xxA: With dummy bumps on both sides of the chip
xxB: Without dummy bumps on both sides of the chip
*xx indicates a code number.
*01A and 01B are general code numbers.
1/60
1
W
S
T
A
Semiconductor
BLOCK DIAGRAM
1
COM
Common
signal
PEDL9041-03
ML9041-xxA/xxB
17
1
SEG
100
SEG
COM
Segment Signal - driver
driver
100-bit latch
shift
17-bit
register
100-bit shift register
Parallel-
serial
converter
5
blink
Cursor
controller
generator
Character
(ID)
decoder
Instruction
8
7
(IR)
register
Instruction
8
Timing
generator
5
RAM
8
(CG RAM)
ROM
generator
Character
(CG ROM)
RAM
8
Display data
8
(ADC)
counter
Address
5
RAM
Arbitrator
(DD RAM)
decoder
instruction
Expansion
(AB RAM)
(ED)
8
circuit
Voltage
Data
(DR)
register
(BF)
Busy flag
instruction
Expansion
register (ER)
8
8
I/O
buffer
4
Test
circuit
LCD bias
voltage
4
multiplier
5
circuit
dividing
SSR
CSR
BEBV
IN
V
V
CC
C
2
1
DD
V
GND
R
OSC
OSC
OSC
0
RS1RS
R/
3
7
1
E
C
/S
P
SH
SI
SO
to DB
0
DB
to DB
4
DB
T
T2T
3V1V2
3
5
5IN
V4V
V3BV
V
2/60
1
A
A
A
A
A
A
A
A
A
T
A
A
A
A
A
A
A
Semiconductor
I/O CIRCUITS
V
DD
P
PEDL9041-03
ML9041-xxA/xxB
V
DD
P
V
DD
V
DD
P
N
Applied to pins SSR, CSR,
P
/S, and BEB
pplied to pin E
pplied to pin
SH
V
DD
P
t serial I/F
t parallel I/F
t serial I/F
t parallel I/F
V
DD
P
N
N
pplied to pins T1, T2, and T
: 0
: 1
: 1 (CS = 1)
: 0 (CS = 0)
: 1
V
DD
P
3
pplied to pin SI
pplied to pin
N
pplied to pins R/W, RS1, and RS
t serial I/F
: 1 (CS = 0)
: 0 (CS = 1)
t parallel I/F
t serial I/F
t parallel I/F
: 0
: 0
: 1
CS
0
N
Output Enable signal
pplied to pins DB0 to DB
V
V
DD
DD
7
PP
N
Output Enable signal
pplied to pin SO
3/60
1
Semiconductor
PIN DESCRIPTIONS
SymbolDescription
W
R/
PEDL9041-03
ML9041-xxA/xxB
The input pin with a pu ll-up resi stor to s elect Read (“H”) or Write (“L”) in the Parallel I/F
Mode.
This pin should be open in the Serial l/F Mode.
The input pins with a pull-up resistor to select a register in the Parallel l/F Mode.
RS0, RS
1
E
DB0 to DB
DB4 to DB
OSC
1
OSC
2
OSC
R
COM1 to COM
SEG1 to SEG
RS
1
RS
0
Name of register
HHData register
HLInstruction register
LLExpansion Instruction register
This pin should be open in the Serial I/F Mode.
The input pin for data input/output between the CPU and the ML9041 and for
activating instructions in the Parallel l/F Mode.
This pin should be open in the Serial l/F Mode.
The input/output pins to transfer data of lower-order 4 bits between the CPU and the
ML9041 in the Parallel l/F Mode. The pins are not used for the 4-bit interface and
3
serial interface.
Each pin is equipped with a pull-up r esistor, so thi s pin should be open when no t used.
The input/output pins to transfer data of upper 4 bits between the CPU and the
ML9041 in the Parallel l/F Mode. The pins are not used for the serial interface.
