OMNIREL OMR183, OMR184, OMR186, OMR185 Datasheet

30 kRad - 100kRad Rad Tolerant LDO Positive Adjustable Voltage Regulators in Hermetic Packages
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30 kRad - 100kRad RADIATION TOLERANT 7.5A, 5A, 3A, 1.5A LOW DROPOUT POSITIVE ADJUSTABLE REGULATORS
• Operates Down to 1V Dropout, 1.5V @ Max. Current
• .015% Line Regulation
• .01% Load Regulation
• 1% Reference Voltage
• Hermetic Isolated and Non-Isolated Packages
• Radiation Tolerant up to 150 kRad (Si)
• Available Hi-Rel Screened, Class B and Class S, MIL-STD-883
DESCRIPTION
These three terminal positive adjustable voltage regulators are designed to provide 7.5A, 5A, 3A, and 1.5A with higher efficiency than conventional v oltage regulators. The devices are designed to operate to 1 Volt input to output differential and the dropout voltage is specified as a function of load current. All devices are pin compatible with older three terminal regulators. These devices are ideally suited for Space applications where small size, high reliability, and radiation tolerance is required. The high level of Radiation Tolerance of these devices makes them a desirable choice for LEO and many MEO and GEO communication satellites. Radiation testing is performed on a single wafer by w af er basis. Random die samples per wafer are selected, packaged and radiation tested to qualify each individual semiconductor wafer-by-wafer.
ABSOLUTE MAXIMUM RATINGS @ 25°C
Input V oltage . ..........................................................30 V
Operating Junction Temperature Range. . . . . . . . . . . . . . . . . . . . . - 55°C to + 150°C
Storage Temperature . ....................................... - 65°C to + 150°C
Output Current - OMR183SC, NM.. .................................. 7.5 A
OMR184SC, NM.. .................................... 5 A
OMR185ST, SR, NM. .................................. 3 A
OMR186ST, SR, NM.. ................................ 1.5 A
OMR186NH.. .......................................0.5 A
Lead Temperature (Soldering 10 seconds) ................................300°C
Surface Mount Package Soldering Temperature.............................250°C
Radiation Tolerant - Total Dose, OMR183, OMR184 ...................100k Rad (Si)
Total Dose, OMR185 . ..................................50k Rad (Si)
Total Dose, OMR186 . ..................................30k Rad (Si)
Note: OMR183 and OMR184 products are packaged in the TO-258 or SMD-1 Packages (7.5A & 5A).
OMR185 products are packaged in the TO-257, D2Pac or SMD-1 Packages (3A).
OMR186 products are packaged in the TO-257, D2Pac or SMD-1 or TO-205 Packages (1.5A & 0.5A).
OMR185 Series OMR186 Series
OMR183 Series OMR184 Series
Please see mechanical
outlines herein
OMR183- OMR186 Series
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted)
Parameter Conditions Min. Typ. Max. Units
Reference V oltage I
OUT
= 10 mA, Tj= 25°C
(V
IN
- V
OUT
) = 3 V 1.238 1.250 1.262 V
10mA ≤ I
OUT
I
FULL LOAD
1.5 V (VIN- V
OUT
) 25 V (Note 3) 1.220 1.250 1.270 V
Line Regulation I
LOAD
= 10 mA, 1.5 V ≤ (VIN- V
OUT
) 15 V, 0.015 0.2 %
T
j
= 25°C 0.035 0.2 %
15 V (V
IN
- V
OUT
) 35 V (Notes 1 & 2) 0.05 0.5 %
Load Regulation (V
IN
- V
OUT
) = 3 V
10 mA ≤ I
OUT
I
FULL LOAD
Tj= 25°C 0.5 0.8 % (Notes 1, 2, 3) .8 1.0 %
Dropout Voltage ∆V
REF
=
1%, I
OUT
= I
FULL LOAD
1.3 1.5 V
Current Limit
OMR183 (V
IN
- V
OUT
) = 5 V 8.0 A
(V
IN
- V
OUT
) = 25 V 0.4 A
OMR184 (V
IN
- V
OUT
) = 5 V 5.5 A
(V
IN
- V
OUT
) = 25 V 0.3 A
OMR185 (V
IN
- V
OUT
) = 5 V 3.2 A
(V
IN
- V
OUT
) = 25 V 0.2 A
OMR186 (V
IN
- V
OUT
) = 5 V 1.5 A
(V
IN
- V
OUT
) = 25 V 0.75 A
Minimum Load Current (V
IN
- V
OUT
) = 25 V 5 10 mA
Thermal Regulation T
