Omega Products OSXL-A35SC User Manual

Bench Top Thermal Imaging
Camera Kit

Real-Time Thermal Imaging and Analysis

OSXL-ASC Series

®

Powered

By

U Designed Specifically

for Thermal Benchtop
Testing Applications

U Compact, Rugged,

and Lightweight

U Plug-and-Play

Compatibility

U Fast Data Transfer
U Includes Everything

Needed for Quick “Out
of Box” Deployment

U Compliant with Any

Software that Supports
GenICamTM, Including
National Instruments
IMAQ Vision, Stemmers

U Common Vision Blox,

and COGNEX Vision Pro

U GigE VisionTM Standard

Compatibility

U GenICamTM Protocol

Support

U PoE (Power Over

Ethernet)

U GPIO (General Purpose

Input/Output)

U Wide Temperature

Range

U High Sensitivity <50 mK

Thermal imaging cameras can be
used for a wide variety of R&D
applications. Until today using
a thermal imaging camera was
often the privilege for large R&D
departments. With the extremely
affordable OSXL-A35SC/
OSXL-A15SC and OSXL-A5SC
thermal imaging systems are
now bringing the advantages of
thermal imaging to the test bench
of every R&D engineer.

OSXL-A35SC shown
smaller than actual size.

The OSXL-A35SC/OSXL-A15SC
and OSXL-A5SC models are not
only extremely affordable, they
contain both the hardware and
software for analyzing and
verifying your R&D projects.
You will be able to visualize
and measure temperatures in
a non-contact mode.

The OSXL-A35SC produces crisp
thermal images of 320 x 256
pixels. Users that do not need
this high image quality for their
application can choose the
OSXL-A15SC which produces
thermal images of 160 x 128
pixels or the OSXL-A5SC
which produces thermal images
of 80 x 64 pixels.

The OSXL-A35SC, OSXL-A15SC,
and OSXL-A5SC are affordable
infrared camera kits designed
speci fically for thermal benchtop
testing applications. The compact
packaging makes the OSXL-A5SC
a perfect fit for the benchtop and
allows for deployment in locations
where size constraints are critical.
They are available in a variety of
pixel resolutions and can meet the
spatial resolution requirements of
most applications.

J-1

Rear view.

Note: Not for Export – USA only

Eliminate the guesswork, see heat
patterns with the thermal imagery
and extract temperature values
from live or recorded imagery.
This instrument has uncooled
micro bolometer detector that is
maintenance-free and provides
excellent long wave imaging
performance. The pixel resolution
and optics are available in 80 x
64, 160 x 128, 320 x 256 pixel
formats to achieve numerous
fields of view. Versatile, compact,
rugged, and lightweight with
straightforward mounting that
permits quick installation and easy
movement for new application
requirements. Plug-and-play
compatibility, is an ideal system
integration solution through GigE
Vision and GenICam protocols,
these cameras can be fully
con figured from a PC, allowing

J

camera control and image capture
in real time. Fast data transfer and
RJ45 GB Ethernet connection
supply 14-bit images at frame
rates as high as 60 Hz. Image
and data acquisition can record
thermal snapshots and movies
with OSXL-ASC tools + recording
and analysis software.

®

GigE Vision

is a new camera
interface standard developed
using the Gigabit Ethernet
communication protocol. GigE
Vision is the first standard video
interface to allow for fast image
transfer using low cost standard
cables even over long distances.
With GigE Vision, hardware and
software from different vendors
can inter operate seamlessly over
GigE connections.

TM

The goal of GenICam

is to
provide a generic programming
interface for all types of cameras.
Regardless of interface technology
(GigE Vision, Camera Link®,
1394 DCAM, etc.) or features
implemented, the Application
Programming Interface (API)
will always be the same.
The GenICam protocol also
makes it possible to use third
party software with the
camera. GenICam makes the
OSXL-A35SC plug-and-play when
used with software packages such
as IMAQ Vision and Halcon.

Specifications

IR Resolution:
OSXL-A5SC: 320 x 256 pixels
OSXL-A15SC: 160 x 128 pixels
OSXL-A35SC: 80 x 64 pixels

FOV (Field of View)/Focal Length:
OSXL-A5SC/OSXL-A15SC:
48° (H) x 39° (V) with 9 mm lens
OSXL-A35SC: 44° (H) x 36° (V)

with 5 mm lens

Benchtop computer board thermal analysis using GenICam software.

Ethernet: Control and image

Spatial Resolution (IFOV):
OSXL-A5SC: 2.78 mrad for
9 mm lens
OSXL-A15SC: 5.56 mrad
for 9 mm lens
OSXL-A35SC: 0.0 mrad

for 5 mm lens

Detector Pitch:
OSXL-A5SC: 25 µm

OSXL-A15SC/OSXL-A35SC: 50 µm

Thermal Sensitivity/NETD:

<0.05°C @ 30°C (86°F)/50 mK

Minimum Focus Distance: Fixed
F-Number: 1.25
Image Frequency: 60 Hz
Focus: Fixed
Focal Plane Array (FPA)/

Spectral Range: Uncooled VOX

micro bolometer/7.5 to 13 µm
Detector Time Constant:

Typical 12 ms
Object Temperature Range:

-40 to 160°C (-40 to 320°F)/

-40 to 550°C (-40 to 1022°F)
Accuracy: ±5ºC or ±5% of reading

Type: Gigabit Ethernet
Standard: IEEE 802.3
Connector Type: RJ45
Communication: GigE Vision
version 1.2; Client API GenICam
compliant
Image Streaming: 14-bit signal
linear/DDE, GigE Vision and
GenICam compatible
Power: Power over Ethernet, PoE
IEEE 802.3af class 0 power
Protocols: TCP, UDP, ICMP, IGMP,
DHCP, GigEVision

Digital Input/Output:
Input: General purpose; 1× opto-

isolated, “0” < 2, “1” = 2 to 40 Vdc
Output: General purpose output
to external device (programmatically
set); 1× opto-isolated, 2 to 40 Vdc,
maximum 185 mA

Digital I/O:
Isolation Voltage: 500 VRMS

Supply Voltage: 2 to 40 Vdc,
maximum 200 mA
Connector Type: 12-pole M12
connector (shared with digital
synchronization and external power)

Computer chip IR analysis.

J-2