Ohmite LVR Series Data Sheet

LVR Series

100

Percent Rated Power

Ambient Temperature, °C

60

20

0

80

40

-40 0 120 140 160-20-60 20 80 10040 60

70°-55°

125°

270°

190°

Temperature °C

Time (sec.)

200

50

500 100 150 250200

0

250

300

100

150

Preheating

ramp up

rate <3K/s

ramp up

rate <3K/s

ramp down

rate <6K/s

Low-TCR Current Sense Chips

The resistors are constructed using out­standing TCR level material, which makes
LVR resistors excellent for current sensing
application in battery charger circuit & DC-DC
converter. The composition of the resistive
material is adjusted to give the LVR series
resistors more resistive stability than the
competition in very small package sizes.

SERIES SPECIFICATIONS

Power

Operating

Temp. Range

Power

Rating

Rated

Voltage

Temperature

Coeff. of

Resistance

Terminations

Series Size

LVR02A 0201 0.1W 5mΩ - 10mΩ 150ppm/°C 1%, 5%

LVR04A 0402 0.125W

–55°C to +125°C

Standard rated power at 70°C; see chart above

The DC or AC (rms) continuous working voltage cor­responding to the rated power is determined by the
following formula:
V = √(PxR)
or max. working voltage whichever is less, where:

V = Cont. rated DC or AC (rms) working voltage (V)
P = Rated power (W)
R = Resistance value (Ω)

Size Resistance range TCR

0201 5mΩ - 10mΩ ±150 ppm/°C

0402 2.5mΩ ±350 ppm/°C

5mΩ - 20mΩ ±150 ppm/°C

Cu, Ni, matte Tin

Rating Resistance Range TCR (ppm/°C) Tolerance

CHARACTERISTICS

APPLICATIONS

• Consumergoods

• Computer

• Telecom/Datacom

• Industrial/Powersupply

• AlternativeEnergy

• Carelectronics

• Battery

2.5mΩ

5mΩ - 20mΩ

Derating

Reflow Soldering Conditions

±350 ppm/°C
±150 ppm/°C

1%, 5%

LVR Series

Low-TCR Current Sense Chips

PERFORMANCE DATA

Test Method Procedure Requirements

Short time

overload

Temperature

Exposure

Moisture

Resistance

Operational

Endurance

Solderability -

Wetting

Moisture

Resistance

Thermal

Shock

Board Flex/

Bending

Resistance

to Soldering

IEC60115-1 4.13 2.5 times of rated power for 5 seconds at room temperature ±(1%+0.0005Ω)

MIL-STD-202-Method

High

108

MIL-STD-202-Method
106

MIL-STD-202 Method
108

Life/

IEC 60115-1 4.25.1

J-STD-002 test B Electrical Test not required. Magnification 50X. SMD conditions: 1st step

MIL-STD-202 Method
106

MIL-STD-202 Method
107

IEC 60115-1 4.33 Device mounted on PCB test board as described, only 1 board bend-

MIL-STD-202 Method
210

Heat

IEC 60115-1 4.18

1,000 hours at maximum operating temperature depending on speci­fication, unpowered. No direct impingement of forced air to the parts
Tolerances: 125±5ºC

Each temperature / humidity cycle is defined at 8 hours (method 106F),
3 cycles / 24 hours for 10d with 25ºC / 65ºC 95% R.H, without steps 7a
& 7b, unpowered

1,000 hours at 70±2ºC applied RCWV. 1.5 hours on, 0.5 hour off, still air
required

: method B, aging 4 hours at 155°C dry heat; 2nd step: leadfree solder
bath at 245±3°C; Dipping time: 3± 0.5 seconds

Each temperature / humidity cycle is defined at 8 hours (Method 106G),
3 cycles / 24 hours for 10d. with 25°C / 65°C 95% R.H, without steps 7a
& 7b, un-powered Parts mounted on test board, without condensation
on parts. Measurement at 24±2 hours after test conclusion.

-55/+125°C. Number of cycles required is 300. Parts mounted on test
board. Maximum transfer time is 20 seconds. Dwell time is 15 minutes.

ing required. 2 mm bending. Bending time: 60±1 seconds. Ohmic value
checked during bending

Condition B, no pre-heat of samples. Leadfree solder, 260±5°C,
10±1seconds immersion time. Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol

No visible damage

±(1.0%+0.0005Ω)

±(0.5%+0.0005Ω)

±(1.0%+0.0005Ω)

Well tinned (>95% covered)
No visible damage

±(0.5% + 0.0005Ω)
No visible damage

±(1.0% + 0.0005Ω)

±(1.0 % + 0.0005Ω)

±(0.5% + 0.0005Ω)
No visible damage