RC Series: carbon composition (1/4 & 1/2 watt)
RC Series: ceramic composition (above 1/2 watt)
RF Series: metal film
RW Series: wirewound
RP Series: power film
RM Series: high voltage thick film
FEATURES
• Tolerance 1%, 5%, 10%, depending on construction
• Twelve wattage ratings
• Seven package sizes
• Two mounting designs to accommodate your soldering process
• Five power resistor technologies to optimize your operating performance:
1. Carbon and Ceramic composition for surge and low inductance
2. Metal film for high ohmic value and low T.C.
• Flexible J-bend terminations
• Working Temperature Range: -55°C to +150°C
Part Number (watts)* voltage 1% tol. 5% tol. 10% tol. 0.1Ω–1Ω1Ω–10Ω 10Ω+ Withstanding 13” reels per reel
3. Wire element for inrush current combined with low ohmic values.
Resistance values as low as 0.005Ω
4. Power film for high ohmic value and high wattage
5. High Voltage thick film for high voltage applications
SERIES SPECIFICATIONS
Power Maximum Resistance range Temp. Coefficient Dielectric Tape Size Quantity
*25°C ambient. E24 values standard; contact Ohmite for custom values.
(continued)
100%200%300%
200
180
160
140
120
100
80
60
40
20
Temperature rise, ϒC
Percent Rated power
Alumina
Solder joint
FR4
Package limit hot spot temperature rise
100
Percent Rated Power
Ambient Temperature, ϒC
60
20
0
80
40
25 50100150750125
0.02
500
400
300
200
100
Ohms
0.04 0.06 0.08 0.10
Typical TCR for
less than 0.1Ω SMD
resistors (PPM/°C)
Surface Mount Power
300
Temperature °C
Time (sec.)
Preheating
120 sec.
Soldering
Cooling
200
50
500100 150250200
0
250
100
150
60 sec.
10 sec.
PERFORMANCE DATA
Temp. cycleLoad LifeImmersion
(-55°C to 125°C,(1000 hours (260°C for Momentary
Construction 1000 cycles)at 25°C)10 sec.)Overload
RCCarbon/Ceramic Comp. ±4.0%+.05Ω ±10.0%+.05Ω ±3.0%+.05Ω 6.3x rated power for 5 sec.
RFMetal Film ±0.5%+.05Ω ±0.5%+.05Ω ±0.1%+.05Ω 2x rated power for 0.1 sec.
RW Wirewound ±0.5%+.05Ω ±3.0%+.05Ω ±0.1%+.05Ω 5x rated power for 5 sec.
RPPower Film ±3.0%+.05Ω ±5.0%+.05Ω ±0.5%+.05Ω 2x rated power for 0.1 sec.
RNWirewound, Non-inductive ±0.5%+.05Ω ±3.0%+.05Ω ±0.1%+.05Ω 5x rated power for 5 sec.
ALL models: Leaching (260°C Solder immersion, 60 sec.)....................... No visible leaching
Thermal Shock (Units at -55°C, then rated power applied).. No mechanical damage
Flammability ......................................................................... UL Material rating, UL94V0
Derating
TCR
Recommended Solder Profile
Preheating: 145°C ±15°, max. 120 sec.
Soldering: min. 220°C, max. 60 sec.
Max. Temp.: 260°C ±5°, 10 sec.
(RC only: 250°C ±5°, 3 sec.)
The temperature rise graph
data was obtained by a
selection of test substrate
size and trace width for
each resistor size to limit
operating temperatures to
safe values.
The operating temperature
safe rises are either 100°C
substrate temperature rise
or 180°C package hot spot
temperature rise at 25°C
ambient.
FR4: 0.062 in. thick; 0.062
in. traces
Alumina: 0.040 in. thick;
0.010 in. traces
Molding material rated at
205°C continuous.
RC SERIES ONLYC. Cautions
A. Heat Treatment
110°C ±10°C
15 hours
RC SERIES: BAKE PROCEDURE
B. Frequency of
heat treatment
1 time only
Solderability: may be affected due to oxidization of lead wire
Resistance value: some units may not completely recover to origi-
nal value.
Soldering heat: some treated product may have substantial resis-
tance change during soldering operation. It is recommended that
parts be tested to evaluate soldering heat effects.
Surface Mount Power
J
I
C
B
K
=0.006 Ref.
D
A
E
G
H
Note 1
F
=0.005 ±.001
Note 2
L
O
M
P
N
Recommended
for glue dot
application
A
0.795*
20.2
min.
0.512 ±.008
13.0 ±.200
C
B
1.973
50
min.
0.059*
1. 5
min.
Full
Radius
Tape Start Slot
Measured
at Hub
0.098 /
2.5
min. width
0.394 /
10
min. depth
DIMENSIONS
(in./mm)
Packages A B C D G I J L M N O P
BA (in.) 0.246±.020 0.136±.005 0.133 REF 0.110±.010 0.047 ±0.020 0.054±.012 0.136±.005 0.150 0.346 0.098 0.126 0.050
Note 1: Packages BA and CA are only available with a pedestal base. Packages CB and DA are available in either pedestal or recessed base. Packages DB and EA
are only available in a recessed base.
Note 2: Test point is .020 above PCB.
Note 3: Tape and reel dimensions per EIA 481 A except “EA” size which is 12 mm component pitch versus 16mm pitch.
Package Outline Dimensions PC Board Land Pattern
Land pattern dimensions are for reference only
Reel Dimensions
Size A nom. B C max. Quantity
12mm 13” 0.488" +0.078, –0.00 0.724" 2000 pcs. BA or
16mm 13” 0.646" +0.078, –0.00 0.882" 1500 pcs. CA or
24mm 13” 0.961" +0.078, –0.00 1.196" 1000 pcs. DA or DB
32mm 13” 1.276" +0.078, –0.00 1.52" 750 pcs. EA
All reels are compatible with major pick-and-place machines
and made in accordance with EIA 481 A (except EA size,
which is 12mm component pitch versus 16mm pitch).
12.4mm +2.0, –0.0 18.4mm 2500 pcs. BB
16.4mm +2.0, –0.0 22.4mm 1000 pcs. CB
24.4mm +2.0, –0.0 30.4mm
32.4mm +2.0, –0.0 38.4mm
(continued)
Component type
R = resistor
Component Modifier
C = carbon/ceramic
composition
F = film
P = power film
W = wire
N = wirewound, non-inductive