ON ESD9C3.3ST5G, ESD9C5.0ST5G Schematic [ru]

ESD9C3.3ST5G SERIES

Transient Voltage
Suppressors

Micro-Packaged Diodes for ESD Protection

The ESD9C3.3ST5G Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage, and
fast response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its small size, it is suited
for use in cellular phones, portable devices, digital cameras, power
supplies and many other portable applications.

Specification Features:

•Low Capacitance 6.2 pF - 13 pF

•Low Clamping Voltage

•Small Body Outline Dimensions:

0.039″ x 0.024″ (1.0 mm x 0.60 mm)

•Low Body Height: 0.016″ (0.40 mm) Max

•Stand-off Voltage: 3.3 V, 5 V

•Low Leakage

•Response Time < 1 ns

•ESD Rating of Class 3 (> 16 kV) per Human Body Model

•IEC61000-4-2 Level 4 ESD Protection

•These are Pb-Free Devices

Mechanical Characteristics:

Void‐free, transfer‐molded, thermosetting plastic

CASE:

Epoxy Meets UL 94 V-0

LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

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12

PIN 1. CATHODE

2. ANODE

MARKING
DIAGRAM

SOD-923

CASE 514AB

X = Specific Device Code
M = Date Code

ORDERING INFORMATION

Device Package Shipping

ESD9CxxST5G SOD-923

(Pb-Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

X M

†

8000/Tape & Reel

MAXIMUM RATINGS

Rating Symbol Value Unit

IEC 61000-4-2 (ESD) Contact

Total Power Dissipation on FR-5 Board
(Note 1) @ TA = 25°C

Junction and Storage Temperature
Range

Lead Solder Temperature - Maximum
(10 Second Duration)

Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.

1. FR-5 = 1.0 x 0.75 x 0.62 in.

Air

⎪P

TJ, T

T

D

stg

L

±8.0

±15

150

-55 to +150 °C

260 °C

kV

mW

See specific marking information in the device marking
column of the table on page 2 of this data sheet.

See Application Note AND8308/D for further description of survivability specs.

© Semiconductor Components Industries, LLC, 2008

April, 2008 - Rev. 2

1 Publication Order Number:

DEVICE MARKING INFORMATION

ESD9C3.3S/D

ESD9C3.3ST5G SERIES

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted)

Symbol Parameter

I

V

V

RWM

V

V

P

*See Application Note AND8308/D for detailed explanations of

datasheet parameters.

ELECTRICAL CHARACTERISTICS (T

ESD9C3.3ST5G R 3.3 1.0 5.0 1.0 12.8 13

ESD9C5.0ST5G P 5.0 0.5 11.0 1.0 6.0 6.2

2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C.

3. Capacitance at f = 1 MHz, VR = 0 V, TA = 25°C.

4. For test procedure see Figures 3 and 4 and Application Note AND8307/D.

5. ESD9C5.0ST5G shown below. Other voltages available upon request.

Maximum Reverse Peak Pulse Current

PP

Clamping Voltage @ I

C

PP

Working Peak Reverse Voltage

I

Maximum Reverse Leakage Current @ V

R

Breakdown Voltage @ I

BR

I

Test Current

T

I

Forward Current

F

Forward Voltage @ I

F

Peak Power Dissipation

pk

T

F

C Max. Capacitance @VR = 0 and f = 1 MHz

= 25°C unless otherwise noted, VF = 1.1 V Max. @ IF = 10 mA)

A

I

(mA)

R

@ V

V

Device

Device

Marking

(V)

RWM

Max Max Min mA Typ Max Per IEC61000-4-2 (Note 4)

RWM

RWM

VBR (V) @ I

(Note 2)

V

VCV

BR

RWM

Uni-Directional TVS

T

C (pF)

(Note 3)

I

T

(Note 3)

I

F

C (pF)

I

I

V

R

F

I

T

I

PP

V

V

C

Figures 1 and 2

See Below

(Note 5)

Figure 1. ESD Clamping Voltage Screenshot

Positive 8 kV Contact per IEC61000-4-2

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Figure 2. ESD Clamping Voltage Screenshot

Negative 8 kV Contact per IEC61000-4-2

2