ON BSS138LT1 Schematic [ru]

BSS138LT1

Preferred Device

Power MOSFET
200 mA, 50 V

N−Channel SOT−23

Typical applications are DC−DC converters, power management in
portable and battery−powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.

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Features

• Pb−Free Packages are Available

• Low Threshold Voltage (V

Low Voltage Applications

: 0.5 V−1.5 V) Makes it Ideal for

GS(th)

• Miniature SOT−23 Surface Mount Package Saves Board Space

MAXIMUM RATINGS (T

Rating Symbol Value Unit

Drain−to−Source Voltage V
Gate−to−Source Voltage − Continuous V
Drain Current

− Continuous @ T

− Pulsed Drain Current (t
Total Power Dissipation @ TA = 25°C P
Operating and Storage Temperature

Range
Thermal Resistance − Junction−to−Ambient R
Maximum Lead Temperature for Soldering

Purposes, for 10 seconds

Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.

= 25°C unless otherwise noted)

A

= 25°C

A

≤ 10 s)

p

DSS

I

I

DM

TJ, T

T

GS

D



50 Vdc

± 20 Vdc

200
800

stg

225 mW

− 55 to
150

556 °C/W
260 °C

D

JA
L

mA

°C

200 mA, 50 V

N−Channel

3

= 3.5 

3

2

SOT−23
CASE 318
STYLE 21

Gate

3

Drain

J1M

21

Source

R

DS(on)

1

1

2

MARKING DIAGRAM & PIN ASSIGNMENT

J1 = Device Code
M = Date Code

 Semiconductor Components Industries, LLC, 2004

June, 2004 − Rev. 3

ORDERING INFORMATION

Device Package Shipping

BSS138L T1 SOT−23 3000 Tape & Reel
BSS138LT1G SOT−23

(Pb−Free)

BSS138L T3 SOT−23 10,000 Tape & Reel
BSS138LT3G SOT−23

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

Preferred devices are recommended choices for future use
and best overall value.

1 Publication Order Number:

3000 Tape & Reel

10,000 Tape & Reel

BSS138LT1/D

†

BSS138LT1

ELECTRICAL CHARACTERISTICS (T

= 25°C unless otherwise noted)

A

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS

Drain−to−Source Breakdown Voltage

= 0 Vdc, ID = 250 Adc)

(V

GS

Zero Gate Voltage Drain Current

(V

= 25 Vdc, VGS = 0 Vdc)

DS

= 50 Vdc, VGS = 0 Vdc)

(V

DS

Gate−Source Leakage Current (VGS = ± 20 Vdc, VDS = 0 Vdc) I

ON CHARACTERISTICS (Note 1)

Gate−Source Threshold Voltage

(V

= VGS, ID = 1.0 mAdc)

DS

Static Drain−to−Source On−Resistance

(V

= 2.75 Vdc, ID < 200 mAdc, TA = −40°C to +85°C)

GS

(V

= 5.0 Vdc, ID = 200 mAdc)

GS

Forward Transconductance

(V

= 25 Vdc, ID = 200 mAdc, f = 1.0 kHz)

DS

DYNAMIC CHARACTERISTICS

Input Capacitance

(VDS = 25 Vdc, VGS = 0, f = 1 MHz) C
Output Capacitance (VDS = 25 Vdc, VGS = 0, f = 1 MHz) C
Transfer Capacitance (VDG = 25 Vdc, VGS = 0, f = 1 MHz) C

SWITCHING CHARACTERISTICS (Note 2)

Turn−On Delay Time
Turn−Off Delay Time

(VDD = 30 Vdc, ID = 0.2 Adc,)

1. Pulse Test: Pulse Width ≤300 s, Duty Cycle ≤ 2%.

2. Switching characteristics are independent of operating junction temperature.

V

(BR)DSS

I

DSS

GSS

V

GS(th)

r

DS(on)

g

t

d(on)

t

d(off)

fs

iss

oss

rss

50 − − Vdc

Adc

−

−

−

−

0.1

0.5

− − ±0.1 Adc

0.5 − 1.5 Vdc

Ohms

−

−

5.6

−

3.5

10

100 − − mmhos

− 40 50 pF

− 12 25

− 3.5 5.0

− − 20

ns

− − 20

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2

BSS138LT1

TYPICAL ELECTRICAL CHARACTERISTICS

0.8
T

= 25°C

J

0.7

0.6

0.5

0.4

0.3

, DRAIN CURRENT (AMPS)

0.2

D

I

0.1

0

024 10

13 957

V

, DRAIN−TO−SOURCE VOLTAGE (VOLTS)

DS

VGS = 3.5 V

VGS = 3.25 V

VGS = 3.0 V

VGS = 2.75 V

VGS = 2.5 V

6

8

Figure 1. On−Region Characteristics

2.2

2

1.8

1.6

1.4

1.2

(NORMALIZED)