A
= 25°C, 30 ms pulse OMR183 Guaranteed by design 0.002 0.01 %/W OMR184 0.003 0.15 %/W OMR185 0.004 0.02 %/W OMR186 0.010 0.05 %/W
Ripple Rejection f = 120 Hz
C
ADJ
= 25 µF Tantalum
I
OUT
- I
FULL LOAD (VIN
- V
OUT
) = 3 V 60 75 dB
Adjust Pin Current T
J
= 25°C 55 µA
Adjust Pin Current Change 10mA ≤ I
OUT
I
FULL LOAD
1.5 V (VIN- V
OUT
) 25 V 0.2 5 µA
Temperature Stability -55°C ≤ T
J
+150°C 0.5 %
Long T erm Stability T
A
= 125°C, 1000 Hrs. 0.3 1 %
Thermal Resistance Junction-to-Case
TO-257, D
2
Pac 4.2 °C/W TO-258 2.75 °C/W SMD-1 3.5 °C/W TO-205 17 °C/W
Note 1: Load and line regulation are measured at a constant junction temperature by low duty cycle pulse testing. Note 2: Line and load regulation are guaranteed up to the maximum power dissipation (OMR183/60W, OMR184/45W, OMR185/30W,
OMR186/15W). Power dissipation is determined by the input/output differential and the output current. Guaranteed maximum
power dissipation will not be available over the full input/output voltage range.
Note 3: I
FULL LOAD
curve is defined as the minimum value of current limit as a function of input to output voltage. Note that power
dissipation is only achievable over a limited range of input to output voltage.
Note 4: Dropout voltage is specified over the full output current range of the device. Note 5: Refer to curves for typical characteristics versus total dose radiation levels.
Radiation Testing is performed on a single wafer by wafer basis.
Each wafer is identified and a random sample of 5 die per wafer is selected.
The die are then individually assembled in a hermetic package, data logged, electrically tested, hi-rel screened and then submitted to radiation testing.
The packaged die are submitted to Steady State Total Dose radiation per Method 1019, Condition A, at a dose rate of 50 RAD/sec biased at maximum supply voltage.
Final electrical test is performed within two hours of both Total Dose Radiation level from a Cobalt 60 source and 168 hr, 100°C annealing process. Read and record data including two non-radiated control samples.
The wafer is then qualified only if samples from wafers meet full electrical specifications after 150% of total dose rating as specified in each product data sheet.
Omnirel’s controlling specifications are as follows: For Voltage Regulators the controlling specification is MIL-PRF- 38534/MIL-STD-883. For Rectifiers/Schottky the controlling specification is MIL-PRF-19500/MIL-STD-750.
OMR183- OMR186 Series
OMNIREL’S RADIATION TEST PROCEDURE
Standard Class Level Screening
Per MIL-PRF-38535
Screen *Level B *Level S
Test Method Required Test Method Required
Wafer Lot Acceptance ----- ----- 5007 100% Non-destructive Bond Pull ----- ----- ----- ----­Pre-Cap Visual Inspection 2010 100% 2010 100% Temperature Cycle 1010 100% 1010 100% Constant Acceleration 2001 100% 2001 100% Visual Inspection ----- 100% ----- 100% PIND Test ----- ----- 2020 100% Serialization ----- ----- ----- 100% Pre-Burn-In Electrical Data Sheet 100% Data Sheet 100% Burn-In 1015/160 hrs. 100% 1015/240hrs. 100% Interim Electrical ----- ----- Data Sheet 100% PDA Calculations 5% Functional Lot 5% Functional Lot Final Electrical Data Sheet 100% Data Sheet 100% Fine & Gross Seal 1014 100% 1014 100% Radiographic ----- ----- 2012/Two Vie ws 100% Conformance Inspection** GR A 100% GR A 100% Final Visual Inspection 2009 Sample 2009 Sample
*Note: For “B” Level Screening add “M” to par t number, for “S” Level Screening add “S” to par t number. See Part Number Designator. **Note: Additional conformance inspection testing i.e. Group B, C, & D optional.
AVAILABLE PRODUCT SCREENING
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