7
Each pin is equipped w ith a pull-u p resistor, so thi s pin shoul d be open in the Ser ial I/F
Mode when not used.
The clock oscillation pins required for LCD drive signals and the operation of the
ML9041 by instructions sent from the CPU.
To input external clock, the OSC
pin should be used. The OSCR and the OSC2 pins
1
should be open.
To start oscillation w ith an ex ternal resistor, t he resistor should be connected between
the OSC
To start oscillation with an internal resistor, the OSC
short-circuited outside the ML9041. The OSC
and OSC2 pins. The OSCR pin should be open.
1
and OSCR pins should be
2
pin should be open.
1
The LCD common signal output pins.
to COM17. For
10
to COM17.
13
100
17
For 1/9 duty, non-selectable voltage waveforms are output via COM
1/12 duty, non-selectable voltage waveforms are output via COM
The LCD segment signal output pins.
4/60
1
Semiconductor
SymbolDescription
CSR
SSR
V1 , V2, V3A, V3B, V
BEB
V
V5, V
V
V
PEDL9041-03
ML9041-xxA/xxB
The input pin to select the transfer direction of the common signal output data.
At 1/n duty, data is transferred from CO M1 to COM n when “L” is applied to this pin and
transferred from COMn to COM1 when “H” is applied to this pin.
The input pin to select the transfer direction of the segment signal output data.
“L”: Data transfer from SEG
“H”: Data transfer from SEG
The pins to output bias voltages to the LCD.
For 1/4 bias : The V2 and V3B pins are shorted.
4
For 1/5 bias : The V
3A
The input pin to enable or disable the voltage multiplier circuit.
"L" disables the voltage multiplier circuit. "H" enables the voltage multiplier circuit.
The voltage multiplier circuit doubles the input voltage V
referenced to V
is output to the V
DD
only when generating a level lower than GND.
IN
The pin to input voltage to the voltage multiplier.
The pins to supply the LCD drive voltage.
The LCD drive voltage is supp lied to the V5 pin when the voltage multiplier is not used
(BEB = 0) and the internal contrast adjusting circuit is also not used. At this time, the
V
pin should be open.
5IN
The LCD drive voltage is supplie d to the V
5IN
(BEB = 0) but the internal contrast adjusting circuit is used. At this time, the V
should be open.
When the voltage multiplier is used (BEB = 1), the V
multiplied voltage is output to the V
circuit must be used. Capacitors for the voltage multiplier should be connected
between the V
C
CC
The pin to connect the positive pin of the capacitor for the voltage multiplier.
The pin to connect the negative pin of the capacitor used for the voltage multiplier.
pin and the V
DD
to SEG
1
100
to SEG
100
1
and V3B pins are shorted.
pin. The voltage multiplier circuit can be used
5IN
pin when the voltage multip lier is not used
5IN
pin). In this case, the internal contrast adjusting
5IN
pin.
5IN
and the multiplied voltage
MUL
pin should be open (the
5
pin
5
5/60
1
Semiconductor
SymbolDescription
T1, T2, T
3
V
DD
GNDThe ground level input pin.
P
/S
CS
SHT
Sl
SO
The input pins for test circuits (normally open). Each of these pins is equipped with a
pull-down resistor, so this pin should be left open.
The power supply pin.
The input pin to select the parallel or serial interface.
“L” selects the parallel interface.
“H” selects the serial interface.
The pin to enable this IC in the serial l/F mode.
“L” enables this IC.
“H” disables this IC.
This pin should be open in the parallel l/F mode.
The pin to input shift clock in the serial l/F mode.
Data inputting to the SI pin is carried out synchronizing with the rising edge of this
clock signal.
Data outputting from the SO pin is carried out synchronizing with the falling edge of
this clock signal.
This pin should be open in the parallel l/F mode.
The pin to input DATA in the serial l/F mode.
Data inputting to this pin is carried out synchronizing with the rising edge of the
signal.
This pin should be open in the parallel l/F mode.