VGS = 10 V
I

= 0.8 A

D

VGS = 4.5 V
I

D

= 0.5 A

, VARIANCE (VOLTS)

0.9

0.8

0.7

0.6

0.5

0.4

0.3

, DRAIN CURRENT (AMPS)

D

0.2

I

0.1

0

1.25

1.125

1

VDS = 10 V

−55°C

1 1.5 2 2.5 3

VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)

Figure 2. Transfer Characteristics

ID = 1.0 mA

25°C

3.5

150°C

4

4.50.50

1

, DRAIN−TO−SOURCE RESISTANCE

0.8

DS(on)

R

0.6

−55 −5 45 95

T

, JUNCTION TEMPERATURE (°C)

J

Figure 3. On−Resistance Variation with

Temperature

10

, GATE−TO−SOURCE VOLTAGE (VOLTS)

GS

V

8

6

4

2

0

0

VDS = 40 V
T

= 25°C

J

500

0.875

gs(th)

V

145

1000

Q

, TOTAL GATE CHARGE (pC)

T

0.75

ID = 200 mA

1500

−55 −5 45 95 145

2000

Figure 5. Gate Charge

−30 20 70 120

T

, JUNCTION TEMPERATURE (°C)

J

Figure 4. Threshold Voltage Variation

with Temperature

2500 3000

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3

BSS138LT1

TYPICAL ELECTRICAL CHARACTERISTICS

10

VGS = 2.5 V

9

8

7

6

5

4

3

2

, DRAIN−TO−SOURCE RESISTANCE (OHMS)

1

0 0.1 0.2

DS(on)

R

0.05 0.15 0.25

ID, DRAIN CURRENT (AMPS)

Figure 6. On−Resistance versus Drain Current

6

VGS = 4.5 V

5.5

5

4.5

4

3.5

3

2.5

2

, DRAIN−TO−SOURCE RESISTANCE (OHMS)

1.5

1

DS(on)

R

0 0.2 0.40.05

0.1 0.3 0.5

I

, DRAIN CURRENT (AMPS)

D

0.25 0.450.15 0.35

150°C

25°C

−55°C

150°C

25°C

−55°C

8

7

6

5

4

3

2

, DRAIN−TO−SOURCE RESISTANCE (OHMS)

1

DS(on)

R

VGS = 2.75 V

0 0.1 0.2

0.05 0.15 0.25

I

, DRAIN CURRENT (AMPS)

D

Figure 7. On−Resistance versus Drain Current

4.5

VGS = 10 V

4

3.5

3

2.5

2

1.5

, DRAIN−TO−SOURCE RESISTANCE (OHMS)

1

DS(on)

R

0 0.2 0.40.05

0.1 0.3 0.5

, DRAIN CURRENT (AMPS)

I

D

0.25 0.450.15 0.35

150°C

25°C

−55°C

150°C

25°C

−55°C

Figure 8. On−Resistance versus Drain Current

1

T

= 150°C

0.1

0.01

, DIODE CURRENT (AMPS)

D

I

0.001

0 0.2 0.4 0.6

J

0.8

VSD, DIODE FORWARD VOLTAGE (VOLTS)

Figure 10. Body Diode Forward Voltage

−55°C25°C

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4

Figure 9. On−Resistance versus Drain Current

120

100

80

60

C

iss

40

C

20

C

rss

0

0

oss

510

15

Figure 11. Capacitance

201.0 1.2

25

BSS138LT1

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AH

A

L

3

1

2

S

B

GV

C

D

H

K

J

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.
4. 318−03 AND −07 OBSOLETE, NEW STANDARD

318−08.

INCHES

DIMAMIN MAX MIN MAX

0.1102 0.1197 2.80 3.04

B 0.0472 0.0551 1.20 1.40
C 0.0350 0.0440 0.89 1.11
D 0.0150 0.0200 0.37 0.50
G 0.0701 0.0807 1.78 2.04
H 0.0005 0.0040 0.013 0.100

J 0.0034 0.0070 0.085 0.177
K 0.0140 0.0285 0.35 0.69
L 0.0350 0.0401 0.89 1.02
S 0.0830 0.1039 2.10 2.64
V 0.0177 0.0236 0.45 0.60

STYLE 21:

PIN 1. GATE

2. SOURCE

3. DRAIN

MILLIMETERS

SOLDERING FOOTPRINT*

0.95

0.95

0.037

0.037

2.0

0.079

0.9

0.035

0.8

0.031

mm



SCALE 10:1

inches



*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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5

BSS138LT1

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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For additional information, please contact your
local Sales Representative.

BSS138LT1/D

6