Datasheet CM1692-04DE, CM1692-06DE, CM1692-08DE Datasheet (ON) [ru]

CM1692

Praetorian L-C LCD and
Camera EMI Filter Array
with ESD Protection

Features

• Four, Six and Eight Channels of EMI Filtering with Integrated

ESD Protection

• Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C)

Network

• ±15 kV ESD Protection on Each Channel

(IEC 61000−4−2 Level 4, Contact Discharge)

• Greater than 30 dB Attenuation (Typical) at 1 GHz

• 0.50 mm Thick mDFN Package with 0.40 mm Lead Pitch:

♦ 4−channel = 8−lead mDFN
♦ 6−channel = 12−lead mDFN
♦ 8−channel = 16−lead mDFN

• Tiny mDFN Package Size:

♦ 8−lead: 1.70 mm x 1.35 mm
♦ 12−lead: 2.50 mm x 1.35 mm
♦ 16−lead: 3.30 mm x 1.35 mm

• These Devices are Pb−Free and are RoHS Compliant

Applications

• LCD and Camera Data Lines in Mobile Handsets

• Wireless Handsets

• LCD and Camera Modules

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UDFN8

DE SUFFIX

CASE 517BC

UDFN12

DE SUFFIX

CASE 517BD

UDFN16

DE SUFFIX

CASE 517BE

ELECTRICAL SCHEMATIC

Filter

+

ESDn*

GND

1 of 4, 6 or 8 EMI/RFI Filter Channels

with Integrated ESD Protection

* See Package/Pinout Diagrams for expanded pin information.

17 nH

12 pF12 pF

MARKING DIAGRAM

P92 MG

G

1

(Note: Microdot may be in either location)

P926 MG

G

1

P92 = CM1692−04DE
P926 = CM1692−06DE
P928 = CM1692−08DE
M = Date Code
G = Pb−Free Package

1

P928 MG

G

Filter

+

ESDn*

© Semiconductor Components Industries, LLC, 2011

April, 2011 − Rev. 4

ORDERING INFORMATION

Device Package Shipping

CM1692−04DE

CM1692−06DE

CM1692−08DE

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.

1 Publication Order Number:

mDFN−8

(Pb−Free)

mDFN−12

(Pb−Free)

mDFN−16

(Pb−Free)

3000/Tape & Reel

3000/Tape & Reel

3000/Tape & Reel

†

CM1692/D

CM1692

PACKAGE / PINOUT DIAGRAMS

Pin 1

Marking

Top View

(Pins Down View)

8765

P92

1234 8765

CM1692−04DE

8 Lead mDFN Package

Pin 1

Marking

Bottom View

(Pins Up View)

1234

(Pins Down View)

14 12

1516 1110 9

12345678

GND

PAD

Top View

13

P928

CM1692−08DE

16 Lead mDFN Package

(Pins Down View)

Pin 1

Marking

1 2 3 4 12 1110 956 87

Bottom View

(Pins Up View)

12345678

GND

PAD

1314 121516 1110 9

Top View

P926

CM1692−06DE

12 Lead mDFN Package

Bottom View
(Pins Up View)
123412 1110 9 5 687

GND
PAD

Table 1. PIN DESCRIPTIONS

Device Pin(s)

−04 −06 −08 −04 −06 −08

1 1 1 FILTER1 Filter + ESD Channel 1 8 12 16 FILTER1 Filter + ESD Channel 1

2 2 2 FILTER2 Filter + ESD Channel 2 7 11 15 FILTER2 Filter + ESD Channel 2

3 3 3 FILTER3 Filter + ESD Channel 3 6 10 14 FILTER3 Filter + ESD Channel 3

4 4 4 FILTER4 Filter + ESD Channel 4 5 9 13 FILTER4 Filter + ESD Channel 4

− 5 5 FILTER5 Filter + ESD Channel 5 − 8 12 FILTER5 Filter + ESD Channel 5

− 6 6 FILTER6 Filter + ESD Channel 6 − 7 11 FILTER6 Filter + ESD Channel 6

− − 7 FILTER7 Filter + ESD Channel 7 − − 10 FILTER7 Filter + ESD Channel 7

− − 8 FILTER8 Filter + ESD Channel 8 − − 9 FILTER8 Filter + ESD Channel 8

GND PAD GND Device Ground − − − −

Name Description

Device Pin(s)

Name Description

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2

CM1692

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range −65 to +150 °C

Current per Inductor 30 mA

DC Package Power Rating 500 mW

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range –40 to +85 °C

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol Parameter Conditions Min Ty p Max Units

L Channel Inductance 17 nH

C

TOTAL

C Capacitance C1 At 2.5 V DC Reverse Bias,

V

DIODE

I

LEAK

V

SIG

V

ESD

R

DYN

f

C

1. T

= 25°C unless otherwise specified.

A

2. ESD applied to input and output pins with respect to GND, one at a time.

3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is
measured at pin C1). Unused pins are left open.