The pin to output DATA in the serial l/F mode.
Data inputting to this pin is carried out synchronizing with the falling edge of the
signal.
This pin should be open in the parallel l/F mode.
PEDL9041-03
ML9041-xxA/xxB
SHT
SHT
6/60
1
Semiconductor
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolConditionRatingUnitApplicable pins
Supply VoltageV
LCD Driving Voltage
V1, V2, V3,
V
4
Input VoltageV
Storage TemperatureT
DD
, V
I
STG
Ta = 25°C–0.3 to +6.5VVDD–GND
Ta = 25°CVDD–7.5 to VDD+0.3VV1, V4, V5, V
5
Ta = 25°C–0.3 to VDD+0.3V
—–55 to +150°C—
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolConditionRangeUnitApplicable pins
Supply VoltageV
LCD Driving Voltage
V
(See Note)
Voltage Multipler
Operating Voltage
Operating TemperatureT
DD
DD–V5
V
MUL
op
—2.5 to 5.5VVDD–GND
—2.8 to 7.0V
BEB = 1
—–40 to +85°C—
V
DD
V
–1.40 to
–3.5
DD
PEDL9041-03
ML9041-xxA/xxB
(GND = 0 V)
, V2, V3A, V
5IN
R/W, E,
SSR, Sl, RS0, RS1, BEB, CS,
T
VV
SHT
, CSR, P/S,
to T3, DB0 to DB7, V
1
(GND = 0 V)
V
DD–V5
(V
)
5IN
DD–VIN
IN
3B
Note:This voltage should be applied across VDD and V5. The following voltages are output to the V1, V2,
V
(V3B) and V4 pins:
3A
•
1/4 bias
= {VDD – (VDD – V5)/4} ±0.15 V
V
1
V
= V3B = {VDD – (VDD – V5)/2} ±0.15 V
2
= {VDD – 3 × (VDD – V5)/4 } ±0.15 V
V
4
•
1/5 bias
V
= {VDD – (VDD – V5)/5} ±0.15 V
1
= {VDD – 2 × (VDD – V5)/5} ±0.15 V
V
2
V
= V3B = {VDD – 3 × (VDD – V5)/5} ±0.15 V
3A
V
= {VDD – 4 × (VDD – V5)/5} ±0.15 V
4
The voltages at the V
V
> V1 > V2 > V3A (V3B) > V4 > V5.
DD
(Higher
←
, V2, V3A (V3B), V4 and V5 pins should satisfy
1
→ Lower)
* Do not apply short-circuiting across output pins and across an output pin and an input/output
“H” Input Voltage 2V
“L” Input Voltage 2V
“H” Output Voltage 1V
“L” Output Voltage 1V
“H” Output Voltage 2V
“L” Output Voltage 2V
COM Voltage Drop
SEG Voltage Drop
V
V
V
V
IH1
IL1
IH2
IL2
OH1IOH
OL1IOL
OH2IOH
OL2IOL
V
CHlOCH
CMHlOCMH
CMLlOCML
V
CLlOCL
V
SHlOSH
SMHlOSMH
SMLlOSML
V
SLlOSL
—
—
= –0.1 mA0.75V
= +0.1 mA——0.2V
= –13 µA0.9V
= +13 µA——0.1V
= –4 µAV
= ±4 µAV
= ±4 µAV
V
–V5 = 5 V
DD
Note 1
= +4 µA
= –4 µAV
= ±4 µAV
= ±4 µAV
V
–V5 = 5 V
DD
Note 1
= +4 µA
0.8V
DD
–0.3—0.2V
0.8V
DD
–0.3—0.2V
DD
DD
–0.3V
DD
–0.3V1+0.3
1
–0.3V4+0.3
4
V
5
–0.3V
DD
–0.3V2+0.3
2
–0.3V3+0.3
3
V
5
Input Leakage Current| IIL |VDD = 5 V, VIN = 5 V or 0 V——1.0
VDD = 5 V, VIN = GND102561
= 5 V, VIN = VDD,
V
