The MC74VHC1G08 is an advanced high speed CMOS 2−input
AND gate fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
The MC74VHC1G08 input structure provides protection when
voltages up to 7.0 V are applied, regardless of the supply voltage. This
allows the MC74VHC1G08 to be used to interface 5.0 V circuits to
3.0 V circuits.
Features
• High Speed: t
• Low Power Dissipation: I
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Pin and Function Compatible with Other Standard Logic Families
• Chip Complexity: FETs = 62
• These Devices are Pb−Free and are RoHS Compliant
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
L
H
L
H
Y
L
L
L
H
MC74VHC1G08/D
MC74VHC1G08
MAXIMUM RATINGS
SymbolParameterValueUnit
V
V
V
OUT
I
I
OK
I
OUT
I
CC
T
STG
T
T
q
P
MSLMoisture SensitivityLevel 1
F
V
ESD
I
LATCHUP
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
SymbolCharacteristicsMinMaxUnit
V
V
V
OUT
T
t
r
Device Junction Temperature versus
Time to 0.1% Bond Failures
Temperature °C
DC Supply Voltage*0.5 to )7.0V
CC
DC Input Voltage−0.5 to +7.0V
IN
DC Output Voltage*0.5 to V
DC Input Diode Current−20mA
IK
CC
DC Output Diode Current$20mA
DC Output Sink Current$12.5mA
DC Supply Current per Supply Pin$25mA
Storage Temperature Range*65 to )150°C
Lead Temperature, 1 mm from Case for 10 Seconds260°C
L
Junction Temperature Under Bias)150°C
J
Thermal ResistanceSC70−5/SC−88A (Note 1)
JA
Power Dissipation in Still Air at 85°CSC70−5/SC−88A
D
Flammability RatingOxygen Index: 28 to 34UL 94 V−0 @ 0.125 in
R
TSOP−5
TSOP−5
ESD Withstand VoltageHuman Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
350
230
150
200
u2000
u200
N/A
Latchup PerformanceAbove VCC and Below GND at 125°C (Note 5)$500mA
DC Supply Voltage2.05.5V
CC
DC Input Voltage0.05.5V
IN
DC Output Voltage0.0V
Operating Temperature Range−55+125°C
A
, t
Input Rise and Fall TimeVCC = 3.3 V ± 0.3 V
f
V
= 5.0 V ± 0.5 V
CC
0
0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Junction
Time, HoursTime, Years
801,032,200117.8
90419,30047.9
100178,70020.4
11079,6009.4
= 130 C°
J
T
J
J
T
T
= 110 C°
= 120 C°
1
NORMALIZED FAILURE RATE
110100
TIME, YEARS
C°
= 90
= 100 C°
J
J
T
T
12037,0004.2
13017,8002.0
Figure 3. Failure Rate vs. Time
Junction Temperature
1408,9001.0
)0.5V
°C/W
CC
100
20
C°
= 80
J
T
1000
mW
V
V
ns/V
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2
DC ELECTRICAL CHARACTERISTICS
SymbolParameterTest Conditions
V
V
V
V
I
Minimum High−Level
IH
Input Voltage
Maximum Low−Level
IL
Input Voltage
Minimum High−Level
OH
Output Voltage
V
Maximum Low−Level
OL
Output Voltage
V
I
Maximum Input
IN
Leakage Current
Maximum Quiescent
CC
Supply Current
= VIH or V
IN
= VIH or V
IN
VIN = VIH or V
IL
VIN = VIH or V
IL
IOH = −50 mA
IL
IOH = −4 mA
IOH = −8 mA
VIN = VIH or V
IL
VIN = VIH or V
IL
IOL = 50 mA
IL
IOL = 4 mA
IOL = 8 mA
VIN = 5.5 V or GND0 to 5.5$0.1$1.0$1.0
VIN = VCC or GND5.51.01040
MC74VHC1G08
V
CC
(V)
2.0
3.0
4.5
5.5
2.0
3.0
4.5
5.5
2.0
3.0
4.5
3.0
4.5
2.0
3.0
4.5
3.0
4.5
TA = 255CTA v 855C*555C to 1255C
MinTypMaxMinMaxMinMax
1.5
2.1
3.15
3.85
1.9
2.9
4.4
2.58
3.94
2.0
3.0
4.5
0.0
0.0
0.0
0.5
0.9
1.35
1.65
0.1
0.1
0.1
0.36
0.36
1.5
2.1
3.15
3.85
1.9
2.9
4.4
2.48
3.80
0.5
0.9
1.35
1.65
0.1
0.1
0.1
0.44
0.44
1.5
2.1
3.15
3.85
1.9
2.9
4.4
2.34
3.66
0.5
0.9
1.35
1.65
0.1
0.1
0.1
0.52
0.52
Unit
V
V
V
V
mA
mA
AC ELECTRICAL CHARACTERISTICS Input t
Symbol
t
PLH
t
PHL
C
IN
,
Parameter
Maximum Propagation Delay,
Input A or B to Y
Maximum Input Capacitance
Test Conditions
VCC = 3.3 ± 0.3 VCL = 15 pF
VCC = 5.0 ± 0.5 VCL = 15 pF
r
= t
= 3.0 ns
f
C
L
C
L
= 50 pF
= 50 pF
Min
TA = 25°C
Typ
4.1
5.9
3.5
4.2
5.5
Max
8.8
12.3
5.9
7.9
10
TA ≤ 85°C
Min
−55 ≤ TA ≤ 125°C
Max
10.5
14.0
7.0
9.0
10
Min
Max
12.5
16.5
9.0
11.0
10
Unit
ns
pF
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Note 6)
11
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
power consumption; P
= CPD V
D
2
fin + ICC VCC.
CC
= CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
)
CC(OPR
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3
MC74VHC1G08
V
CC
Input A or B
Output Y
50% V
50%
t
PLH
50% V
CC
CC
t
PHL
Figure 4. Switching Waveforms
GND
V
OH
V
OL
INPUT
C
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended
for propagation delay tests.
Figure 5. Test Circuit
OUTPUT
L*
DEVICE ORDERING INFORMATION
DevicePackageShipping
MC74VHC1G08DFT1G
NLVVHC1G08DFT1G*
MC74VHC1G08DFT2G
SC70−5/SC−88A/SOT−353
(Pb−Free)
3000 / Tape & Reel
NLVVHC1G08DFT2G*
MC74VHC1G08DTT1G
SOT23−5/TSOP−5/SC59−5
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
†
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4
MC74VHC1G08
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE K
A
G
45
D
5 PL
−B−
MM
B0.2 (0.008)
S
12 3
N
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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PUBLICATION ORDERING INFORMATION
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC74VHC1G08/D
6
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