OMRON EESX1321 Datasheet

Photomicrosensor (Transmissive)

Be sure to read Safety Precautions on page 3.

4

5.1

4

2 mm (slot width)

Input

Input

I

L

V

Output

cc

R

L

t

0

tf

tr

90%

10%

t

Output

0

EE-SX1321

Ultra-Compact Slot / SMD Type
(Slot width: 2 mm)

• PCB surface mounting type.

• High resolution with a 0.3-mm-wide aperture.

• Dual-channel output.

Ordering Information

Photomicrosensor

Appearance

Sensing

method

Connecting

method

Sensing distance

Aperture size (H × W)

(mm)

Output type Model

Emitter

× 1.4

Transmissive
(slot type)

SMT

1.4

Detector

× 0.3 2ch

1

Ratings, Characteristics and Exterior Specifications

Absolute Maximum Ratings (Ta = 25°C)

Item Symbol Rated value Unit

Emitter

Forward current IF 25 *1 mA

Pulse forward current IFP 100 *2 mA

Reverse voltage VR 5V

Detector

Collector-Emitter
voltage

Emitter-Collector
voltage

Collector current

Collector dissipation

Operating temperature

Storage temperature

Reflow soldering
temperature

CEO 12 V

V

V

ECO 5V

C 20 mA

I

C 75 *1 mW

P

opr

-30

to +

-40

to +

85 *1 °C

90 *1 °C

T

stg

T

sol 255 *3 °C

T

*1. Refer to the temperature rating chart if the ambient temperature

exceeds 25°C.

*2. Duty ratio: 1%, Pulse width: 0.1 ms
*3. Complete soldering within 10 seconds for reflow soldering.

Exterior Specifications

Connecting method Weight (g)

SMT 0.1 PPS

Material

Case

Electrical and Optical Characteristics

Item Symbol

Emitter

Forward voltage VF --- 1.1 1.3 V IF = 5 mA

Reverse current

Peak emission
wavelength

Detector

Light current

Dark current ID --- 10 100 nA

Collector-Emitter
saturated voltage

Peak spectral
sensitivity

wavelength

Rising time tr --- 19 --- s

Falling time tf --- 26 --- s

Note: Refer to the following timing diagram for tr and tf.

Phototransistor

(Dual-channel

EE-SX1321

output)

(Ta = 25°C)

Value

MIN. TYP.

R --- --- 10 AVR = 5 V

I

P --- 940 --- nm IF = 20 mA



L1 150 --- 1500 A

I

L2 150 --- 1500 A

I

V

CE

(sat)

--- 0.1 0.4 V

P --- 900 --- nm VCE = 5 V



MAX.

Unit Condition

F = 5 mA,

I

CE = 5 V

V

V

CE = 10 V,

0 lx

I

F = 20 mA,
L = 50 A

I

V

CC = 5 V,
L = 100 ,

R
I

L = 500 A

V

CC = 5 V,
L = 100 ,

R
I

L = 500 A

1

Engineering Data (Reference value)

60

50

40

30

20

10

0

120

100

80

60

40

20

0

-40 -20 0 20 40 60 80 100

P

C

I

F

Ambient temperature Ta (ºC)

Forward current I

F

(mA)

Collector dissipation P

C

(mW)

02468101214

2,500

2,000

1,500

1,000

500

0

Ta = 25ºC

I

F

=

10 mA

I

F

=

5 mA

Collector-Emitter voltage VCE (V)

Light current I

L

(µA)

120

110

100

90

80

70

60

−40 −20 0 20 40 60 80 100
Ambient temperature Ta (°C)

I

F

=

5 mA

V

CE

=

5 V

Relative light current I

L

(%)

1,000

100

10

1

0.1

−30 −20 −10

0

10 20 30 40 50 60 708090

V

CE

= 2 V

0 l x

V

CE

= 10 V

Ambient temperature Ta (ºC)

Dark current I

D

(nA)

10,000

1,000

100

10

1

0.1 100101

tr

tf

Load resistance R

L (kΩ)

Response time tr, tf (μs)

VCC = 5 V
I

L =0.5 mA

Ta = 25°C

−0.8 −0.6 −0.4 −0.2 0 0.2 0.4 0.80.6

d

IF = 5 mA
V

CE = 5 V

(Center of
optical axis)

Ta = 25ºC

100

80

60

40

20

0

120

Distance d (mm)

Relative light current IL (%)

100

80

60

40

20

0

-1.2 -0.9 -0.6 -0.3 0 0.3 0.6 0.9 1.2

120

Relative light current I

L

(%)

Distance d (mm)

d

IF = 5 mA

Ta = 25ºC

V

CE

= 5 V

(Center of
optical axis)

EE-SX1321

Fig 1. Forward Current vs. Collector
Dissipation Temperature Rating

Fig 4. Light Current vs. Collector­Emitter Voltage Characteristics (Typical)

Fig 2. Forward Current vs. Forward
Voltage Characteristics (Typical)

60

50

40

30

20

Forward current IF (mA)

10

0

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8

Forward voltage V

Ta = 25°C

F (V)

Fig 5. Relative Light Current vs. Ambient
Temperature Characteristics (Typical)

Fig 3. Light Current vs. Forward Current
Characteristics (Typical)

3,500

3,000

2,500

(µA)

L

2,000

1,500

Light current I

1,000

500

0

0 1020304050

Forward current IF (mA)

Ta = 25°C

CE

= 5 V

V

Fig 6. Dark Current vs. Ambient
Temperature Characteristics (Typical)

Fig 7. Response Time vs. Load
Resistance Characteristics (Typical)

Fig 8. Sensing Position Characteristics
(Typical)

Fig 9. Sensing Position Characteristics
(Typical)

2

EE-SX1321

Emitter side

2.0 mm dia. or 0.5 mm recess (MAX)

Ejector pin, gate mark, or flat surface

Detector side

Cross section view B-B

(Emitter side)

Terminals are exposed
in the end face of the board

Optical axis

Marking
(upper: model, lower: lot No.)