Input Current 1| II1 |
DD
Excluding current flowing
through the pull-up resistor
——2.0
and the output driving MOS
Input Current 2| II2 |
VDD = 5 V, VIN = V
DD
VDD = 5 V, VIN = VDD,
Excluding current flowing
1545105
——2.0
through the pull-down resistor
Supply Currentl
LCD Bias ResistorR
Oscillation Frequency
of External Resistor Rf
Oscillation Frequency
of Internal Resistor Rf
Clock Input
Frequency
Input Clock Dutyf
Input Clock Rise
Time
External Clock
Input Clock Fall Timef
VDD = 5 VNote 2——1.2mA VDD–GND
DD
LB
Rf = 180 kΩ±2%Note 3175270400kHz OSC1, OSC
f
osc1
OSC1: OpenNote 4
f
osc2
OSC
and OSCR: Short-
2
140270480kHz
circuited
OSC2, OSCR: Open
f
in
Input from OSC
duty
f
rf
ff
1
Note 5455055%
Note 6——0.2
Note 6——0.2
125480kHz
= 2.5 to 5.5 V, Ta = –40 to +85°C)
DD
—V
DD
V
DD
—V
——
——
DD
V
DD
VDB0 to DB7, SO
DD
VOSC
DD
DD
V
V5+0.3
DD
V
V5+0.3
µ
A
µ
A
µ
AT
4.0k
Ω
µ
s
µ
s
PEDL9041-03
R/W, RS
E, DB
SHT, P
, RS1,
0
to DB7,
0
/S, Sl,
CS
, SSR,
OSC
1
CSR, BEB
2
to
COM
1
COM
17
to
SEG
1
SEG
100
E, SSR, CSR,
SHT, P
BEB,
/S,
CS, Sl
R/W, RS
DB
1
V
DD
V
3A
OSC
OSC
OSC
, RS1,
0
to DB7, SO
0
, T2, T
3
, V1, V2,
, V3B, V4, V
, OSC2,
1
R
1
5
2
8/60
1
Semiconductor
PEDL9041-03
ML9041-xxA/xxB
(GND = 0 V, V
ParameterSymbolConditionMin.Typ.Max.Unit
= 5 V, 1/5 bias
Maximum and
minimum LCD
drive voltages
when internal
variable resistors
are used.
Bias Voltage for
Driving LCD by
External Input
V
MAX
V
MIN
V
V
V
LCD
DD
V
5IN
Contrast data: 1F
VDD = 5 V, 1/5 bias
LCD
V
5IN
Contrast data: 00
LCD1
VDD–V
LCD2
= 0 V,
= 0 V,
5
Note 7
4.6—VV
1/5 bias2.8—7.0VV
1/4 bias2.8—7.0
= 2.5 to 5.5 V, Ta = –40 to +85°C)
DD
Applicable
pins
DD–V5
—3.4 V
5
VDD = 3 V, VIN = 0 V
f = 270 kHz
Voltage Multiplier
Output Voltage
V
A capacitor for the voltage
5OUT
multiplier = 4.7 µF
–(VDD–VIN)
V
DD
×
2–0.1
—
VDD–(VDD–
V
) × 2+1.2 V
IN
VV
5
, V
5IN
No load
BEB = H
Voltage Multiplier
Input Voltage
V
IN
VDD–3.5 VVDD/2VV
IN
Note 1:Applied to the voltage drop occurring between any of the VDD, V1, V4 and V5 pins and any of the
common pins (COM
to COM17) when the current of 4 µA flows in or flows out at one common
1
pin.
Also applied to the voltage drop occurring between any of the V
any of the segment pins (SEG
to SEG
1
) when the current of 4 µA flows in or flows out at one
100
, V2, V3A (V3B) and V5 pins and
DD
common pin.
The current of 4 µA flows out when the output level is V
.
