ON ESD9P5.0ST5G Schematic [ru]
ESD9P5.0ST5G
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra−Low
Capacitance
The ESD9P Series is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs that
utilize high−speed lines such as USB.
Specification Features:
• Low Capacitance 1.3 pF
• Low Clamping Voltage
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.4 mm)
• Stand−off Voltage: 5 V
• Low Leakage
• Response Time is Typically < 1.0 ns
• IEC61000−4−2 Level 4 ESD Protection
• This is a Pb−Free Device
Mechanical Characteristics:
Void-free, transfer-molded, thermosetting plastic
CASE:
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Value Unit
IEC 61000−4−2 (ESD) Contact
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Junction and Storage Temperature Range TJ, T
Lead Solder Temperature − Maximum
(10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
Air
°PD° 150 mW
stg
T
L
±10
±15
−55 to
+150
260 °C
kV
°C
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SOD−923
CASE 514AB
MARKING DIAGRAM
T M
T = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device Package Shipping
ESD9P5.0ST5G SOD−923
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
(Pb−Free)
8000/Tape & Reel
†
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2010
May, 2010 − Rev. 0
1 Publication Order Number:
ESD9P5.0S/D
ESD9P5.0ST5G
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol Parameter
V
I
V
RWM
V
V
P
Maximum Reverse Peak Pulse Current
PP
Clamping Voltage @ I
C
PP
Working Peak Reverse Voltage
I
Maximum Reverse Leakage Current @ V
R
Breakdown Voltage @ I
BR
I
Test Current
T
I
Forward Current
F
Forward Voltage @ I
F
Peak Power Dissipation
pk
T
F
RWM
C Max. Capacitance @ VR = 0 and f = 1.0 MHz
VCV
V
RWM
BR
Uni−Directional TVS
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted, VF = 1.0 V Max. @ IF = 10 mA for all types)
A
V
RWM
(V)
I
R
@ V
(mA)
RWM
VBR (V) @ I
(Note 2)
T
I
C (pF)
T
Device
Device
Marking
Max Max Min mA Max Max
ESD9P5.0ST5G T 5.0 1.0 5.8 1.0 1.3 9.8 Figures1and 2
* The “G’’ suffix indicates Pb−Free package available.
**Other voltages available upon request.
2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C.
3. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
4. Surge current waveform per Figure 5.
I
I
F
I
V
R
F
I
T
I
PP
VC (V)
@ IPP = 1 A
(Note 4)
V
V
C
Per IEC61000−4−2
(Note 3)
See Below
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
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Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC61000−4−2
2
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