ON ADM1032ARMZ-1RL, ADM1032ARMZ-2R, ADM1032ARMZ-REEL, ADM1032ARZ Schematic [ru]

ADM1032

+15C Remote and Local System Temperature Monitor

The ADM1032 is a dual-channel digital thermometer and under/overtemperature alarm intended for use in PCs and thermal management systems. The device can measure the temperature of a remote thermal diode, which can be located on the processor die or can be a discrete device (2N3904/06), accurate to 1°C. A novel measurement technique cancels out the absolute value of the transistor’s base emitter voltage so that no calibration is required. The ADM1032 also measures its ambient temperature.

The ADM1032 communicates over a 2-wire serial interface compatible with System Management Bus (SMBus) standards. Under/overtemperature limits can be programmed into the device over the SMBus, and an ALERT

output signals when the on−chip or remote temperature measurement is out of range. This output can be used as an interrupt or as a SMBus alert. The THERM output is a comparator output that allows CPU clock throttling or on/off control of a cooling fan. An ADM1032−1 and ADM1032−2 are available. The difference

THERM

between the ADM1032 and the ADM1032−1 is the default value of the external THERM

limit. The ADM1032−2 has a different SMBus

address. The SMBus address of the ADM1032−2 is 0x4D.

Features

• On-chip and Remote Temperature Sensing

• Offset Registers for System Calibration

• 0.125°C Resolution/1°C Accuracy on Remote Channel

• 1°C Resolution/3°C Accuracy on Local Channel

• Fast (Up to 64 Measurements Per Second)

• 2-wire SMBus Serial Interface

• Supports SMBus Alert

• Programmable Under/Overtemperature Limits

• Programmable Fault Queue

• Overtemperature Fail-safe THERM Output

• Programmable THERM Limits

• Programmable THERM Hysteresis

• 170 mA Operating Current

• 5.5 mA Standby Current

• 3.0 V to 5.5 V Supply

• Small 8-lead SOIC and MSOP Packages

• These are Pb-Free Devices*

Applications

• Desktop and Notebook Computers

• Smart Batteries

(Note: Microdot may be in either location)

• Industrial Controllers

• Telecommunications Equipment

• Instrumentation

See detailed ordering and shipping information in the package dimensions section on page 16 of this data sheet.

• Embedded Systems

*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

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SOIC−8 NB

CASE 751

PIN ASSIGNMENT

D+

D−

(Top View)

MARKING DIAGRAMS

1032AR

#YYWW

XXXX

SOIC−8 NB

1023AR = Specific Device Code # = Pb-Free Package YY = Year W = Work Week XX = Assembly Lot

AYW G

MSOP−8

T1x = Refer to Order Info Table A = Assembly Location Y = Year W = Work Week G = Pb-Free Package