V
5
Note 2:Applied to the current flowing into the V
fed to the internal R
= 5 V
V
DD
GND = V
V
, V2, V3A (V3B) and V4: Open
1
= 0 V,
5
oscillation or OSC1 under the following conditions:
f
E, SSR, CSR, and BEB: “L” (fixed)
Other input pins: “L” or “H” (fixed)
Other output pins: No load
or flows in when the output level is
DD
pin when the external clock (f
DD
= fin = 270 kHz) is
OSC2
9/60
1
A
A
Semiconductor
Note 3:Note 4:
OSC
OSC
OSC
OSC
1
= 180 kΩ±2%
R
R
2
f
OSC
OSC
PEDL9041-03
ML9041-xxA/xxB
1
R
2
The wire between OSC1 and Rf and the wire between
and Rf should be as short as possible.
OSC
2
Keep OSC
open.
R
Note 5:
t
V
DD
2
f
IN
waveform
pplied to the pulses entering from the OSC1 pin
= tHW/(tHW + tLW) ×100 (%)
f
duty
Note 6:
0.7V
DD
0.3V
DD
The wire between OSC2 and OSCR should be as short
as possible. Keep OSC
HW
V
DD
2
0.7V
DD
0.3V
t
LW
V
DD
open.
1
DD
2
t
rf
t
ff
pplied to the pulses entering from the OSC1 pin
Note 7:For 1/4 bias, V2 and V3B pins are short-circuited. V3A pin is open.
For 1/5 bias, V
and V3B pins are short-circuited. V2 pin is open.
3A
10/60
PEDL9041-03
W
1
Semiconductor
ML9041-xxA/xxB
Switching Characteristics (The following ratings are subject to change after ES evaluation.)
•
Parallel Interface Mode
The timing for the input from the CPU (see 1) and the timing for the output to the CPU (see 2) are as shown below:
1) WRITE MODE (Timing for input from the CPU)
(VDD = 2.5 to 5.5 V, Ta = –40 to +85°C)
ParameterSymbolMin.Typ.Max.Unit
R/W, RS0, RS1 Setup Timet
E Pulse Widtht
R/W, RS0, RS1 Hold Timet
E Rise Timet
E Fall Timet
E Pulse Widtht
E Cycle Timet
DB0 to DB7 Input Data Hold Timet
DB0 to DB7 Input Data Setup Timet
B
W
A
r
f
L
C
I
H
40——ns
450——ns
10——ns
——25ns
——25ns
430——ns
1000——ns
195——ns
10——ns
RS1, RS
DB
to DB
0
R/
V
0
E
7
V
IH
V
IL
V
IL
t
t
B
t
L
IL
V
IL
r
V
IH
t
C
t
W
t
I
V
V
Input
IH
Data
IL
V
IH
V
IL
V
IL
t
f
V
IH
t
A
V
IL
t
H
V
IH
V
IL
11/60
1
W
Semiconductor
2) READ MODE (Timing for output to the CPU)
ParameterSymbolMin.Typ.Max.Unit
R/W, RS1, RS0 Setup Timet
E Pulse Widtht
R/W, RS1, RS0 Hold Timet
E Rise Timet
E Fall Timet
E Pulse Widtht
E Cycle Timet
DB0 to DB7 Output Data Delay Timet
DB0 to DB7 Output Data Hold Timet
PEDL9041-03
ML9041-xxA/xxB
(VDD = 2.5 to 5.5 V, Ta = –40 to +85°C)
B
W
A
r
f
L
C
D
O
40——ns
450——ns
10——ns
——25ns
——25ns
430——ns
1000——ns
——350ns
20——ns
RS1, RS
to DB
DB
0
R/
V
0
E
7
V
IH
V
IL
V
IH
t
t
B
t
L
IL
V
IL
r
V
IH
t
D
t
C
t
W
V
OH
Output
Data
V
OL
V
IH
V
IL
V
IH
t
f
V
IH
t
A
V
IL
t
O
V
OH
V
OL
12/60
1
CS
SHT
Semiconductor
•
Serial Interface Mode
ParameterSymbolMin.Typ.Max.Unit
SHT
Cycle Timet
CS
Setup Timet
CS
Hold Timet
SHT
Setup Timet
SHT
Hold Timet
SHT
“H” Pulse Widtht
SHT
“L” Pulse Widtht
SHT
Rise Timet
SHT
Fall Timet
Sl Setup Timet
Sl Hold Timet
Data Output Delay Timet
