
ORDERING INFORMATION
Device Package Shipping
mESDxxDT5G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SOT-723 8000/Tape & Reel
†
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
February, 2008 - Rev. 2
1 Publication Order Number:
mESD3.3DT5G/D
mESD3.3DT5G SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol Parameter
I
V
V
RWM
V
V
P
ELECTRICAL CHARACTERISTICS (T
mESD3.3DT5G
mESD5.0DT5G
mESD6.0DT5G
*Other voltages available upon request.
2. V
Maximum Reverse Peak Pulse Current
PP
Clamping Voltage @ I
C
PP
Working Peak Reverse Voltage
I
Maximum Reverse Leakage Current @ V
R
Breakdown Voltage @ I
BR
I
Test Current
T
I
Forward Current
F
Forward Voltage @ I
F
Peak Power Dissipation
pk
T
F
RWM
C Max. Capacitance @VR = 0 and f = 1 MHz
= 25°C unless otherwise noted, VF = 1.1 V Max. @ IF = 10 mA for all types)
A
V
(V)
RWM
Max Max Min mA Typ
Device*
Device
Marking
L0 3.3 1.0 5.0 1.0 47
L2 5.0 0.1 6.2 1.0 38
L3 6.0 0.1 7.0 1.0 34
is measured with a pulse test current IT at an ambient temperature of 25°C.
BR
I
(mA) @ V
R
VCV
BR
RWM
I
I
F
V
RWM
I
R
I
T
I
PP
Uni-Directional TVS
VBR (V) @ I
(Note 2)
V
F
T
V
I
C (pF)
T
http://onsemi.com
2
)
Z
7.4
@ I
7.3
Z
7.2
7.1
7.0
6.9
6.8
6.7
6.6
6.5
6.4
6.3
-55 +25
BREAKDOWN VOLTAGE (VOLTS) (V
mESDxxDT5G
TEMPERATURE (°C)
mESD3.3DT5G SERIES
TYPICAL CHARACTERISTICS
20
18
16
14
12
10
(nA)
R
I
8
6
4
2
+150
0
-55
mESDxxDT5G
+25
TEMPERATURE (°C)
+150
Figure 1. Typical Breakdown Voltage
versus Temperature
45
40
35
30
25
20
15
CAPACITANCE (pF)
10
5
0
012345
mESDxxDT5G
BIAS VOLTAGE (V)
Figure 3. Typical Capacitance versus Bias Voltage
Figure 2. Typical Leakage Current
versus Temperature
300
250
200
150
100
, POWER DISSIPATION (mW)
50
D
P
0
0 25 50 75 100 125 150 175
FR-5 BOARD
TEMPERATURE (°C)
Figure 4. Steady State Power Derating Curve
Figure 5. Positive 8 kV contact per IEC 6100-4-2
- mESD5.0DT5G
http://onsemi.com
Figure 6. Negative 8 kV contact per IEC 61000-4-2
- mESD5.0DT5G
3
b1
mESD3.3DT5G SERIES
PACKAGE DIMENSIONS
SOT-723
CASE 631AA-01
ISSUE A
NOTES:
-X-
D
3
1
2
e
-Y-
E
2X
b
X0.08 (0.0032) Y
A
H
L
E
C
SOLDER FOOTPRINT*
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.45 0.50 0.55
b 0.15 0.20 0.27
b1 0.25 0.3 0.35
C 0.07 0.12 0.17
D 1.15 1.20 1.25
E 0.75 0.80 0.85
e 0.40 BSC
H 1.15 1.20 1.25
E
L 0.15 0.20 0.25
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
INCHES
MIN NOM MAX
0.018 0.020 0.022
0.0059 0.0079 0.0106
0.010 0.012 0.014
0.0028 0.0047 0.0067
0.045 0.047 0.049
0.03 0.032 0.034
0.016 BSC
0.045 0.047 0.049
0.0059 0.0079 0.0098
0.40
0.0157
0.40
0.0157
1.0
0.039
0.40
0.0157
0.40
0.0157
0.40
0.0157
SCALE 20:1
ǒ
inches
mm
Ǔ
SOT-723
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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mESD3.3DT5G/D
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