ORDERING INFORMATION

CASE 846AB

Marking #2Marking #1

T1x

MSOP−8

1032AR

#YYWW

SCLK

SDATA

ALERT

GND

October, 2013 − Rev. 13

1 Publication Order Number:

ADM1032/D

ADM1032

ADDRESS POINTER

ON-CHIP

TEMPERATURE

SENSOR

D+

D−

ANALOG

MUX

BUSY

EXTERNAL DIODE OPEN-CIRCUIT

ADM1032

LOCAL TEMPERATURE

VALUE REGISTER

A/D

CONVERTER

RUN/STANDBY

REMOTE TEMPERATURE

VALUE REGISTER

REMOTE OFFSET

LIMIT

COMPARATOR

DIGITAL MUX

STATUS REGISTER

SMBUS INTERFACE

CONVERSION RATE

LOCAL TEMPERATURE

LOW LIMIT REGISTER

LOCAL TEMPERATURE

HIGH LIMIT REGISTER

REMOTE TEMPERATURE

LOW LIMIT REGISTER

REMOTE TEMPERATURE

HIGH LIMIT REGISTER

LOCAL THERM

EXTERNAL THERM LIMIT

CONFIGURATION

LIMIT

INTERRUPT

MASKING

ALERT

THERM

GND

SDATA SCLK

Figure 1. Functional Block Diagram

Table 1. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Unit

Positive Supply Voltage (VDD) to GND −0.3, +5.5 V

D+ −0.3 to VDD + 0.3 V

D− to GND −0.3 to +0.6 V

SCLK, SDATA, ALERT −0.3 to +5.5 V

THERM −0.3 to VDD + 0.3 V

Input Current, SDATA, THERM −1, +50 mA

Input Current, D− ±1 mA

ESD Rating, All Pins (Human Body Model) > 1000 V

Maximum Junction Temperature (TJ

Storage Temperature Range −65 to +150 °C

IR Reflow Peak Temperature 220 °C

IR Reflow Peak Temperature for Pb-Free 260 °C

Lead Temperature (Soldering 10 sec) 300 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

) 150 °C

Max

Table 2. THERMAL CHARACTERISTICS

Package Type

8-lead SOIC NB Package 121 °C

8-lead MSOP Package 142 °C

Unit

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ADM1032

Table 3. PIN ASSIGNMENT

Pin No. Mnemonic Description

1 V

2 D+ Positive Connection to Remote Temperature Sensor.

3 D− Negative Connection to Remote Temperature Sensor.

4 THERM THERM is an open-drain output that can be used to turn a fan on/off or throttle a CPU clock in the event

5 GND Supply Ground Connection.

6 ALERT Open-Drain Logic Output Used as Interrupt or SMBus Alert.

7 SDATA Logic Input/Output, SMBus Serial Data. Open-drain output. Requires pullup resistor.

SCLK Logic Input, SMBus Serial Clock. Requires pullup resistor.

Table 4. ELECTRICAL CHARACTERISTICS

Parameter Conditions Min Typ Max Unit

Power Supply

Supply Voltage, V

Average Operating Supply Current, I

Undervoltage Lockout Threshold VDD Input, Disables ADC, Rising Edge 2.35 2.55 2.8 V

Power-On Reset Threshold 1.0 − 2.4 V

Temperature-To-Digital Converter

Local Sensor Accuracy

Resolution − 1.0 − °C

Remote Diode Sensor Accuracy 60°C ≤ TD ≤ 100°C, VCC = 3 V to 3.6 V

Resolution − 0.125 − °C

Remote Sensor Source Current High Level (Note 2)

Conversion Time From stop bit to conversion complete

Open-Drain Digital Outputs (THERM, ALERT)

Output Low Voltage, V

High Level Output Leakage Current, I

Serial Bus Timing (Note 2)

Logic Input High Voltage, V SCLK, SDATA

Logic Input Low Voltage, V

Hysteresis SCLK, SDATA

SDATA Output Low Sink Current SDATA Forced to 0.6 V 6.0 − − mA

ALERT Output Low Sink Current ALERT Forced to 0.4 V 1.0 − − mA

Logic Input Current, IIH, I

Input Capacitance, SCLK, SDATA − 5.0 − pF

Positive Supply, 3.0 V to 5.5 V.

of an overtemperature condition. Requires pullup to V Note: Please refer to Power Sequencing Considerations; THERM

information.

0.0625 Conversions/Sec Rate (Note 1) − 170 215

Standby Mode − 5.5 10

0 ≤ TA ≤ 100°C, VCC = 3 V to 3.6 V − ±1 ±3 °C

0°C ≤ T

≤ 120°C

Low Level (Note 2)

Both channels: one-shot mode with averaging switched on

One-shot mode with averaging off (that is, conversion rate = 32 or 64 conversions per second)

= −6.0 mA (Note 2) − − 0.4 V

OUT

= VDD (Note 2) − 0.1 1.0

OUT

VDD = 3.0 V to 5.5 V 2.1 − − V

VDD = 3.0 V to 5.5 V − − 0.8 V

, the same supply as the ADM1032.

