OKI MSM51V16800BSL-60JS, MSM51V16800B-70TS-K, MSM51V16800B-60TS-K, MSM51V16800B-50JS, MSM51V16800BSL-70TS-K Datasheet

353

¡ Semiconductor MSM51V16800B/BSL

DESCRIPTION

The MSM51V16800B/BSL is a 2,097,152-word ¥ 8-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM51V16800B/BSL achieves high integration, high-speed operation, and low-power consumption because Oki manufactures the device in a quadruple-layer polysilicon/ double-layer metal CMOS process. The MSM51V16800B/BSL is available in a 28-pin plastic SOJ or 28-pin plastic TSOP. The MSM51V16800BSL (the self-refresh version) is specially designed for lower-power applications.

FEATURES

• 2,097,152-word ¥ 8-bit configuration

• Single 3.3 V power supply, ±0.3 V tolerance

• Input : LVTTL compatible, low input capacitance

• Output : LVTTL compatible, 3-state

• Refresh : 4096 cycles/64 ms, 4096 cycles/128 ms (SL version)

• Fast page mode, read modify write capability

• CAS before RAS refresh, hidden refresh, RAS-only refresh capability

• CAS before RAS self-refresh capability (SL version)

• Multi-bit test mode capability

• Package options: 28-pin 400 mil plastic SOJ (SOJ28-P-400-1.27)

(Product : MSM51V16800B/BSL-xxJS)

28-pin 400 mil plastic TSOP (TSOPII28-P-400-1.27-K)

(Product : MSM51V16800B/BSL-xxTS-K) xx indicates speed rank.

PRODUCT FAMILY

¡ Semiconductor

MSM51V16800B/BSL

2,097,152-Word ¥ 8-Bit DYNAMIC RAM : FAST PAGE MODE TYPE

MSM51V16800B/BSL-70

70 ns

130 ns

90 ns

288 mW

396 mW

Family

Access Time (Max.)

Cycle Time

(Min.)

Standby (Max.)

Power Dissipation

MSM51V16800B/BSL-50

t

RAC

50 ns

35 ns

t

AA

25 ns

20 ns

t

CAC

13 ns

20 ns

t

OEA

13 ns

MSM51V16800B/BSL-60

60 ns

110 ns 324 mW

30 ns 15 ns 15 ns

Operating (Max.)

1.8 mW/

0.72 mW (SL version)

E2G0074-17-41

354

MSM51V16800B/BSL ¡ Semiconductor

PIN CONFIGURATION (TOP VIEW)

3

4

5

9

10

11

12

13

DQ2

DQ3

DQ4

A10R

A0

A1

A2

A3

26

25

24

20

19

18

17

16

DQ7

DQ6

DQ5

A8

A7

A6

A5

A4

2

DQ1 27 DQ8

1

V

CC

28 V

SS

28-Pin Plastic SOJ

3

4

5

9

10

11

12

13

26

25

24

20

19

18

17

16

2

27

1

28

28-Pin Plastic TSOP

(K Type)

6WE 23 CAS 23

8A11R 21 A9R 21

6

8

7RAS 22 OE 227

14V

CC

15 V

SS

14 15

DQ2

DQ3

DQ4

A10R

A0

A1

A2

A3

DQ1

V

CC

WE

A11R

RAS

V

CC

DQ7

DQ6

DQ5

A8

A7

A6

A5

A4

DQ8

V

SS

CAS

A9R

OE

V

SS

Pin Name Function

A0 - A8,

Address Input

RAS Row Address Strobe CAS Column Address Strobe

DQ1 - DQ8 Data Input/Data Output

OE Output Enable

WE Write Enable

V

CC

Power Supply (3.3 V)

V

SS

Ground (0 V)

A9R - A11R

Note : The same power supply voltage must be provided to every VCC pin, and the same GND

voltage level must be provided to every VSS pin.

