Omega Products OB-700 User Manual

OMEGABOND® High Temperature Chemical Set Cements
OMEGABOND
HIGH TEMP
CC High Temperature Cement Binder
U Heat Conductive U Thermal Shock
Resistant
U Insulate Electricity U Resists Oils,
Solvents, Most Acids
U Adhere To
Practically All Clean Surfaces**
Chemical set cements set or cure by an internal chemical action which does not require exposure to air. Chemical set cements can be used in thick applications (applied in thicknesses greater than 1⁄4")*.
Selection Criteria for Cements
1. Type of Application—
Potting, sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement can be used.
2. Thermal Considerations— What is the maximum temperature that the cement must withstand? What degree of thermal conductivity is needed? What degree of thermal expansion is allowed? These properties are then matched to the appropriate cement.
3. Solvent—10% Sodium Hydroxide. However it’s difficult to remove cured cement.
4. Substrate—What materials will the cement be in contact with?
5. Application Consideration— Pot life, set time, method of dispensing, batch size, cure procedure.
CC High
Temperature
Cement Filler
6. Miscellaneous Considerations—Porosity,
moisture absorption, electrical resistance, volume stability, clearances/tolerances.
To Order
Model No. Description OB-600 OMEGABOND® 600 powder, 8 fluid oz
(1 part cement; just mix with water) OB-700 OMEGABOND® 700 powder, 8 fluid oz
(1 part cement; just mix with water) CC HIGH TEMP CC high temperature cement kit, contains
2.25 oz powder and 0.75 oz liquid by weight
CC FILLER CC high temperature cement powder, 8 oz by weight (2 part cement; mix liquid with CC binder)
CC BINDER CC high temperature cement liquid, 8 oz by weight (2 part cement; mix liquid with CC filler)
OB - K IT-2 Chemical set cement kit, ideal for research purposes; includes 2 fluid oz each of OB-600 and OB-700 and also one CC high temp kit
OB-TL OMEGABOND® thinning liquid, 8 fluid oz used to dampen porous substrates before application of mixed OB-300 or OB-400 cements
See next page for footnotes.
*, **
Ordering Example: OB-KIT-2, chemical set cement kit containing OB-600, OB-700, and
1 CC high temp kit.
Visit omega.com/ob_bond_chem_set for Pricing and Details
OMEGABOND
®
700
OMEGABOND
®
600
F-25
High Temperature Chemical Set Cements
APPLICATIONS
OMEGABOND® 600 OMEGABOND® 700 CC High Temperature Cement
U Potting U Coating U Cementing on and Insulating U Bonding U Assembling Thermocouples for Surface U Insulating U Sealing Temperature Measurement U Embedding U Coating
Physical Properties
Cement OMEGABOND 600 OMEGABOND 700 CC High Temperature
Type of cement (1 or 2 Part) 1 part 1 part 2 part
Coefficient of thermal expansion, in/in/°F 2.6 x 10
Color Off white White Tan
-6
12.4 x 10-6 4.6 x 10
-6
Compressive strength, psi 4500 to 5500 3500 3900
3
Density, lb/ft
160 141 Dielectric constant 3.0 to 4.0 5.0 to 7.0 Dielectric strength at 20°C (70°F), V/mil 76.0 to 101.0 25.0 to 51.0 Dielectric strength at 400°C (750°F), V/mil 25.0 to 38.0 12.5 to 25.0 Dielectric strength at 795°C (1475°F), V/mil 12.5 to 25.0 1.3 Maximum service temperature, °C (°F) 1426 (2600) 871 (1600) 843 (1550) Modulus of rupture, psi 450 Tensile strength, psi 250 425
10
Volume resistivity at 20°C (70°F), Ω-cm 10
Volume resistivity at 400°C (750°F), Ω-cm 109-1010
-1011
Volume resistivity at 795°C (1475°F), Ω-cm 108-109 Flexural strength, psi Absorption, % Shrinkage, % Thermal conductivity, Btu-in/ft
2
-hr-°F 10 to 12 4.5 to 5.9 8
435
9
107-10
6
104-10
3
102-10
10 - 12
0.5
Mix ratio Mix 100 parts powder with Mix 75 to 80% powder with Mix 3 parts powder to 1 part
13 parts water by weight 20 to 25% water by weight liquid by weight, or 2 parts filler to 1 part liquid by volume
Curing schedule OMEGABOND 600
®
OMEGABOND 700® CC high temperature cures at room cures at room temperature cement hardens with an temperature by internal with a chemical set action in internal chemical-setting chemical action in 18 to 24-hr, cure time can be action with an initial set in 18 to 24-hr, cure time accelerated by low approximately 30 min; can be accelerated by temperature oven drying the final set is reached in low temperature oven at 82°C (180°F); if the 18 to 24-hr when cured drying at 82°C (180°F); if cement is to be exposed at room temperature; the cement is to be exposed to elevated temperatures, if it is desired to accelerate to elevated temperatures, cure for 18 to 24-hr at the curing time, set the cure for 18 to 24-hr at ambient temperature, drying oven to 65°C (150°F) ambient temperature, then oven dry for 4-hr and the cement will cure in then oven dry for 4-hr at 82°C (180°F) and for 4-hr; if the drying oven at 82°C (180°F) and for an additional 4-hr at is set to 105°C (220°F), the an additional 4-hr at 105°C (220°F); this helps cement will cure in 3 hours 105°C (220°F); this helps to prevent spilling to prevent spilling
F
Distinguishing characteristics High dielectric strength, Used on metals or other Used to cement on and and applications used to pot nickel materials which have a insulate thermocouples for chromium resistance high coefficient of thermal surface temperature
heating wire; won’t expansion; excellent measurement stick to smooth quartz bonding characteristics
These physical properties were determined under laboratory conditions using applicable ASTM procedures. Actual field data may vary. Do not use physical properties data for specifications.
Air set cements are also available, see OMEGABOND® 300, OMEGABOND® 400 and OMEGABOND® 500. These cements set or cure through
*
loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air set cements are used mainly in the thin film applications (less than 1⁄4" thickness.)
Porous substrates may require dampening with thinning liquid before application of mixed cement. For OMEGABOND® 600 and
**
OMEGABOND® 700 (1 part cement), order OMEGABOND® thinning liquid (8 fluid oz), OB -TL. For CC high temperature cement, use CC high temperature cement liquid binder to dampen porous substrates.
F-26
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