Total Channel Capacitance At 2.5 V DC Reverse Bias,

1 MHz, 30 mV AC

1 MHz, 30 mV AC

Stand−off Voltage

Diode Leakage Current (Reverse Bias) V

Signal Clamp Voltage

Positive Clamp
Negative Clamp

In−system ESD Withstand Voltage

I

= 10 mA

DIODE

= 3.3 V 0.1 1.0

DIODE

(Note 3)
I

= 10 mA

LOAD

I

= −10 mA

LOAD

(Notes 2 and 3)
Contact Discharge per
IEC 61000−4−2 Standard, Level 4

Dynamic Resistance

Positive
Negative

Roll−off Frequency at −6 dB Attenuation

Z

SOURCE

= 50 W, Z

LOAD

= 50 W

18.8 23.5 28.2 pF

11.8 pF

6.0 V

mA

5.6

6.8

−1.5

−0.8

9.0

−0.4

kV

±15

2.3

0.9

MHz

400

V

W

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3

PERFORMANCE INFORMATION

Typical Diode Capacitance vs. Input Voltage

Capacitance (Normalized)

Figure 1. Filter Capacitance vs. Input Voltage

(normalized to capacitance at 2.5 V DC and 25C)

CM1692

DC Voltage (V)

0 dB

−10 dB

−20 dB

−30 dB

−40 dB

−50 dB

3 10 100 1000 6000

FREQUENCY (MHz)

2000

Figure 2. Typical Performance Curve

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4

CM1692

PACKAGE DIMENSIONS

UDFN8, 1.7x1.35, 0.4P

CASE 517BC−01

ISSUE O

2X

0.10 C

PIN ONE

REFERENCE

2X

8X

NOTE 4

0.05 C

0.05 C

DETAIL A

L

8X

0.10 C

TOP VIEW

SIDE VIEW

1

8

K8X

e

e/2

BOTTOM VIEW

D

DETAIL B

D2

A1

A

B

E

A

E2

8X

b

0.10 B

0.05ACC

(A3)

C

SEATING
PLANE

NOTE 3

EXPOSED Cu

A1

CONSTRUCTIONS

L1

MOLD CMPD

A3

DETAIL B

ALTERNATE

L

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTIONS

RECOMMENDED

SOLDERING FOOTPRINT*

PACKAGE
OUTLINE

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND

0.25 mm FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55

A1 0.00 0.05

L

1.40

A3 0.13 REF

b 0.15 0.25

D 1.70 BSC

D2 1.10 1.30

E 1.35 BSC

E2 0.30 0.50

e 0.40 BSC

K 0.15 −−−

L 0.20 0.30

L1 −−− 0.05

8X

0.40

1.55

0.50
1

8X

0.25

0.40 PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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5

CM1692

PACKAGE DIMENSIONS

UDFN12, 2.5x1.35, 0.4P

CASE 517BD−01

ISSUE O

2X

PIN ONE

REFERENCE

12X

NOTE 4

0.10 C

2X

0.05 C

0.05 C

12X

L

0.10 C

K

D

TOP VIEW

DETAIL B

SIDE VIEW

D2

1

e

BOTTOM VIEW

DETAIL A

6

712

A

B

E

A

(A3)

A1

E2

b

12X

0.10 B

0.05ACC

C

NOTES:

L

MOLD CMPD

A3

1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND

0.25 mm FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF

b 0.15 0.25

D 2.50 BSC
D2 1.90 2.10

E 1.35 BSC
E2 0.30 0.50

e 0.40 BSC

K 0.15 −−−

L 0.20 0.30
L1 −−− 0.05

SEATING
PLANE

L1

EXPOSED Cu

A1

L

DETAIL A

OPTIONAL

CONSTRUCTIONS

DETAIL B

OPTIONAL

CONSTRUCTION

RECOMMENDED

SOLDERING FOOTPRINT*

PACKAGE

OUTLINE

NOTE 3

0.50

0.40

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

2.20

12X

0.25

DIMENSIONS: MILLIMETERS

12X

0.40

1.55

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6

CM1692

PACKAGE DIMENSIONS

UDFN16, 3.3x1.35, 0.4P

CASE 517BE−01

ISSUE O

2X

0.10 C

PIN ONE

REFERENCE

2X

0.05 C

16X

0.05 C

NOTE 4

16X

L

0.10 C

K

D

TOP VIEW

DETAIL B

SIDE VIEW

D2

1

e

BOTTOM VIEW

DETAIL A

8

916

16X

A

B

E

A

(A3)

A1

C

E2

b

0.10 B

0.05ACC

SEATING
PLANE

NOTE 3

NOTES:

L

MOLD CMPD

A3

1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND

0.25 mm FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF

b 0.15 0.25

D 3.30 BSC
D2 2.70 2.90

E 1.35 BSC
E2 0.30 0.50

e 0.40 BSC
K 0.15 −−−
L 0.20 0.30

L1 −−− 0.05

L1

EXPOSED Cu

A1

L

DETAIL A

OPTIONAL

CONSTRUCTIONS

DETAIL B

OPTIONAL

CONSTRUCTION

RECOMMENDED

SOLDERING FOOTPRINT*

16X

0.25

16X

0.40

PACKAGE

OUTLINE

3.00

0.50

0.40

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

1.55

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ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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CM1692/D

7