Data Output Hold Timet
SCY
CSU
CH
SSU
SH
SWH
SWL
SR
SF
DISU
DIH
DOD
CDH
PEDL9041-03
ML9041-xxA/xxB
(VDD = 2.5 to 5.5 V, Ta = –40 to +85°C)
500——ns
100——ns
100——ns
60——ns
200——ns
200——ns
200——ns
——50ns
——50ns
100——ns
100——ns
——160ns
0——ns
SI
SO
t
CSU
t
SCY
V
IL
t
SSU
t
t
SWL
V
IH
V
IH
V
t
DOD
V
SR
V
IL
t
DISU
t
SWH
V
IH
t
DIH
V
IL
OL
V
t
SF
V
IH
IL
V
IH
t
DOD
IL
V
OH
t
SH
V
IH
t
t
CDH
CH
V
OH
13/60
1
Semiconductor
FUNCTIONAL DESCRIPTION
Instruction Register (IR), Data Register (DR), and Expansion Instruction Register (ER)
PEDL9041-03
ML9041-xxA/xxB
These registers are selected by setting the level of the Register Selection input pins RS
selected when both RS
when both RS
and RS1 are “L”. (When RS0 is “H” and RS1 is “L”, the ML9041 is not selected.)
0
and RS1 are “H”. The IR is selected when RS0 is “L” and RS1 is “H”. The ER is selected
0
and RS1. The DR is
0
The IR stores an instruction code and sets the address code of the display data RAM (DDRAM) or the character
generator RAM (CGRAM).
The microcontroller (CPU) can write to the IR but cannot read from the IR.
The ER stores a contrast adjusting code and sets the address code of the arbitrator RAM (ABRAM).
The CPU can write to or read from the ER.
The DR stores data to be written in the DDRAM, ABRAM and CGRAM and also stores data read from the
DDRAM, AM RAM and CG RA M .
The data written in the DR by the CPU is automatically written in the DDRAM, ABRAM or CGRAM.
When an address code is written in the IR or ER, the data of the specified address is automatically transferred from
the DDRAM, ABRAM or CGRAM to the DR. The data of the DDRAM, ABRAM and CGRAM can be checked
by allowing the CPU to read the data stored in the DR.
After the CPU writes data in the DR, the data of the next addres s in the DDRAM, ABRAM or CGRAM is selected
to be ready for the next writing by the CPU. Similarly, after the CPU reads the data in the DR, the data of the next
address in the DDRAM, ABRAM or CGRAM is set in the DR to be ready for the next reading by the CPU.
Writing in or reading from these 3 registers is controlled by changing the status of the R/W (Read/Write) pin.
Table 1 R/W pin status and register operation
W
R/
LLHWriting in the IR
HLHReading the Busy flag (BF) and the ad dress counter (ADC )
LHHWriting in the DR
HHHReading from the DR
LLLWriting in the ER
HLLReading the contrast code
RS
RS
0
1
Operation
Busy Flag (BF)
The status “1” of the Busy Flag (BF) indicates that the ML9041 is carrying out internal operation.
When the BF is “1”, any new instruction is ignored.
When R/W = “H”, RS
= “L” and RS1 = “H”, the data in the BF is output to the DB7.
0
New instructions should be input when the BF is “0”.
When the BF is “1”, the output code of the address counter (ADC) is undefined.