Terminals are exposed
in the end face of
the board

Cross section view A-A

(Detector side)

1

1

0.3 ±0.15

0.8

1.4

1.4
1

0.4

0.4

1 1 1

3.1 2 2

1

2±0.2 1.55

2.8
4

B

BAA

R0.3

1

1 1 1

2.8

1 1 1

2.8

1

R0.3

(6)

(4)(3)

(2)

(1)

(5)

5.1

4

(6xC0.2)

(0.4) (0.4)

EE-SX1321

Aperture size (H x W)

Emitter Detector

1.4×1.4

1×0.3

2ch

Unless otherwise specified, the tolerances are ±0.2 mm.

(6)

(2),(3)

(5)

(1)

(4)

Internal circuit

Terminal No. Name

(1) Anode

(2)(3) Cathode

(4)(5) Emitter

(6) Collector

Safety Precautions

To ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor.

CAUTION

This product is not designed or rated for ensuring
safety of persons either directly or indirectly. Do not
use it for such purposes.

Do not use the product in atmospheres or
environments that exceed product ratings.
This product is for surface mounting. Refer to

Precautions for Correct Use

Soldering Information, Storage and Baking for

Precautions for Safe Use

Do not use the product with a voltage or current

details.
Dispose of this product as industrial waste.

that exceeds the rated range.

Applying a voltage or current that is higher than the rated range may
result in explosion or fire.

Do not miswire such as the polarity of the power
supply voltage.

Otherwise the product may be damaged or it may burn.

This product does not resist water. Do not use
the product in places where water or oil may be
sprayed onto the product.

Dimensions and Internal Circuit (Unit: mm)

Photomicrosensor

3

Tape and Reel

W1

W2

13

±0.2 dia.

2

±0.5

21

±0.8 dia.

80

±1dia.

330

±2 dia.

W1 = 13.5

±1

W2 = 17.5

±1

PHOTO MICROSENSOR

Quantity

Country of origin

Lot number

Product name

Tape Pull-out direction

K
K
A

E2
E1

C

1.5 dia.

Note: Direction of product packing is upper figure.

Reel (Unit: mm) *

EE-SX1321

Tape (Unit: mm)

Tape quantity

2,000 pcs./reel
100 pcs./pack *
* EE-SX1321-1 (100 pcs./pack) has no reel, only tape is attached.

4

Soldering Information

120 sec max.

150 to 180°C max.

1 to 4°C/s

1 to 4°C/s

1 to 4°C/sec

260°C max.

10 sec max.

230°C

255°C

Time (s)

Temperature (°C)

40 sec max.

EE-SX1321

Reflow soldering: Temperature profile

1. The reflow soldering can be implemented in two times complying

with the following diagram.
All the temperatures in the product must be within the diagram.

2. The recommended thickness of the metal mask for screen printing
is between 0.2 and 0.25 mm.

Storage

Storage conditions

To protect the product from the effects of humidity until the package
is opened, dry-box storage is recommended. If this is not possible,
store the product under the following conditions:

Temperature: 10 to 30 °C
Humidity: 60% RH max.

Manual soldering

The manual soldering should not be applied to the products,
otherwise the housing may be deformed and/or the Au plating may be
peeled off by heat.

Other notes

The use of infrared lamp causes the temperature at the resin to rise
particularly too high.
All the temperatures in the product must be within the above diagram.
Do not immerse the resin part into the solder. Even if within the above
temperature diagram, there is a possibility that the gold wire in the
products is broken in case that the deformation of PC board gives
stress to the products.
Please confirm the conditions (including material and method of flux
and cleaning) of the reflow soldering fully by actual solder reflow
machine prior to the mass production use.

Treatment after open

1. Reflow soldering must be done within 48 hours stored at the

conditions of humidity 60% RH or less and temperature 10 to
30°C.

2. If the product must be stored after it is unpacked, store it in a dry
box or reseal it in a moisture-proof package with desiccant at a
temperature of 10 to 30°C and a humidity of 60% RH or less. Even
then, mount the product within one week.

Baking

In case that it could not carry out the above treatment, it is able to
mount by the following baking treatment. However baking treatment
shall be limited only 1 time.

Recommended conditions: 60°C for 24 to 48 hours (reeled one)

100°C for 8 to 24 hours (loose one)

5

• Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product.

• Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad

systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious
influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or
equipment, and be sure to provide the system or equipment with double safety mechanisms.

OMRON Corporation

Electronic and Mechanical Components Company

Contact: www.omron.com/ecb

Cat. No. E455-E1-05

0417(0816)(O)

Note: Do not use this document to operate the Unit.