Pin Pullup on page 15 for more

3.0 3.30 5.5 V

−

35.7

5.7

−

230

−

− 500 − mV

−1.0 − +1.0

±1 ±3

−

142.8

22.8

°C

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ADM1032

Table 4. ELECTRICAL CHARACTERISTICS

Parameter UnitMaxTypMinConditions

Serial Bus Timing (Note 2)

Clock Frequency

SMBus Timeout (Note 3) − 25 64 ms

SCLK Clock Low Time, t

SCLK Clock High Time, t

Start Condition Setup Time, t

Start Condition Hold Time, t

Stop Condition Setup Time, t

LOW

HIGH

SU:STA

HD:STA

SU:STO

Data Valid to SCLK Rising Edge Time, t

SU:DAT

Data Hold Time, t

Bus Free Time, t

SCLK, SDATA Rise Time, t

SCLK, SDATA Fall Time, t

HD:DAT

BUF

between 10% Points 1.3 − −

LOW

between 90% Points 0.6 − −

HIGH

Time from 10% of SDATA to 90% of SCLK 600 − − ns

Time from 90% of SCLK to 10% of SDATA 600 − − ns

Time for 10% or 90% of SDATA to 10% of SCLK 100 − − ns

Between Start/Stop Condition 1.3 − −

1. See Table 10 for information on other conversion rates.

2. Guaranteed by design, not production tested.

3. The SMBus timeout is a programmable feature. By default, it is not enabled. Details on how to enable it are available in the Serial Bus Interface

section.

− − 400 kHz

600 − − ns

300 − − ns

− − 300 ns

SCLK

SDATA

BUF

LOW

HD; STA

HD; DAT

HIGH

SU; DAT

Figure 2. Serial Bus Timing Diagram

HD; STA

SU; STA

SU; STO

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ADM1032

TYPICAL PERFORMANCE CHARACTERISTICS

−4

−8

TEMPERATURE ERROR (°C)

−12

−16

0 10 100

D+ To GND

D+ To V

LEAKAGE RESISTANCE (MW)

Figure 3. Temperature Error vs. Leakage

Resistance

TEMPERATURE ERROR (°C)

−1

100K

1M 10M 100M

FREQUENCY (Hz)

VIN = 40 mV p−p

VIN = 10 mV p−p

Figure 5. Temperature Error vs. Differential Mode

Noise Frequency

1.0

0.5

TEMPERATURE ERROR (°C)

−0.5 0

20 40 60 80 100 120

TEMPERATURE (°C)

Figure 4. Temperature Error vs. Actual

Temperature Using 2N3906

TEMPERATURE ERROR (°C)

VIN = 250 mV p−p

VIN = 100 mV p−p

FREQUENCY (Hz)

Figure 6. Temperature Error vs. Power Supply

Noise Frequency

TEMPERATURE ERROR (°C)

6111621263136

CAPACITANCE (nF)

Figure 7. Temperature Error vs. Capacitance

Between D+ and D−

2.0

1.5

1.0

0.5

SUPPLY CURRENT (mA)

0.0

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VDD = 5 V

VDD = 3 V

0.01

0.1 1 10 100

CONVERSION RATE (Hz)

Figure 8. Operating Supply Current vs.

Conversion Rate

ADM1032

TYPICAL PERFORMANCE CHARACTERISTICS (Cont’d)

VIN = 100 mV p−p

TEMPERATURE ERROR (°C)

100K

VIN = 50 mV p−p

VIN = 25 mV p−p

1M 10M 100M

FREQUENCY (Hz)

Figure 9. Temperature Error vs. Common-mode

Noise Frequency

SUPPLY CURRENT (mA)

5 10 25 50 75 100 250 500 750 1000

SCLK FREQUENCY (kHz)

VDD = 5 V

VDD = 3.3 V

Figure 10. Standby Supply Current vs. Clock

Frequency

STANDBY SUPPLY CURRENT (mA)

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SUPPLY VOLTAGE (V)

Figure 11. Standby Supply Current vs. Supply Voltage

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