ON M74VHC1GT66DFT1G, M74VHC1GT66DTT1G, MC74VHC1GT66DFT2 Schematic [ru]

MC74VHC1GT66

SPST (NO) Normally Open
Analog Switch

The MC74VHC1GT66 is a Single Pole Single Throw (SPST)
analog switch. It achieves high speed propagation delays and low ON
resistances while maintaining low power dissipation. This bilateral
switch controls analog and digital voltages that may vary across the
full power−supply range (from V

The MC74VHC1GT66 is compatible in function to a single gate of
the High Speed CMOS MC74VHCT4066 and the metal−gate CMOS
MC14066. The device has been designed so that the ON resistances
(R

) are much lower and more linear over input voltage than RON of

ON

the metal−gate CMOS or High Speed CMOS analog switches.

The ON/OFF Control input is compatible with TTL−type input
thresholds allowing the device to be used as a logic−level translator
from 3 V CMOS logic to 5 V CMOS logic or from 1.8 V CMOS logic
to 3 V CMOS logic while operating at the high−voltage power supply.
The input protection circuitry on this device allows overvoltage
tolerance on the input, which provides protection when voltages of up
to 7 V are applied, regardless of the supply voltage. This allows the
MC74VHC1GT66 to be used to interface 5 V circuits to 3 V circuits.

Features

• High Speed: t

= 20 ns (Typ) at VCC = 5 V

PD

• Low Power Dissipation: I

• Diode Protection Provided on Inputs and Outputs

• Improved Linearity and Lower ON Resistance over Input Voltage

• On/Off Control Input Has OVT

• Chip Complexity: FETs = 11; Equivalent Gates = 3

• Pb−Free Packages are Available

to GND).

CC

= 1.0 mA (Max) at TA = 25°C

CC

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MARKING

DIAGRAMS

5

1

5

1

VE = Device Code
M = Date Code*
W = Work Week
G = Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or position may vary

depending upon manufacturing location.

1

2

3 GND

4

5V

SC−88A

DF SUFFIX

CASE 419A

TSOP−5

DT SUFFIX

CASE 483

PIN ASSIGNMENT

ON/OFF CONTROL

5

1

5

1

IN/OUT X

OUT/IN Y

CC

M

VE MG

VE MG

G

A

A

G

© Semiconductor Components Industries, LLC, 2011

August, 2011 − Rev. 15

FUNCTION TABLE

On/Off Control Input State of Analog Switch

L

H

ORDERING INFORMATION

See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.

1 Publication Order Number:

Off
On

MC74VHC1GT66/D

MC74VHC1GT66

IN/OUT X

OUT/IN Y

GND

1

A

2

A

3

5

4

V

CC

ON/OFF
CONTROL

(SC−88A, TSOP−5)

Figure 1. Pinout Diagram

ON/OFF CONTROL

IN/OUT X

A

X 1

1

U U

1

OUT/IN Y

A

Figure 2. Logic Symbol

MAXIMUM RATINGS

Symbol Characteristics Value Unit

V

V

V

I

T

q

MSL Moisture Sensitivity Level 1

V

I

Latchup

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.

DC Supply Voltage −0.5 to +7.0 V

CC

DC Input Voltage −0.5 to +7.0 V

IN

Analog Output Voltage −0.5 to 7.0 V

IS

I

Input Diode Current −20 mA

IK

DC Supply Current, VCC and GND +25 mA

CC

Storage Temperature Range *65 to )150 °C

STG

T

Lead Temperature, 1 mm from Case for 10 Seconds 260 °C

L

T

Junction Temperature Under Bias )150 °C

J

Thermal Resistance SC70−5 (Note 1)

JA

P

Power Dissipation in Still Air at 85°CSC70−5

D

F

Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

R

ESD Withstand Voltage Human Body Model (Note 2)

ESD

Machine Model (Note 3)

SOT23−5

SOT23−5

Charged Device Model (Note 4)

350
230

150
200

u2000

u200

N/A

Latchup Performance Above VCC and Below GND at 125°C (Note 5) $500 mA

°C/W

mW

V

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2

MC74VHC1GT66

RECOMMENDED OPERATING CONDITIONS

Symbol Characteristics Min Max Unit

V

V

V

t

Device Junction Temperature versus
Time to 0.1% Bond Failures

Temperature °C

DC Supply Voltage 2.0 5.5 V

CC

Digital Input Voltage GND 5.5 V

IN

Analog Input Voltage GND V

IS

T

Operating Temperature Range −55 +125 °C

A

, tfInput Rise and Fall Time VCC = 3.3 V ± 0.3 V

r

Junction

Time, Hours Time, Years

V

= 5.0 V ± 0.5 V

CC

FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR

0
0

80 1,032,200 117.8

90 419,300 47.9

100 178,700 20.4

110 79,600 9.4

120 37,000 4.2

130 17,800 2.0

140 8,900 1.0

=120 C°

= 130 C°

J

T

=110 C°

J

J

T

T

1

1 10 100

NORMALIZED FAILURE RATE

TIME, YEARS

Figure 3. Failure Rate vs. Time Junction Temperature

= 90 C°

=100 C°

J

J

T

T

CC

100

20

ns/V

= 80 C°

J

T

1000

V

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