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Address Counter (ADC)
The address counter provides a read/write address for the DDRAM, ABRAM or CGRAM and also provides a
cursor display address.
When an instruction code specifying DDR AM, ABRAM or CGRAM addr ess setting is inpu t to the pre-defined
register, the register selects the specified DDRAM, ABRAM or CGRAM and transfers the address code to the
ADC. The address data in the ADC is automatically incremented (or decremented) by 1 after the display data is
written in or read from the DDRAM, ABRAM or CGRAM.
The data in the ADC is output to DB
to DB6 when R/W = “H”, RS0 = “L”, RS1 = “H” and BF = “0”.
0
Timing Generator
The timing generator generates timing sign als for th e internal operation of the ML 9041 activ ated by the instruction
sent from the CPU or for the operation of the internal circuits of the ML9041 such as DDRAM, ABRAM,
CGRAM and CGROM. Timing signals are generated so that the internal operation carried out for L CD displaying
will not be interfered by the internal operation initiated by accessing from the CPU. For example, when the CPU
writes data in the DDRAM, the display of the LCD not corresponding to the written data is not affected.
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Display Data RAM (DDRAM)
This RAM stores the display data represented in 8-bit character coding (see Table 2).
The DDRAM addresses correspond to the display positions (digits) of the LCD as shown below. The DDRAM
addresses (to be set in the ADC) are represented in hexadecimal.
DB
6DB5DB4DB3DB2DB1DB0
DC
(Example) Representation of DDRAM address = 12
MSB
HexadecimalHexadecimal
LSB
DC010010
0
1
2
1) Relationship between DDRAM addresses and display positions (1-line display mode)
Digit
2 3 4 519 20
1
00 01 02 03 0412 13
Left
end
Right
end
Display position
DD RAM address (hexadecimal)
In the 1-line display mode, the ML9041 can display up to 20 characters from digit 1 to digit 20. While the
DDRAM has addresses “00” to “4F” for up to 80 character codes, the area not used for display can be used as a
RAM area for general data. When the display is shifted by instruction, the relationship between the LCD
display and the DDRAM address changes as shown below:
Digit
1
2341920
(Display shifted to the right)
(Display shifted to the left)
4F 00 01 0211 12
Digit
2340551920
1
01
02 03 0413 14
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2) Relationship between DDRAM addresses and display positions (2-line display mode)
In the 2-line mode, the ML9041 can display up to 40 characters (20 characters per line) from digit 1 to digit 20.
Digit
1
Line 1
Line 2
2345
00 01 02 03 04
40 41 42 43 4452 53
19 20
12 13
Display position
DD RAM
address (hexadecimal)
Note: T he DDRAM addr ess at digi t 20 in the first line is n ot consecutive to the DD RAM addres s at
digit 1 in the second line.
When the display is shifted by instruction, the relationship between the LCD display and the DDRAM address
changes as shown below:
Digit
(Display shifted to the right)
234
1
Line 1
27 00 01 02
Line 2
67 40 41 4251 52
5
03
43
19 20
11 12
(Display shifted to the left)
Line 1
Line 2
Digit
1
234
01 02 03 04
41 42 43 44
5
05
4553 54
19 20
13 14
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Character Generator ROM (CGROM)
The CGROM generates small character patterns (5 × 7 dots, 160 patterns) or large character patterns (5 × 10 dots,
32 patterns) from the 8-bit character code signals in the DDRAM.
When the 8-bit character code corresponding to a character pattern in the CGROM is written in the DDRAM, the
character pattern is displayed in the display position specified b y the DDRAM address.
Character codes 20 to 7F and A0 to FF are contained in the character code area in the CG ROM.
Character codes 20 to 7F and A0 to DF are contained in the character code area f or the 5 × 7-dot character patterns.
Character codes E0 to FF are contained in the ROM area for 5 × 10-dot character patterns.
The general character generator ROM codes are 01A/01B.
The relationship between character codes and general purpose character patterns are indicated in Table2.
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