355

¡ Semiconductor MSM51V16800B/BSL

BLOCK DIAGRAM

Timing

Generator

Refresh

Control Clock

Column Address

Buffers

Internal Address Counter

Row

Address

Buffers

Row Decoders

Word

Drivers

Memory

Cells

Sense Amplifiers

Column Decoders

I/O

Controller

I/O

Selector

Output Buffers

Input

Buffers

On Chip

V

BB

Generator

V

CC

DQ1 - DQ8

CAS

WE

A0 - A8

99

8

88

12

9

OE

RAS

V

SS

3

A9R - A11R

356

MSM51V16800B/BSL ¡ Semiconductor

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

Recommended Operating Conditions

Capacitance

*: Ta = 25°C

Voltage on Any Pin Relative to V

SS

Short Circuit Output Current

Power Dissipation

Operating Temperature

Storage Temperature

V

T

Symbol

I

OS

P

D

*

T

opr

T

stg

–0.5 to 4.6

50

1

0 to 70

–55 to 150

Rating

mA

W

°C

Parameter

V

Unit

Power Supply Voltage

Input High Voltage

Input Low Voltage

V

CC

Symbol

V

SS

V

IH

V

IL

3.3

0

—

Typ.Parameter

3.0

0

2.0

–0.3

Min.

3.6

0

V

CC

+ 0.3

0.8

Max.

(Ta = 0°C to 70°C)

V

Unit

V

Input Capacitance (A0 - A8, A9R - A11R)

Input Capacitance (RAS, CAS, WE, OE)

Output Capacitance (DQ1 - DQ8)

C

IN1

Symbol

C

IN2

C

I/O

5

7

Max.

pF

Unit

pF

Parameter

(V

CC

= 3.3 V ±0.3 V, Ta = 25°C, f = 1 MHz)

—

Typ.

357

¡ Semiconductor MSM51V16800B/BSL

DC Characteristics

Parameter

Symbol

Condition

MSM51V16800

B/BSL-50

MSM51V16800

B/BSL-60

MSM51V16800

B/BSL-70

(VCC = 3.3 V ±0.3 V, Ta = 0°C to 70°C)

IOH = –2.0 mAOutput High Voltage

IOL = 2.0 mAOutput Low Voltage

0 V £ VI £ VCC + 0.3 V;

All other pins notInput Leakage Current

under test = 0 V

DQ disable

Output Leakage Current

0 V £ VO £ V

CC

RAS, CAS cycling,

Average Power

t

RC

= Min.

Supply Current

(Operating)

RAS, CAS = V

IH

Power Supply

RAS, CAS

Current (Standby)

RAS cycling,Average Power CAS = V

IH

,Supply Current

tRC = Min.(RAS-only Refresh) RAS = V

IH

,

Power Supply

CAS = V

IL

,

Current (Standby)

DQ = enable

Average Power

CAS before RAS

Supply Current (CAS before RAS Refresh)

Average Power

RAS £ 0.2 V,Supply Current CAS £ 0.2 V(CAS before RAS

V

OH

V

OL

I

LI

I

LO

I

CC1

I

CC2

I

CC3

I

CC5

I

CC6

I

CCS

≥ VCC –0.2 V

Min. Max. Min. Max. Min. Max.

Unit Note

RAS cycling,

2.4

0

–10

—

V

CC

0.4

10

110

2

0.5

110

300

5

2.4

0

–10

—

V

CC

0.4

10

90

2

0.5

90

300

5

2.4

0

–10

—

V

CC

0.4

10

80

2

0.5

80

300

5

— 200 — 200 — 200

V

mA

1, 2

1, 5

1

mA 1, 5

tRC = 31.3 ms,Average Power CAS before RAS,Supply Current

t

RAS

£ 1 ms(Battery Backup)

I

CC10

— 400 — 400 — 400 mA

1, 4,

RAS = VIL,Average Power CAS cycling,Supply Current

t

PC

= Min.(Fast Page Mode)

I

CC7

— 90 — 80 — 70 mA 1, 3

5

Self-Refresh)

Notes : 1. ICC Max. is specified as ICC for output open condition.

2. The address can be changed once or less while RAS = VIL.

3. The address can be changed once or less while CAS = VIH.

4. VCC – 0.2 V £ VIH £ VCC + 0.3 V, –0.3 V £ VIL £ 0.2 V.

5. SL version.

358

MSM51V16800B/BSL ¡ Semiconductor

AC Characteristics (1/2)

Parameter

MSM51V16800

B/BSL-60

MSM51V16800

B/BSL-70

MSM51V16800

B/BSL-50

(VCC = 3.3 V ±0.3 V, Ta = 0°C to 70°C) Note 1, 2, 3, 11, 12

Random Read or Write Cycle Time Read Modify Write Cycle Time Fast Page Mode Cycle Time Fast Page Mode Read Modify Write

Cycle Time Access Time from RAS Access Time from CAS

Access Time from Column Address Access Time from CAS Precharge

CAS to Data Output Buffer Turn-off Delay Time

Transition Time

RAS Precharge Time RAS Pulse Width RAS Pulse Width (Fast Page Mode) RAS Hold Time

CAS Pulse Width CAS Hold Time

RAS to CAS Delay Time RAS to Column Address Delay Time

CAS to RAS Precharge Time

Row Address Set-up Time

Row Address Hold Time

Column Address Set-up Time

Column Address Hold Time

Column Address to RAS Lead Time

Read Command Set-up Time

Read Command Hold Time Read Command Hold Time referenced to RAS

Access Time from OE

OE to Data Output Buffer Turn-off Delay Time

Refresh Period

RAS Hold Time referenced to OE

Unit

Min. Max. Min. Max.

RAS Hold Time from CAS Precharge

Symbol

t

RC

t

RWC

t

PC

t

PRWC

t

RAC

t

CAC

t

AA

t

CPA

t

OFF

t

T

t

RP

t

RAS

t

RASP

t

RSH

t

CAS

t

CSH

t

RCD

t

RAD

t

CRP

t

ASR

t

RAH

t

ASC

t

CAH

t

RAL

t

RCS

t

RCH

t

RRH

t

OEA

t

OEZ

t

REF

t

ROH

t

RHCP

Note

Min. Max.

Output Low Impedance Time from CAS t

CLZ

CAS Precharge Time (Fast Page Mode) t

CP

4, 5, 6

4, 5

4, 6

4

7

5 6

8

4

7

4

3

13

ns ns ns

ns

ns ns

ns

ns ns

ns

ns ns

ns

ms

ns

90

131

35

76

—

— —

0

3

30

50

13

7

13

50

17 12

5

0

7

0

7

25

0

—

0

—

13

30

— — —

—

50

13

25 30

—

13

50

—

10,000

100,000

—

10,000

—

37 25

—

— —

—

13

64

—

130 185

45

100

—

— —

0

3

50

70

20

10

20

70

20 15

5

0

10

0

15 35

0

—

0

—

20

40

— — —

—

70

20

35 40

—

20

50

—

10,000

100,000

—

10,000

—

50 35

—

— —

—

20

64

—

110 155

40

85

—

— —

0

3

40

60

15

10

15

60

20 15

5

0

10

0

10 30

0

—

0

—

15

35

— — —

—

60

15

30 35

—

15

50

—

10,000

100,000

—

10,000

—

45 30

—

— —

—

15

64

—

Refresh Period (SL version)

t

REF

ms— 128 — 128— 128

359

¡ Semiconductor MSM51V16800B/BSL

AC Characteristics (2/2)

MSM51V16800

B/BSL-60

MSM51V16800

B/BSL-70

MSM51V16800

B/BSL-50

Write Command Pulse Width

Write Command to CAS Lead Time

Write Command to RAS Lead Time

Data-in Set-up Time

CAS to WE Delay Time

RAS to WE Delay Time

Column Address to WE Delay Time

RAS to CAS Hold Time (CAS before RAS)

CAS Active Delay Time from RAS Precharge

Data-in Hold Time

Write Command Hold Time

OE Command Hold Time

OE to Data-in Delay Time

(VCC = 3.3 V ±0.3 V, Ta = 0°C to 70°C) Note 1, 2, 3, 11, 12

Write Command Set-up Time

t

WP

t

CWL

t

RWL

t

DS

t

CWD

t

RWD

t

AWD

t

CHR

t

RPC

t

DH

t

WCH

t

OEH

t

OED

t

WCS

Min. Max.

Parameter

Symbol

Unit Note

Min. Max. Min. Max.

RAS to CAS Set-up Time (CAS before RAS)t

CSR

WE to RAS Precharge Time (CAS before RAS)

t

WRP

WE Hold Time from RAS (CAS before RAS)t

WRH

RAS to WE Set-up Time (Test Mode) t

WTS

CAS Precharge WE Delay Time t

CPWD

RAS to WE Hold Time (Test Mode) t

WTH

10

9

10

9

10 10 10 10

10

15

0

40

85

55

10 10

5

10

15

0

60

— — — —

—

— —

—

ns ns ns ns

ns

ns ns

ns

10 10 10 10

7

13

0

36

73

48

10 10

5

7

13

0

53

— — — —

—

— —

—

10 10 10 10

10

20

0

50

100

65

10 10

5

15

20

0

70

—

— —

—

— — — —

—

RAS Pulse Width

t

RASS

13100 — ms100 — 100 —

(CAS before RAS Self-Refresh) RAS Precharge Time

t

RPS

13110 — ns90 — 130 —

(CAS before RAS Self-Refresh) CAS Hold Time

t

CHS

13–50 — ns–50 — –50 —

(CAS before RAS Self-Refresh)

360

MSM51V16800B/BSL ¡ Semiconductor

Notes: 1. A start-up delay of 200 µs is required after power-up, followed by a minimum of eight

initialization cycles (RAS-only refresh or CAS before RAS refresh) before proper device operation is achieved.

2. The AC characteristics assume tT = 5 ns.

3. VIH (Min.) and VIL (Max.) are reference levels for measuring input timing signals. Transition times (tT) are measured between VIH and VIL.

4. This parameter is measured with a load circuit equivalent to 1 TTL load and 100 pF. The output timing reference levels are VOH = 2.0 V and VOL = 0.8 V.

5. Operation within the t

RCD

(Max.) limit ensures that t

RAC

(Max.) can be met.

t

RCD

(Max.) is specified as a reference point only. If t

RCD

is greater than the specified

t

RCD

(Max.) limit, then the access time is controlled by t

CAC

.

6. Operation within the t

RAD

(Max.) limit ensures that t

RAC

(Max.) can be met.

t

RAD

(Max.) is specified as a reference point only. If t

RAD

is greater than the specified

t

RAD

(Max.) limit, then the access time is controlled by tAA.

7. t

OFF

(Max.) and t

OEZ

(Max.) define the time at which the output achieves the open

circuit condition and are not referenced to output voltage levels.

8. t

RCH

or t

RRH

must be satisfied for a read cycle.

9. t

WCS

, t

CWD

, t

RWD

, t

AWD

and t

CPWD

are not restrictive operating parameters. They are

included in the data sheet as electrical characteristics only. If t

WCS

≥ t

WCS

(Min.), then the cycle is an early write cycle and the data out will remain open circuit (high impedance) throughout the entire cycle. If t

CWD

≥ t

CWD

(Min.) , t

RWD

≥ t

RWD

(Min.),

t

AWD

≥ t

AWD

(Min.) and t

CPWD

≥ t

CPWD

(Min.), then the cycle is a read modify write cycle and data out will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, then the condition of the data out (at access time) is indeterminate.

10. These parameters are referenced to the CAS leading edge in an early write cycle, and to the WE leading edge in an OE control write cycle, or a read modify write cycle.

11. The test mode is initiated by performing a WE and CAS before RAS refresh cycle. This mode is latched and remains in effect until the exit cycle is generated. The test mode specified in this data sheet is a 2-bit parallel test function. CA8 is not used. In a read cycle, if all internal bits are equal, the DQ pin will indicate a high level. If any internal bits are not equal, the DQ pin will indicate a low level. The test mode is cleared and the memory device returned to its normal operating state by performing a RAS-only refresh cycle or a CAS before RAS refresh cycle.

12. In a test mode read cycle, the value of access time parameters is delayed for 5 ns for the specified value. These parameters should be specified in test mode cycle by adding the above value to the specified value in this data sheet.

13. Only SL version.

See ADDENDUM N for AC Timing Waveforms

OKI MSM51V16800BSL-60JS, MSM51V16800B-70TS-K, MSM51V16800B-60TS-K, MSM51V16800B-50JS, MSM51V16800BSL-70TS-K Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual